PCB process production ability

FPC process production capability

SMT (PCBA) Production Capability

Market distribution

Product field

Production cycle

PCB process production ability

Technical ltem MassProduct Advanced Technology
2015 2018 2023
Max.Layer Count 80 layer 100 layer 100 layer
PCB through hole board 2～80 layer 2～100 layer 2～100 layer
Maximum size through hole 1～2 layers 43*62" 43〞*83" 43〞*90.55"
Maximum size through hole 4～60 layers 43〞*49" 43〞*61" 43〞*61"
Maximum size HDI 4～60 layers 35″*40" 43〞*49" 43〞*49"
Minimum line width and line spacing of large size PCB Through hole 12 / 12mil
HDI14 / 14mil		 Through hole 10/10 mil
HDI12 / 12mil		 Through hole 8 / 8mil
HDI12 / 12mil
The largest board ruler 1 → the smallest hole of 18 layers Through hole 0.50mm
HDI: 0.45mm		 Through hole 0.50mm
HDI: 0.45mm		 Through hole 0.50mm
HDI: 0.45mm
The layer number of FPC 1～36layer 1～60layer 1～60layer
FPC (roll to roll) maximum size 19.68″*7874" 19.68″*7874" 19.68″*7874"
Maximum size of FPC single chip shipment 19.68″*118.11" 19.68″*196.8" 19.68″*196.80"
The layer number of FPC 2～18 layer 2～36 layer 2～42 layer
Maximum size of layered board 19.68″*35" 19.68″*43" 19.68″*43"
Number of through-hole layers 2～20layer 2～30 layer 2～40 layer
Hard and soft HDI layers 2～14 layer 2～18 layer 2～22 layer
Maximum size of soft and hard combination 19.68″*43" 19.68″*49" 19.68″*49"
FPC/soft-hard combination arbitrary interconnection HDI 4+X+4 Inter connect HDI 5+X+5 Inter connect HDI 6+X+6 Inter connect HDI
HDI PCB layers 4～36 layer 4～60 layer 4～80 layer

Anylayer HDI PCB		 4+X+4 Inter connect HDI 5+X+5 Inter connect HDI 8+X+8 Inter connect HDI
HDIPCB maximum board size 24"*52" 43"*49" 43"*49"
Number of through hole layers of high frequency board 2～18 layer 2～36 layer 2～60 layer
HDI layers of high frequency board 2～16 layer 2～24 layer 2～60layer
Maximum size of high frequency board 37″*43" 43″*49" 43″*49"
Number of ceramic plates 1-2 layer 1～4 layer 1～6 layer
Ceramic plate thickness 0.60mm-1.60mm 0.38mm-20.0mm 0.38mm-20.0mm
Maximum size of ceramic plate 100*150mm 150*190mm 150*650mm
Minimum aperture of ceramic plate 0.50mm 0.35mm 0.35mm
Minimum line width and line spacing of ceramic board 16/16mil 12/12mil 10/10mil
Number of layers of metal copper substrate 1-2 layer 1～4 layer 1～6 layer
Maximum line width and line spacing of metal iron substrate 12/12mil 4/4mil 4/4mil
Number of layers of metal aluminum substrateHDI 1-2 layer 1～4 layer 1～6 layer
Maximum size of metal substrate 37″*43" 25.59″*59" 25.59″*59"
The smallest hole of the metal substrate 0.50mm 0.35mm 0.35mm
Minimum line width and line spacing of metal substrate 8/8mil 4/4mil 4/4mil

The company's main product types		 Halogen free materials, high-frequency materials, high-speed materials, metal materials, environmentally friendly circuit boards, blind buried hole circuit boards, antimony HDI, high thermal conductivity aluminum substrates, thermoelectric separation copper substrates, PDU busbars, iron-based and metal based (core) mixed pressure plates, embedded copper buried copper, buried resistance buried ceramic bead plates, ceramics, ceramic mixed pressure, ultra-thin BT boards, ceramic substrates, high-frequency mixed pressure, differential impedance boards, thick copper plates, thick gold plated boards, HDI, arbitrary order (cross blind buried) Anylayer, double-sided, multi-layer and HDI FPC, soft hard combination HDI, roll to roll FPC, ultra long and ultra large size boards (single, double, multi-layer) PCB production and product design and development. Software development, etc
Main material Rogers, Taikoni, Yalong, Mitsui, Isola, 3M, Taiyao, Taiguang, Tenghui, Shengyi, Lianmao, Nanya, Doosan, DuPont, Taihong, Hongren, Xinyang, Nippon Steel, Teflon, Yasen, Panasonic, RCC, Mitsui, 3M, Kyocera, Jiuhao, Zhongci, Huaqing, Aisenda, Sliton, Kaichangde, Tongxin, Beige, Yalong, Taikoni, Hitachi, Panshi, etc
Main material categories Halogen-free、halogenated、 high thermal conductivity, high TG135 、TG140、 TG150、 TG170、TG180、TG240、TG320
Build-up Material  FR-4 ，TG150,TG70,TG180
Conventional plate thickness(mm) Min.12L(mm) 0.43 0.38～10.0mm 0.38～18.0mm
Min.16L(mm) 0.53 0.45～10.0mm 0.45～18.0mm
Min.18L(mm) 0.63 0.51～10.0mm 0.51～18.0mm
Min.52L(mm) 0.8 0.65～10.0mm 0.65～18.0mm
MAX(mm) 3.5 12.0mm 18.0mm
Copper plate thickness and copper thickness 1-2 layer CU 700um 875um 875um
Layers 4-20 4-12 layer 4-16 layer 4-22 layer
Inner layer copper thickness(um) 875um 1050um 1225um
Outercopperthickness 210um 350um 525um
Thick copper finished plate thickness 8.0mm 12.0mm 18.0mm
IC substrate layerHDI 1-10layer 1-14layer 1-16layer
Line width and spacing 40um 25um 15um
copper thickness 8-10um 10-12um 12-15um
Min.CoreThickness um(mil) 254"(10.0) 0.15～254(10.0mm) 0.15～254(10.0mm)
Min.Build up Dielectric 38(1.5) 25(1.0) 25(1.0)
BaseCopperWeight Inner Layer 1/4-8 OZ 1/4-0.30mm 1/4-0.30mm
Out Layer 1/4-10 OZ 1/4-30 OZ 1/4-30 OZ
Gold thick 1～40u" 1～200u" 1～200u"
Nithick 76～127u" 1～250u" 1～250u"
Min.HOle/Land um(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
Min.Laser via/landum(mil) 60/170(2.4/6.8) 50/150(2/6) 50/150(2/6)
Min. IVH、Hole size/landum(mil) 150/300(6/12) 100/200(4/8) 100/200(4/8)
DieletricThickness 38(1.5) 32(1.3) 32(1.3)
125(5) 125(5) 125(5)
SKipvia Yes Yes Yes
viaoNhie(laserviaon BuriedPTH) Yes Yes Yes
Laser Hole Filling Yes Yes Yes
Technicalltem MassProduct Advanced Technology
2015 2018 2022
Hole depth/diameter Through Hoie 25:01:00 35:01:00 40:01:00
AspctRatio MicroVia 0.8:1 0.8:1 0.8:1
copperFilling Dimple Size 10(0.40) 5(0.20) 5(0.20)
Minimumouter line width/ spacing Inner layer line width and spacing 38/38(1.5/1.5) 38/38(1.5/1.5) 38/38(1.5/1.5)
PlatedLayerum(mil) 38/38(1.5/1.5) 38/38(1.5/1.5) 38/38(1.5/1.5)
BGAPitchmm(mil) 0.4 0.4 0.4
Min.Hole rlng um(mil) 75(3) 62.50(2.50 62.50(2.50
Line Width control <2.5mil(mil) ±0.50 ±0.50 ±0.50
2.5mil≤L/W<4mil ±0.50 ±0.50 ±0.50
≤3mil(mil) ±0.60 ±0.60 ±0.60
SolderMask Registration um(mil) ±25 ±25 ±25
Solder masThickness Lines Min um(mil) 10(0.40) 10(0.40) 10(0.40)
Lines Min um(mil) 30(1.20) 30(1.20) 30(1.20)
CopperMin um(mil) 10(0.40) 10(0.40) 10(0.40)
CopperMax um(mil) 30(1.20) 30(1.20) 30(1.20)
Mln.Solder Mask opening um(mil) 250(10) 200(8) 200(8)
Structure Stacking layer by layer 5+N+5 6+N+6 7+N+7
Sequenetlal Buil-up 42Any Layer 46Any Layer 60Any Layer
Multi-layer stacking N+N N+N N+N
N+X+N N+X+N N+X+N
Sequenetlal Lamination 4+(N+X+N)+4 5+(N+X+N)+5 6+(N+X+N)+6
Multi-layer stepped structure Multi-layer stacking 5+N+5 6+N+6 7+N+7
Sequenetlal Buil-up 12Any Layer 16Any Layer 18Any Layer
Multi-layer staircase 4 steps 6 steps 6 steps

Phone: 13528819118
Email: sales@chaoshengpcb-fpc.com

 

Office address: 101, No.2 Longhe Road,

Longgang District, Shenzhen,

Guangdong, China
(Cha Bajie Headquarters) 2nd Floor

Chaosheng Electronics)

 

Hong Kong Address: Chungking Mansion,

36-44 Nathan Road, Tsim Sha Tsui, Kowloon,

Hong Kong, China

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