PCB process production ability

FPC process production capability

SMT (PCBA) Production Capability

Market distribution

Product field

Production cycle

Technical ltem Mass Product Advanced Technology
2015 2018 2023
PCB layers Max.Layer Count 26 layer 52 layer 80 layer
PCB through hole board 2～60 layer 2～80 layer 2～80 layer
Maximum size through hole 1
～2 layers		 43*62" 43〞*83" 43〞*90.55"
Maximum size through hole 4
～60 layers		 43〞*49" 43〞*61" 43〞*61"
Maximum size HDI 4～60 35″*40" 43〞*49" 43〞*49"
Minimum line width and line spacing of large size PCB Through hole 12 / 12mil
HDI14 / 14mil		 Through hole 10/10 mil HDI12 / 12mil Through hole 8 / 8mil HDI12 / 12mil
The largest board ruler 1
→ the smallest hole of 18 layers		 Through hole 0.45mm
HDI: 0.35mm		 Through hole 0.45mm HDI: 0.35mm Through hole 0.45mm HDI: 0.35mm
The layer number of FPC 1～36layer 1～60layer 1～60layer
FPC (roll to roll) maximum size 19.68″*7874" 19.68″*7874" 19.68″*7874"
Maximum size of FPC single chip shipment 19.68″*118.11" 19.68″*196.8" 19.68″*196.80"
The layer number of FPC 2～12 layer 2～26 layer 2～26 layer
Maximum size of layered board 19.68″*35" 19.68″*43" 19.68″*43"
Number of through-hole layers 2～20layer 2～30 layer 2～40 layer
Hard and soft HDI layers 2～14 layer 2～18 layer 2～22 layer
Maximum size of soft and hard combination 19.68″*43" 19.68″*49" 19.68″*49"
HDI FPC/soft-hard combination arbitrary interconnection HDI 4+X+4Interconnect HDI 5+X+5Interconnect HDI 6+X+6Interconnect HDI
HDIPCB layers 4～18layer 4～36 layer 4～60 layer
Anylayer HDI PCB 4+X+4Interconnect HDI 5+X+5、Interconnect HDI 8+X+8、Interconnect HDI
HDIPCB maximum board size 24"*52" 43"*49" 43"*49"
Number of through hole layers of high frequency board 2～18 layer 2～36 layer 2～42 layer
HDI layers of high frequency board 2～10 layer 2～16 layer 2～24 layer
Maximum size of high frequency board 37″*43" 43″*49" 43″*49"
Number of ceramic plates 1-2 layer 1～4 layer 1～6 layer
Ceramic plate thickness 0.60mm-1.60mm 0.38mm-20.0mm 0.38mm-20.0mm
Maximum size of ceramic 100*150mm 150*190mm 150*650mm
Minimum aperture of ceramic plate 0.50mm 0.35mm 0.35mm
Minimum line width and line spacing of ceramic board 16/16mil 12/12mil 10/10mil
Number of layers of metal copper substrate 1-2 layer 1～4 layer 1～6 layer
Maximum line width and line spacing of metal iron 12/12mil 4/4mil 4/4mil
Number of layers of metal aluminum substrate 1-2 layer 1～4 layer 1～6 layer
Maximum size of metal substrate 37″*43" 25.59″*59" 25.59″*59"
The smallest hole of the 0.50mm 0.35mm 0.35mm
Minimum line width and line spacing of metal substrate 12/12mil 4/4mil 4/4mil

Phone: 13528819118
Email: sales@chaoshengpcb-fpc.com

 

Office address: 101, No.2 Longhe Road,

Longgang District, Shenzhen,

Guangdong, China
(Cha Bajie Headquarters) 2nd Floor

Chaosheng Electronics)

 

Hong Kong Address: Chungking Mansion,

36-44 Nathan Road, Tsim Sha Tsui, Kowloon,

Hong Kong, China

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