16 layer 5-step HDI, 5-step PCB

16 layer 5-step HDI, 5-step PCB

16 layer HDI step PCB

16 layer HDI step PCB

16 layer HDI step PCB FR-4, TG170, 5-stage HDI, 5-stage Minimum line width and spacing 4/4mil, minimum hole 0.10mm, red solder mask, 2U immersion gold" The finished board thickness is 2.95mm, the copper thickness is 35um, and the thickness of each step is 0.30mm, Thickness, Stacking, Aspect Ratio, Processing Methods, Surface Treatment, Main Substrate Brands, Solder Resist, Color Testing Services, Molding Methods, Finished Product Warping, Mechanical Aperture Tolerance, Finished Product Warping, MiNiLED Minimum PAD Thermal Conductivity, Voltage Endurance, Highest Carbon Resistance, Impedance Tolerance, IC Carrier Substrate Series

26 layers embedded in multi-layer board

26 layers embedded in multi-layer board

8-layer thick copper+buried magnetic bead PCB fast charging module

8-layer thick copper+buried magnetic bead PCB fast charging module

2-layer IC carrier half hole+reinforcement board

2-layer IC carrier half hole+reinforcement board

2-layer MiNiOLEDFPC

2-layer MiNiOLEDFPC

2-layer MiNi 96% ceramic alumina+rectifier plate thick gold 5 inches

2-layer MiNi 96% ceramic alumina+rectifier plate thick gold 5 inches

Double layer high-voltage thermoelectric separation with thick copper copper substrate

Double layer high-voltage thermoelectric separation with thick copper copper substrate

4-layer high-voltage thermoelectric separation thick copper aluminum substrate

4-layer high-voltage thermoelectric separation thick copper aluminum substrate

6L high-speed rail car high-voltage soft hard combination FPC

6L high-speed rail car high-voltage soft hard combination FPC

2L ultra-thin ultra large size military antenna board

2L ultra-thin ultra large size military antenna board

12L Panasonic M6 high-speed material buried copper optical module HDIPCB

12L Panasonic M6 high-speed material buried copper optical module HDIPCB

2-layer high and low copper buried capacity thin plate PCB

2-layer high and low copper buried capacity thin plate PCB

2-layer high and low copper buried capacity thin plate PCB

2-layer high and low copper buried capacity thin plate PCB

2-layer thin plate high and low copper buried capacity PCB

2-layer thin plate high and low copper buried capacity PCB

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Email: sales@chaoshengpcb-fpc.com

 

Office address: 101, No.2 Longhe Road,

Longgang District, Shenzhen,

Guangdong, China
(Cha Bajie Headquarters) 2nd Floor

Chaosheng Electronics)

 

Hong Kong Address: Chungking Mansion,

36-44 Nathan Road, Tsim Sha Tsui, Kowloon,

Hong Kong, China

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