Warmly celebrate that China Chaosheng Electronics won the title of high-quality supplier of printed circuit boards of International Nuclear Research Institute and Chinese Academy of Sciences
Recently, China Chaosheng Electronics received a big piece of good news - with its outstanding technical strength, stable product quality and efficient service system in the field of printed circuit boards (PCBs), it successfully won the certification of "high-quality supplier of printed circuit boards" from the International Nuclear Research Institute and the Chinese Academy of Sciences, and officially became the core supply chain system of two top scientific research institutions. This is not only a high recognition of Chaosheng Electronics' comprehensive strength, but also an important milestone for Chinese local electronic manufacturing enterprises to break through in high-end scientific research supporting fields. As a key foundational component supporting the development of the electronic information industry, the performance of printed circuit boards is directly related to the stability and accuracy of scientific research equipment and precision instruments. The International Institute for Nuclear Research has strict requirements for the reliability, anti-interference, and extreme environmental resistance of electronic components in cutting-edge fields such as nuclear physics research and particle detection; As a top scientific research institution in China, the Chinese Academy of Sciences has also set high standards for the precision and compatibility of printed circuit boards in its scientific research projects in aerospace, quantum information, biomedicine and other fields. This time, Chaosheng Electronics was able to pass the strict screening of two major institutions at the same time, which is due to the company's continuous deep cultivation in technology research and development and quality control over the years. On the one hand, the company has established a professional R&D team, focusing on core technology areas such as high-frequency and high-speed, high-density interconnection, and special materials PCB. It has overcome multiple industry technology bottlenecks and developed products that can meet customized needs in different scientific research scenarios; On the other hand, the company has established a comprehensive quality control system throughout the entire process, from raw material procurement, production and processing to finished product testing. Every step of the process follows inspection standards that exceed industry standards, ensuring that product yield and stability remain at the forefront of the industry. This cooperation not only opens the door to the high-end scientific research supporting market for Chaosheng Electronics, but also promotes the enterprise to further approach cutting-edge scientific research needs. Through technological collaboration with the two institutions, it accelerates technological iteration and product upgrades, providing better electronic component support for the development of China's scientific research industry. In the future, Chaosheng Electronics will take this as a new starting point, continue to adhere to the concept of "technological innovation and quality first", continuously enhance its core competitiveness, and deeply cultivate and refine in the field of high-end printed circuit boards, contributing more strength to the high-quality development of China's electronic manufacturing industry.

Introduction to the Manufacturing Technology of High Layer HDI IC Carrier Board by China Chaosheng Electronics
China Chaosheng Electronics has significant advantages in the production technology of multi-layer HDI IC carrier boards. It adopts advanced processes to achieve high production accuracy. The specific introduction is as follows: • Arbitrary blind buried hole technology: Chaosheng Electronics has arbitrary blind buried hole technology, which can achieve ultra-high density wiring. This technology enables circuit boards to achieve electrical connections between more layers in a limited space, effectively reducing the size of the circuit board and improving signal transmission efficiency. It is suitable for miniaturized devices such as smartphone camera modules and medical endoscopes. • Fine line fabrication capability: Chaosheng Electronics has LDI laser etching machine equipment, which can achieve a minimum line width and line spacing of 15 μ m in the production of high multi-layer HDI IC substrates. It can produce 16 layers of arbitrary order HDI and meet the requirements of high-end IC substrates for fine lines and multi-layer structures, helping to improve the integration and performance of the substrate. Multi layer hybrid technology: supports multi-layer hybrid structures, which can laminate materials with different characteristics together, compatible with high-frequency signal transmission, and can better meet the needs of IC carrier boards in complex application scenarios such as high speed and high frequency, ensuring the stability and reliability of signal transmission. Material selection and application: In the production of multi-layer HDI IC substrates, high-performance substrate materials such as FR-4 or polyimide are usually selected to meet the requirements of high-density interconnection. Copper foil is commonly used as a conductive material, and its good conductivity and processing performance are utilized to make circuit lines. At the same time, BT resin or ABF film will be used as insulation layer materials to ensure insulation performance and thermal stability between each layer. Micro hole filling technology: During the production process, micro hole filling technology is used to fill laser drilled holes with specific micro hole filling materials, ensuring the conductivity of the hole walls and the insulation between the layers of the board, improving the quality of signal transmission, and enhancing the overall performance and reliability of the carrier board. Strict quality control: From material selection to production process control, there are strict checks on the accuracy and reliability of each layer of circuit and each via, ensuring that the product meets high-quality standards and meets customer needs through a series of testing processes.

Our professionalism and the quality of our work lead us to build harmonious and lasting relationships with our clients, most of whom are Europeans, Japanese and Americans. In other words, there is no doubt about our knowledge and skills in exporting and processing international orders, not to mention our proficiency in communication. We offer a variety of PCBS, including 2-80 multilayer, HDI arbitrary interconnect and flexible HDIFPC, FPC multilayer, OEM (design, development, production, SMT, plug-in, post welding) integrated production, which is emphasized aspect ratio 30:1. For layers of heavy copper up to 25 ounces, a 6 ounce copper inner layer is used.

We continue to pay attention to environmental protection and cleaner production, adhere to the sustainable development strategy, and abide by the relevant international and domestic environmental protection conventions and requirements. The company has a sound environmental protection facilities system, with mature pollutant control technology and effective energy-saving measures, has reached the local government's cleaner production standards, and exceeded the national cleaner production standard requirements.

Sincere service! Quality refinement! Survive by quality!

 Integrity, mutual assistance, humanistic sharing, integrity responsibility, quality and 

efficiency, customer-centric, market-oriented.