18layer coil inductor multilayer board PCB-Shenzhen Chaosheng Electronic Technology Co., Ltd

China Chao Sheng Electronic Automotive-Grade Hard-Soft Combined HDI-FPC

Automotive electronics PCB, Medical equipment circuit board, Industrial control PCB, Aerospace & military grade PCB, Ion‑equipment high‑voltage board, High‑speed server PCB, 5G communication circuit board, Radar RF microwave PCB, Wireless terminal motherboard, Industrial SBC mainboard, High‑power industrial control PCB, Automation controller board, Drone flight‑control PCB, Robot control board, High frequency low loss PCB, Thick hard gold finger circuit board

Rigid‑Flex HDI FPC for Automotive｜China Chaosheng Electronics

China Chaosheng Electronic Intelligent Products Multilayer Circuit Board HDIPCB TechnologyPCB

Automotive electronics PCB, Medical equipment circuit board, Industrial control PCB, Aerospace & military grade PCB, Ion‑equipment high‑voltage board, High‑speed server PCB, 5G communication circuit board, Radar RF microwave PCB, Wireless terminal motherboard, Industrial SBC mainboard, High‑power industrial control PCB, Automation controller board, Drone flight‑control PCB, Robot control board, High frequency low loss PCB, Thick hard gold finger circuit board, HDI blind & buried via PCB

China Chaosheng Electronic Medical Products Multilayer Circuit Board HDIPCB TechnologyPCB

China Chaosheng Electronic and Electrical Products Multi layer Circuit Board PCB Source FactoryPCB

Automotive electronics PCB, Medical equipment circuit board, Industrial control PCB, Aerospace & military grade PCB, Ion‑equipment high‑voltage board, High‑speed server PCB, 5G communication circuit board, Radar RF microwave PCB, Wireless terminal motherboard, Industrial SBC mainboard, High‑power industrial control PCB, Automation controller board, Drone flight‑control PCB, Robot control board, High frequency low loss PCB, Thick hard gold finger circuit board, HDI blind & buried via PCB

China Chaosheng Electronic Medical Equipment Products Multilayer Circuit Board HDIPCB Technology

Automotive electronics PCB, Medical equipment circuit board, Industrial control PCB, Aerospace & military grade PCB, Ion‑equipment high‑voltage board, High‑speed server PCB, 5G communication circuit board, Radar RF microwave PCB, Wireless terminal motherboard, Industrial SBC mainboard, High‑power industrial control PCB, Automation controller board, Drone flight‑control PCB, Robot control board, High frequency low loss PCB, Thick hard gold finger circuit board, HDI blind & buried via PCB

China Chaosheng Electronic Automotive Products Multi layer Circuit Board HDIPCB Technology

Ultra thin PCB,Double layer ultra-thin PCB,Multi layer ultra-thin PCB,HDI ultra-thin PCB,Oversized thin board PCB，Flexible Rigid PCB，PCB factory，Top PCB Manufacturers，Printed Circuit Board (PCB)，If you get rid of the PCB，PCB Piezotronics，PCB Simulation，Certified PCB Design Company，Quick Turn PCB

Multi domain high-end circuit board technical specifications and process specifications

China Chaosheng Automotive Control Multi layer Circuit Board PCB Source Factory

Ultra thin PCB,Double layer ultra-thin PCB,Multi layer ultra-thin PCB,HDI ultra-thin PCB,Oversized thin board PCB，Flexible Rigid PCB，PCB factory，Top PCB Manufacturers，Printed Circuit Board (PCB)，If you get rid of the PCB，PCB Piezotronics，PCB Simulation，Certified PCB Design Company，Quick Turn PCB

China Chaosheng Electronics Mobile Phone Multi layer Flexible Circuit Board Mainboard FPC

China Chaosheng Electronics Mobile Phone Flexible Motherboard FPC

any order HDI soft hard combined FPC, blind buried hole HDIFPC, single-layer flexible FPC, double-layer flexible FPC, multi-layer flexible FPC, multi-layer flexible HDIFPC, soft hard combined flexible FPC, soft hard combined HDI flexible FPC, any order HDI soft hard combined flexible FPC

China Chaosheng Electronics Mobile Phone Motherboard Flexible FPC

China Chaosheng Electronic Printer Driver Flexible FPC

Ultra long flexible FPC,Ultra long double-layer flexible FPC,Ultra long multi-layer flexible FPC,Ultra long combination of soft and hard FPC,Multi layer ultra long flexible FPC，Ultra long flexible multi-layer FPC,Ultra large flexible FPC,Ultra large flexible multi-layer FPC,Roll to roll flexible FPC, single-layer roll to roll flexible FPC, double-layer roll to roll flexible FPC

China Chaosheng Electronics Large scale Color Printing Machine Flexible FPC

China Chaosheng Electronics' LED products feature ultra large size flexible FPC

China Chaosheng Electronics | Ultra Large&Ultra Long Sizes · Roll to Roll (R-to-R) Flexible FPC Complete Technical Description

Roll‑to‑Roll(R2R) FPC, Ultra‑long flexible circuit board, Max length 15meter FPC, Large format flex PCB, Seamless one‑piece long flex cable, Dupont PI FPC, Thick hard‑gold finger FPC, Multi‑layer long flex PCB, Automotive BMS flexible ribbon, Industrial automation long‑distance flex interconnect

China Chaosheng Electronics | Complete‑Set Technologies for Rigid‑Flex FPC and Ultra‑Long Flexible FPC

Single Layer FPC, Double Layer FPC, Multilayer Flexible PCB, Roll-to-Roll FPC, R2R Flex Circuit, Rigid-Flex PCB, Oversize Large Format Flexible FPC，Medical grade rigid-flex FPC，Automotive flexible multilayer PCB，New energy vehicle large size FPC，800G optical module flexible circuit，Rigid-Flex FPC / Rigid Flexible Combined PCB，Oversize Large Format Flexible FPC / Extra Large Size Flexible PCB，Multilayer Flexible Printed Circuit，Roll-to-Roll Flexible FPC / R2R Flexible PCB，Multilayer Flexible FPC

China Chaosheng Electronics | Complete‑Set Technologies for Rigid‑Flex FPC and Ultra‑Long Flexible FPC

Single Layer FPC, Double Layer FPC, Multilayer Flexible PCB, Roll-to-Roll FPC, R2R Flex Circuit, Rigid-Flex PCB, Oversize Large Format Flexible FPC，Medical grade rigid-flex FPC，Automotive flexible multilayer PCB，New energy vehicle large size FPC，800G optical module flexible circuit，Rigid-Flex FPC / Rigid Flexible Combined PCB，Oversize Large Format Flexible FPC / Extra Large Size Flexible PCB，Multilayer Flexible Printed Circuit，Roll-to-Roll Flexible FPC / R2R Flexible PCB，Multilayer Flexible FPC

China Chaosheng Electronic Sensor Fused Screen Ultra Large and Wide Flexible Circuit Board FPCSpecial

Ultra long flexible FPC,Ultra long double-layer flexible FPC,Ultra long multi-layer flexible FPC,Ultra long combination of soft and hard FPC,Multi layer ultra long flexible FPC，Ultra long flexible multi-layer FPC,Ultra large flexible FPC,Ultra large flexible multi-layer FPC,Roll to roll flexible FPC, single-layer roll to roll flexible FPC, double-layer roll to roll flexible FPC，Single layer FPC, double-layer FPC, multi-layer FPC, multi-layer HDIFPC, soft hard combined FPC, soft hard combined HDI

Chaosheng Group Zhejiang Kunying Flexible FPC Factory

blind buried hole HDI flexible FPC,4-layer flexible FPC

any order HDI soft hard combined FPC, blind buried hole HDIFPC, single-layer flexible FPC, double-layer flexible FPC, multi-layer flexible FPC, multi-layer flexible HDIFPC, soft hard combined flexible FPC, soft hard combined HDI flexible FPC, any order HDI soft hard combined flexible FPC, blind buried hole HDI flexible FPC

China Chaosheng Electronics | A complete set of core technologies including large film switches, fused film screens, silver wires for display screens, and ultra large flexible FPCs

Large sized flexible silver wire PETFPC Extra large carbon wire PETFPC Extra large carbon wire+silver wire PETFPC Touch screen flexible silver wire FPC Touch screen flexible carbon oil line FPC Film switch PET silver wire FPC Film switch PET silver oil circuit FPC Film switch PET carbon oil circuit FPC Large size film switch PET carbon oil circuit FPC Ultra large size thin film switch flexible FPC

Surrounding dam metal ceramic circuit board PCB

- ✅ High airtightness: Metal dam sealed cavity, protecting chips and extending their lifespan (essential for military/aerospace industries). - ✅ Super heat dissipation: Ceramic thermal conductivity is 100 times that of FR-4, suitable for high-power LED, laser, IGBT modules. - ✅ High reliability and stability: Low thermal expansion coefficient (CTE ≈ 4-7 ppm/℃), matched with silicon chips, resistant to thermal shock and high and low temperatures. ✅ ** Large scale mass production: Chaosheng has a unique 3m × 1.24m production line that can produce ≥ 500 pieces per month, replacing multi board splicing and improving system stability.

Leader in ultra long, ultra large, and roll to roll flexible FPC technology

Double layer oversized flexible FPC

18layer coil inductor multilayer board PCB

Product Name: Aerospace, Military, Nuclear, Unmanned Aerial Vehicle ProductsBoard: FR-4, TG150Layers: 18layer coil inductor multilayer board PCBMinimum line width/spacing: 8/8milFinished product size: 255x176mm/1 * 1pcsSurface technology: Sinking gold, green oilCopper thickness: Inner and outer layers of copper with a thickness of 175umPlate thickness: 3.50mmMinimum aperture: 0.35mm, laser hole/mm,Transport Package：Vacuum packaging+moisture-proof beads+separated white paper+cardboard box+wooden card boardFeatures: Difficulties such as dense inner and outer coilsUsage: Engine, electric motor, inductor, orange equipment, etc2-80 layers of rigid circuit boards, 2-50 layers of flexible circuit boards and PCBA productionChaosheng Group Company mainly produces product categoriesHigh end double-sided, multi-layer, flexible, high-frequency, HDI interconnect, metal based, high thermal conductivitymetal based, ceramic, cut in metal based, cut in buried capacitor, cut in thick copper buried magnet, concave convex step substrate, 5G high-speed board, thick copper, thick gold, high carbon resistance, double-sided multi-layerMiNiLED, MiNiHDILED, MiNiOLED, IC carrier substrate, roll to roll FPC, long FPC, large-sized printed circuit board,halogen-free material, high-frequency material, high-speed material, metal material, environmentally friendly circuit board, blind buried hole circuit board, high thermal conductivity aluminum based, thermoelectric separation copper based, PDU busbar, iron-based and metal based (core) mixed pressure plate, embedded copper buried copper. Buried resistance buried capacitance buried ceramic bead board, ultra-thin BT board, ceramic substrate, IC carrier board,high-frequency mixed voltage, high-speed board, differential impedance board, thick copper plate, thick gold platedboard, HDI An integrated OEM and ODM production factory for Anylayer, double-sided, multi-layer, HDI FPC, softhard combination HDI, roll to roll FPC, ultra long FPC, ultra large size PCB production and product design and development, software development, special material printed circuit boards, etc. Process Capability TableTechnical ltemMassProductAdvanced Technology2015 2021 2025 Max.Layer Count80 layer100 layer100 layerPCB through hole board2～80 layer2～100 layer2～100 layerMaximum size through hole 1～237〞*98.50"43.3〞*118.11"43.3〞*118.11"Minimum line width and spacing10(0.40)10(0.40)7.50（0.30mm）Minimum mechanicalhole(mm)12(0.50)10(0.40)8.50（0.35mm）Maximum size through hole 4～22layers37〞*43.30"43.3〞*43.30"43.3〞*43.30"Maximum size through hole 4～22layers31.50 ″*59"31.50 ″*70.86"31.50 ″*70.86"Maximum size through hole 4～22layers10(0.40)10(0.40)7.50（0.30mm）Minimum line width and spacing formulti-layer large-sized PCBs10(0.40)10(0.40)7.50（0.30mm）Maximum size of multi-layer through-hole : 4-22 layers with the smallesthole12(0.50)10(0.40)8.50（0.35mm）Maximum size HDI 4～36 layers31.50 ″*55"31.50 ″*55"31.50 ″*55"Minimum line width and linespacing of large size PCBThrough hole 12 /12milHDI14 /14milThrough hole 10/10milHDI12 / 12milThrough hole 8 /8milHDI12 / 12milThe largest board ruler 1 → thesmallest hole of 18 layersThrough hole0.50mmHDI :0.45mmThrough hole 0.50mmHDI : 0.45mmThrough hole0.50mmHDI : 0.45mmThe layer number of FPC1～36layer1～60layer1～60layerMaximum size offlexible FPC19.68〞*55"28〞*59"31.49〞*118.12"Maximumsize of flexible FPC with soft hardcombination19.68〞*55"28〞*59"31.49〞*118.12"FPC (roll to roll) maximum size19.68 ″*7874"19.68 ″*7874"19.68 ″*7874"Maximum size of FPC single chipshipment19.68 ″*118.11"19.68 ″*196.8"19.68 ″*196.80"The layer number of FPC2～18 layer2～36 layer2～42 layerMaximum size of layered board19.68 ″*35"19.68 ″*43"19.68 ″*43"Number of through-hole layers2～20layer2～30 layer2～40 layerHard and soft HDI layers2～14 layer2～18 layer2～22 layerMaximum size of soft and hardcombination19.68 ″*43"19.68 ″*49"19.68 ″*49"FPC/soft-hard combinationarbitrary interconnection HDI4+X+4InterconnectHDI5+X+5Interconnect HDI6+X+6InterconnectHDIHDIPCB layers4～36layer4～60layer4～80 layerAnylayer HDI PCB4+X+4InterconnectHDI5+X+5、Interconnect HDI8+X+8、InterconnectHDIHDIPCB maximum board size24"*52"43"*49"43"*49"Number of through hole layers ofhigh frequency board2～18 layer2～36 layer2～60 layerHDI layersofhighfrequency board2～16 layer2～24 layer2～60layerMaximum size ofhigh frequency board37 ″*43"43 ″*49"43 ″*49"Number of ceramic plates1-2 layer1～4 layer1～6 layerCeramic plate thickness0.60mm-1.60mm0.38mm-20.0mm0.38mm-20.0mmMaximum size of ceramic plate100*150mm150*190mm150*650mmMinimum aperture of ceramicplate0.50mm0.35mm0.35mmMinimum line width and linespacing of ceramic board16/16mil12/12mil10/10milNumber of layers of metalcopper substrate1-2 layer1～4 layer1～6 layerMaximum line width and linespacing of metal iron substrate12/12mil4/4mil4/4milNumber of layers of metalaluminum substrateHDI1-2 layer1～4 layer1～6 layerMaximum size of metal substrate37 ″*43"25.59 ″*59"25.59 ″*59"The smallest hole ofthe metal substrate0.50mm0.35mm0

64 layer thick copper coil plate technology

Product Name: Aerospace, Military, Nuclear, Unmanned Aerial Vehicle ProductsBoard: FR-4, TG150Layers: 64 layer coil inductor multilayer board PCBMinimum line width/spacing: 8/8milFinished product size: 301x301mm/1 * 1pcsSurface technology: Sinking gold, green oilCopper thickness: 105um for inner and outer layersPlate thickness: 5.5mmMinimum aperture: 3.5mm, laser hole/mm,Features: Difficulties such as dense inner and outer coilsUsage: Engine, electric motor, inductor, orange equipment, etcFirstly, from the perspective of the company's own technological strength, Chaosheng clearly has the ability to produce high multi-layer circuit boards, with its product range covering 2-80 layers of precision multi-layer circuit boards.At the same time, Chaosheng also has imported fully automated precision equipment production lines and a sound quality management system. It has passed multiple quality system certifications such as UL and ISO9001 in the United States, which has laid the foundation for its production of 64 layer and other ultra-high multi-layer circuit boards. Secondly, from the perspective of product characteristics, the product adopts a design that combines blind grooves and depth control grooves, combined with metal edging. The middle part has been treated with immersion gold, which not only improves corrosion resistance but also enhances stability.It is speculated that a 64 layer inductor coil metal wrapped circuit board may also use a similar design to meet the needs of multi-layer and different thickness circuit fabrication.At the same time, metal edging can effectively shield electromagnetic radiation, further enhancing signal integrity and circuit stability. Finally, for the part of the inductor coil, precise control of the inductance value may be achieved through special layout design of the coil and optimized via settings, in order to meet specific electrical performance requirements of the product. A multi-layer coil PCB (Printed Circuit Board) refers to a type of circuit board that consists of multiple layers of conductive material, separated by insulating layers, and is often used for applications requiring compact designs, such as RF (radio frequency) coils, inductors, transformers, and other electromagnetic components.### Key Features of Multi-Layer Coil PCBs:1. **Layer Structure**: - Multi-layer PCBs typically consist of three or more layers. The inner layers can be used for routing power and ground, while the outer layers can be utilized for signal routing and component placement.2. **Coil Design**: - The coils can be designed in various configurations, such as solenoids, toroids, or planar coils, depending on the application. The design may include various winding techniques and geometries to optimize inductance and performance.3. **Material**: - Common materials used for multi-layer PCBs include FR-4 (a type of fiberglass epoxy), Rogers materials (for high-frequency applications), and other specialized materials that can handle specific thermal or electrical requirements.4. **Impedance Control**: - For RF applications, controlling the impedance of the coil is crucial. Multi-layer designs can help maintain consistent impedance across the PCB by using specific layer stack-ups and trace widths.5. **Thermal Management**: - Multi-layer PCBs can help dissipate heat more effectively than single-layer designs. Proper thermal management is essential in coil applications, especially when dealing with high currents.6. **Manufacturing Process**: - The fabrication of multi-layer PCBs involves several steps, including layer alignment, lamination, drilling, plating, and etching. Advanced techniques such as laser drilling and via filling may be employed to create vias and interconnections.7. **Applications**: - Multi-layer coil PCBs are used in various applications, including: - RF and microwave devices - Wireless charging systems - Inductive sensors - Power amplifiers - Communication devices### Design Considerations:1. **Simulation**: - Using simulation software (like HFSS, CST, or other electromagnetic simulation tools) to model the coil's behavior can help in optimizing its design before fabrication.2. **Manufacturing Tolerances**: - Ensure that the PCB manufacturer can meet the necessary tolerances for the coil's dimensions and layer alignment to achieve the desired performance.3. **Testing and Prototyping**: - Prototyping the design and conducting tests (like S-parameter testing) is essential to validate performance and make any necessary adjustments.4. **Cost**: - Multi-layer PCBs can be more expensive than single-layer boards due to the complexity of manufacturing and the materials used. Balancing performance requirements with cost considerations is crucial.5. **Stack-Up Design**: - Carefully planning the stack-up of the PCB layers is important to achieve the desired electrical performance and to minimize issues like crosstalk and electromagnetic interfe

The following is a detailed introduction about "PET carbon wire pseudo double-layer flexible FPC"

Transparent PCB, transparent flexible FPC Transparent PET circuit board, transparent button carbon oil FPC, transparent button carbon silver PCB, transparent PET perforated carbon silver PCB, transparent FR-4PCB, double-layer transparent circuit board PCB, multi-layer transparent FR-4 circuit board, ultra large size transparent PCB, ultra large size transparent circuit board PCB

Transparent PCB, transparent flexible FPC

Transparent PET circuit board, transparent button carbon oil FPC, transparent button carbon silver PCB, transparent PET perforated carbon silver PCB, transparent FR-4PCB, double-layer transparent circuit board PCB, multi-layer transparent FR-4 circuit board, ultra large size transparent PCB, ultra large size transparent circuit board PCB

Detailed Introduction to Transparent FR-4 Multilayer PCB

Transparent PCB, transparent flexible FPC Transparent FR-4PCB, double-layer transparent circuit board PCB, multi-layer transparent FR-4 circuit board, ultra large size transparent PCB, ultra large size transparent circuit board PCB

Process Capability Table
Technical ltem		MassProduct	Advanced Technology
Technical ltem		2015	2021	2025
Max.Layer Count		80 layer	100 layer	100 layer
PCB through hole board		2～80 layer	2～100 layer	2～100 layer
Maximum size through hole 1～2		37〞*98.50"	43.3〞*118.11"	43.3〞*118.11"
Minimum line width and spacing		10(0.40)	10(0.40)	7.50（0.30mm）
Minimum mechanical hole(mm)		12(0.50)	10(0.40)	8.50（0.35mm）
Maximum size through hole 4～22 layers		37〞*43.30"	43.3〞*43.30"	43.3〞*43.30"
Maximum size through hole 4～22 layers		31.50 ″*59"	31.50 ″*70.86"	31.50 ″*70.86"
Maximum size through hole 4～22 layers		10(0.40)	10(0.40)	7.50（0.30mm）
Minimum line width and spacing for multi-layer large-sized PCBs		10(0.40)	10(0.40)	7.50（0.30mm）
Maximum size of multi-layer through- hole : 4-22 layers with the smallest hole		12(0.50)	10(0.40)	8.50（0.35mm）
Maximum size HDI 4～36 layers		31.50 ″*55"	31.50 ″*55"	31.50 ″*55"
Minimum line width and line spacing of large size PCB		Through hole 12 / 12milHDI14 /14mil	Through hole 10/10 milHDI12 / 12mil	Through hole 8 / 8milHDI12 / 12mil
The largest board ruler 1 → the smallest hole of 18 layers		Through hole 0.50mmHDI :0.45mm	Through hole 0.50mm HDI : 0.45mm	Through hole 0.50mmHDI : 0.45mm
The layer number of FPC		1～36layer	1～60layer	1～60layer
Maximum size of flexible FPC		19.68〞*55"	28〞*59"	31.49〞*118.12"
Maximum size of flexible FPC with soft hard combination		19.68〞*55"	28〞*59"	31.49〞*118.12"
FPC (roll to roll) maximum size		19.68 ″*7874"	19.68 ″*7874"	19.68 ″*7874"
Maximum size of FPC single chip shipment		19.68 ″*118.11"	19.68 ″*196.8"	19.68 ″*196.80"
The layer number of FPC		2～18 layer	2～36 layer	2～42 layer
Maximum size of layered board		19.68 ″*35"	19.68 ″*43"	19.68 ″*43"
Number of through-hole layers		2～20layer	2～30 layer	2～40 layer
Hard and soft HDI layers		2～14 layer	2～18 layer	2～22 layer
Maximum size of soft and hard combination		19.68 ″*43"	19.68 ″*49"	19.68 ″*49"
FPC/soft-hard combination arbitrary interconnection HDI		4+X+4Interconnect HDI	5+X+5Interconnect HDI	6+X+6Interconnect HDI
HDIPCB layers		4～36layer	4～60layer	4～80 layer
Anylayer HDI PCB		4+X+4Interconnect HDI	5+X+5、Interconnect HDI	8+X+8、Interconnect HDI
HDIPCB maximum board size		24"*52"	43"*49"	43"*49"
Number of through hole layers of high frequency board		2～18 layer	2～36 layer	2～60 layer
HDI layers ofhighfrequency board		2～16 layer	2～24 layer	2～60layer
Maximum size of high frequency board		37 ″*43"	43 ″*49"	43 ″*49"
Number of ceramic plates		1-2 layer	1～4 layer	1～6 layer
Ceramic plate thickness		0.60mm-1.60mm	0.38mm-20.0mm	0.38mm-20.0mm
Maximum size of ceramic plate		100*150mm	150*190mm	150*650mm
Minimum aperture of ceramic plate		0.50mm	0.35mm	0.35mm
Minimum line width and line spacing of ceramic board		16/16mil	12/12mil	10/10mil
Number of layers of metal copper substrate		1-2 layer	1～4 layer	1～6 layer
Maximum line width and line spacing of metal iron substrate		12/12mil	4/4mil	4/4mil
Number of layers of metal aluminum substrateHDI		1-2 layer	1～4 layer	1～6 layer
Maximum size of metal substrate		37 ″*43"	25.59 ″*59"	25.59 ″*59"
The smallest hole of the metal substrate		0.50mm	0.35mm	0.35mm
Minimum line width and line spacing of metal substrate		8/8mil	4/4mil	4/4mil
Transparent FR- 4 material layers		1-2layer	1-2layer	1-8layer
Transparent FR-4 minimum hole		0.35mm	0.35mm	0.35mm
Transparent FR-4 minimum line width and spacing		4/4Mil	4/4Mil	3.5/3.5Mil
Transparent FR- 4 maximum size		23.63*47.25″	23.63*47.25 ″	23.63*47.25 ″
Number of tempered glass base layers		1-2layer	1-2layer	1-2layer
Minimum line width and spacing of glass		4/4Mil	4/4Mil	3.5/3.5Mil
The smallest hole in glass		0.35mm	0.35mm	0.35mm
Maximum size of glass		23.63*47.25″	23.63*47.25 ″	23.63*47.25 ″
Number of layers of transparent PETmaterial		1-2layer	1-2layer	1-2layer
Maximum size of transparent PET		19.68 ″*7874"	19.68 ″*7874"	19.68 ″*7874"
The company's main product types		Halogen free materials, high TG materials, high-frequency materials, high-speed materials, metal materials, glass materials, embedded materials, transparent FR- 4 materials, high thermal conductivity metals, high thermal conductivity aluminum substrates, environmentally friendly circuit boards, BT materials, ABF materials, and other imported materials, DU busbars, iron-based and metal based (core) mixed pressure plates, embedded buried copper, buried resistors, buried capacitors, buried ceramic bead plates, buried ceramics, ceramic mixed pressure plates, multi-layer ceramics, ultra-thin BT plates, ultra-thin PCBs, ultra-thin PCBs, multi-layer aluminum substrates, multi-layer ceramic plates, multi-layer ultra-thin HDI、 High frequency mixed voltage, differential impedance board, thick copper plate, gold-plated plate, high and low copper, high and low copper, high carbon resistance, transparent multilayer, glass plate, HDI arbitrary order (cross blind buried) Anylayer, flexible double-sided, flexible multilayer, soft hard combination HDI, roll to roll FPC, ultra long size, ultra large size board (single, double, multi-layer) PCB production and product design, product development, software development, etc
Main material		Rogers, Taikoni, Yaron, Mitsui, Isola, 3M, Taiyao, Taiguang, Tenghui, Shengyi,Lianmao, Nanya, Doosan, DuPont, Taihong, Hongren, Xinyang, Nippon Steel, Teflon,Yasen, Panasonic, RCC, Mitsui, Mitsubishi, Yingye, 3M, Kyocera, Jiuhao, Zhongci,Huaqing, Aishengda, Sliton, Kaichangde, Tongxin, Beige, Yalong, Taikoni,Hitachi, Laird System, etc
Main material categories		Halogen-free、halogenated、 high thermal conductivity, high TG135 、TG140、 TG150、 TG170、TG180、TG240、TG320
Build-up Material		FR-4 ，TG150,TG70,TG180
Conventional plate thickness (mm)	Min.1-2L(mm)	0.10mm	0.10-12.0mm	0.10-18.0mm
	Min.4-10L(mm)	0.35mm	0.35mm～10.0mm	0.35-18.0mm
	Min.12L(mm)	0.43	0.38～10.0mm	0.38～18.0mm
	Min.16L(mm)	0.53	0.45～10.0mm	0.45～18.0mm
	Min.18L(mm)	0.63	0.51～10.0mm	0.51～18.0mm
	Min.52L(mm)	0.8	0.65～10.0mm	0.65～18.0mm
	MAX(mm)	3.5	12.0mm	18.0mm
Copper plate thickness and copper thickness	1-2 layerCU	700um	875um	875um
	Layers 4-20	4-12layer	4-16layer	4-22layer
	Inner layer copper thickness（um)	875um	1050um	1225um
	Outercopperthickness	210um	350um	525um
	Thick copper finished plate thickness	8.0mm	12.0mm	18.0mm
IC substrate	layerHDI	1-10layer	1-14layer	1-16layer
	Line width and spacing	50um	25um	15um
	copper thickness	8-10um	10-12um	12-15um
Min.CoreThickness um(mil)		254" (10.0)	0.15～254(10.0mm)	0.15～254(10.0mm)
Min.Build up Dielectric		38(1.5)	25(1.0)	25(1.0)
BaseCopperWeigh t	Inner Layer	1/4-8 OZ	1/4-0.30mm	1/4-0.30mm
BaseCopperWeigh t	Out Layer	1/4-10 OZ	1/4-30 OZ	1/4-30 OZ
Gold thick		1～40u"	1～200u"	1～200u"
Nithick		76～127u"	1～250u"	1～250u"
Min.HOle/Land um(mil)		150/300(6/12)	100/200(4/8)	100/200(4/8)
Min.Laser via/landum(mil)		60/170(2.4/6.8)	50/150(2/6)	50/150(2/6)
Min. IVH、Hole size/landum(mil)		150/300(6/12)	100/200(4/8)	100/200(4/8)
DieletricThickness		38(1.5)	32(1.3)	32(1.3)
DieletricThickness		125(5)	125(5)	125(5)
SKipvia		Yes	Yes	Yes
viaoNhie(laserviaon BuriedPTH)		Yes	Yes	Yes
Laser Hole Filling		Yes	Yes	Yes
Technicalltem		MassProduct	Advanced Technology
Hole depth/diameter	Through Hoie	25:01 :00	35:01 :00	40:01 :00
AspctRatio	MicroVia	0.8 :1	0.8 :1	0.8 :1
copperFilling Dimple Size		10(0.40)	5(0.20)	5(0.20)
Minimumouter line width/ spacing	Inner layer line width and spacing	38/38(1.5/1.5)	38/38(1.5/1.5)	38/38(1.5/1.5)
Minimumouter line width/ spacing	PlatedLayerum(mil)	38/38(1.5/1.5)	38/38(1.5/1.5)	38/38(1.5/1.5)
BGAPitchmm(mil)		0.4	0.4	0.4
PHMin.Hole rlng um(mil)		75(3)	62.50(2.50	62.50(2.50
Line Width control	<2.5mil(mil)	±0.50	±0.50	±0.50
	2.5mil≤L/W<4mil	±0.50	±0.50	±0.50
	≤3mil(mil)	±0.60	±0.60	±0.60
SolderMask Registration um(mil)		±25	±25	±25
Solder masThickness	Lines Minum(mil)	10(0.40)	10(0.40)	10(0.40)
	Lines Minum(mil)	30(1.20)	30(1.20)	30(1.20)
	CopperMinum(mil)	10(0.40)	10(0.40)	10(0.40)
	CopperMax um(mil)	30(1.20)	30(1.20)	30(1.20)
Mln.Solder Mask opening um(mil)		250(10)	200(8)	200(8)
Structure	Stacking layer by layer	5+N+5	6+N+6	7+N+7
	Sequenetlal Bu il-up	42Any Layer	46Any Layer	60Any Layer
	Stacking layer by layer	N+N	N+N	N+N
	Stacking layer by layer	N+X+N	N+X+N	N+X+N
	Sequenetlal Lamination	4+(N+X+N)+4	5+(N+X+N)+5	6+(N+X+N)+6
Multi-layer stepped structure	Multi- layer stacking	5+N+5	6+N+6	7+N+7
	Sequenetlal Bu il-up	12Any Layer	16Any Layer	18Any Layer
	Multi- layer staircase	4 steps	6 steps	6 steps
Mechanical depth control drilling depth		2.0mm±0.08mm	2.0mm±0.08m	2.0mm±0.08m
Laser controlled depth drilling		0.6mm±0.08mm	0.8mm±0.08mm	1.0mm±0.08mm
/Min.HOle/Land um(mil)	linner um(mil)	150/300(6/12)	100/200(4/8)	100/200(4/8)
/Min.HOle/Land um(mil)	Outer um(mil)	150/300(6/12)	100/200(4/8)	100/200(4/8)
Minimumburiedholediameter/solder pad		60/170(2.4/6.8)	50/150(2/6)	50/150(2/6)
SUBDielectricThic kness	Mln.um(mil)	38(1.5)	32(1.3)	25(1.0)
SUBDielectricThic kness	Max.um(mil)	125(5)	125(5)	125(5)
SKipvia		Yes	Yes	Yes
Via on hole(LaserViaon BuriePTH		Yes	Yes	Yes
Laser Hole Filling		Yes	Yes	Yes
Resin plug hole plate thickness	Min mm(mil)	0.35	0.35	0.35
Resin plug hole plate thickness	Max mm(mil)	3.2	3.2	3.2
Min mm(mil)		125(5)	110(4.50)	110(4.50)
Routing Depth control Accuracy um(mil)		±50um(mil)	±50um(mil)	±50um(mil)
Outine NC Rcuting Tolerance um(mil)		75(3)	75(3)	75(3)
Type of surface Finishing		OSP、 Sinking gold, lead-free tin, lead tin, electroplated gold fingers, electroplated gold (electroplated nickel hard gold, electroplated nickel soft gold), gold fingers+sinking gold, spray tin+gold fingers, OSP+electroplated gold, OSP+sinking gold, electroplated silver, electroplated silver, electroplated tin, gold coated silver, nickel free electroplated thick gold, nickel free electroplated thick silver, tin silver copper, OSP+gold fingers
EN Thickness Control(um)		>0.025-0.1um	>0.025-0.1um	>0.025-0.1um
OSOSP Thickness(um)		>0.20-0.50um	>0.20-0.50um	>0.20-0.50um
Ni Thickness(um)		>105⇢ 250um	>105⇢ 250um	>105⇢ 250um
Platinum thickness control		>0.025-5um	>0.025-5um	>0.025-5um
Lead/lead- free tin spraying thickness		>105⇢ 150um	>105⇢ 150um	>105⇢ 150um
Electrosilver		>105⇢ 140um	>105⇢ 140um	>105⇢ 140um
Thickness control of sinking silver		>105⇢ 140um	>105⇢ 140um	>105⇢ 140um
Tin thickness control		>105⇢ 140um	>105⇢ 140um	>105⇢ 140um
Min TestPAD	E/Tum(mil)	75(3)	75(3)	75(3)
	E/Tum(mil)	50(2)	50(2)	50(2)
	E/Tum(mil	25(1)	25(1)	25(1)
	E/Tum(mil)	150（6）	150（6）	150（6）
lmpedanceContro lTolerance	≧50ohm	± 10%	±8%	±8%
lmpedanceContro lTolerance	≦50ohm	±50ohm	±50ohm	±50ohm
Finished board	Plate thickness≧0.15mm	≧ ± 10%	≧ ± 10%	≧ ± 10%
Finished board	Plate thickness≧0.15mm	≧ ±0.075%	≧ ±0.075%	≧ ±0.075%
Warpage		≤0.7%	≤0.5%	≤0.5%
The above are the conventional production skills of Chaosheng Group Company, and there are any unclear points. Please further communicate with our specialized technical personnel, and we will be happy to serve you! Welcome to our guide!

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