Multi layer flexible layered FPC

Multi layer flexible layered FPC

The multi-layer flexible layered FPC is a versatile and advanced technology that offers numerous benefits in various applications. With 16 layers of flexible printed circuits, made from materials such as PI with reinforcement, this FPC is designed to provide high performance and reliability.

One of the key features of this FPC is the layered process, which allows for intricate designs and complex circuitry to be implemented in a compact and flexible form factor. The copper thickness of 18um ensures good conductivity and signal integrity, while the minimum line width and spacing of 1.5mil enables high-density routing and efficient use of space.

The finished board thickness of 0.25mm makes this FPC lightweight and flexible, ideal for applications where space is limited. The impedance control ensures stable signal transmission, while the resin plug hole and minimum mechanical hole size of 0.15mm provide additional protection and durability. The minimum laser hole size of 0.10mm allows for precise drilling and routing, enabling the FPC to be customized for specific requirements.

Overall, the multi-layer flexible layered FPC is a cutting-edge solution for demanding applications that require high performance, reliability, and flexibility. Its advanced design and construction make it suitable for a wide range of industries, from consumer electronics to automotive and medical devices.

|
Main Product Structure of Chaosheng Group Company
2-80 layers of rigid circuit boards, 2-50 layers of flexible circuit boards and PCBA production
Chaosheng Group Company mainly produces product categories
High end double-sided, multi-layer, flexible, high-frequency, HDI interconnect, metal based, high thermal conductivity metal based, ceramic, cut in metal based, cut in buried capacitor, cut in thick copper buried magnet, concave convex step substrate, 5G high-speed board, thick copper, thick gold, high carbon resistance, double-sided multi-layer MiNiLED, MiNiHDILED, MiNiOLED, IC carrier substrate, roll to roll FPC, long FPC, large-sized printed circuit board, halogen-free material, high-frequency material, high-speed material, metal material, environmentally friendly circuit board, blind buried hole circuit board, high thermal conductivity aluminum based, thermoelectric separation copper based, PDU busbar, iron-based and metal based (core) mixed pressure plate, embedded copper buried copper. Buried resistance buried capacitance buried ceramic bead board, ultra-thin BT board, ceramic substrate, IC carrier board, high-frequency mixed voltage, high-speed board, differential impedance board, thick copper plate, thick gold plated board, HDI An integrated OEM and ODM production factory for Anylayer, double-sided, multi-layer, HDI FPC, soft hard combination HDI, roll to roll FPC, ultra long FPC, ultra large size PCB production and product design and development, software development, special material printed circuit boards, etc.
The main application areas of PCB and PCBA products of Chaosheng Group Company
Communication terminals, communication stations, electronic communication, fiber optics, optical modules, backlight sources, chip systems, communication equipment, communication instruments, computers, intelligent devices, intelligent control, system control, industrial power control, industrial equipment, testing instruments, testing instruments, SD cards, SG cards, mobile phones, computers, various antennas, radars, automobiles, light sources, resistors, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other application fields;
The main application areas of flexible circuit boards (FPC) and FPCA products of Chaosheng Group Company
Hard drives, printers, fax machines, scanners, sensors, mobile phones, connectors, modules, walkie talkie antenna cards, high-end cameras, digital cameras, laser heads, CDs, medical devices, instruments, drives, automobiles, automotive instruments, automotive drive disks, drivers, optical drives, medical devices, medical equipment, backlight sources, modules, banking equipment, industrial instruments, LED light strips, military, aviation, aerospace, national defense and other product fields.
Serial Number    Project    Manufacturing capability
1    Layers    Floors 1-80
2    Maximum size of PCB    2500*1150mm
3    Maximum size of flexible FPC    500mm*100m
4    Maximum size of PCBA    1600mm*1000mm
5    FPCBA maximum size    500mm*100m
6    PCB finished product thickness    0.15-12.0mm
7    Thickness of flexible FPC finished product    0.05-0.60mm
8    Finished copper thickness    12um-1075um
9    Minimum finished aperture of laser hole    0.075mm
10    Minimum line width and spacing    1.5mi/1.50mil
11    Minimum finished hole diameter for through-hole    0.15mm
12    Thickness stacking aspect ratio    1:35
13    By processing methods    VIA blind buried hole treatment: ink plug hole, resin plug hole, copper paste plug hole, VCP copper filling hole, silver paste plug hole, carbon oil plug hole, etc
14    Surface Treatment    Sinking gold, electroplating nickel gold, electroplating thick gold, electroplating gold+OSP, electroplating nickel gold+sinking gold, electroplating nickel gold+sinking gold+OSP, electroplating gold+OSP, electroplating gold+gold fingers, OSP+gold fingers, lead-free tin spraying, lead-free tin spraying+sinking gold, lead-free tin spraying+gold fingers, lead tin spraying, OSP, sinking tin, sinking silver, electroplating silver
15    Main substrate brands    Rogers, Arlon, Taconic, TP-2, Megtron, Neclo, Isola, F4B, 3M, Mitsui Group (Japan Mitsui/Mitsui Top), Taiyo TUC, Taiguang EMC, Tenghui VT, Shengyi SY, Lianmao ITEQ, South Asia NOUYA, DuPont Kappon, Taihong, Hongren Hongren, Xin Yang, Nippon Steel Nippon Stee, Teflon, Yasen, Matsushita, RCC, Mitsui Mitsui Group (Japan Mitsui Top), 3M (USA) 3M Location, Kyocera CERADIR, Jiuhe, Jiuhao, China Porcelain, Huaqing, Ai Shengda, Slitton, Kai Changde, Tongxin, Bergs, Yalong, Taiconieta, etc
16    Solder mask color    Green, black, red, yellow, white, blue, purple, matte green, matte black, etc
17    Test service    AOI、X-Ray、 Voltage withstand test, short circuit test, soldering test, thermal shock test, functional test, high temperature and high humidity test, first piece tester, etc
18    Molding method    CNC shape, punch shape, V-CUT+forming method
19    Finished product warpage    ≤0.5%
20    Mechanical aperture tolerance    ≤0.025mm
21    Finished product warpage    ≤0.5%
22    MiNiLED Minimum PAD    0.065mm/0.065mm
23    Thermal conductivity    ≧8W
24    Highest withstand voltage    2500Pa
25    High carbon resistance value and tolerance    ≧100→15000Ω±20%
26    Impedance tolerance    ≤5→8%Ω
27    IC Carrier Board Series    Minimum line width and spacing of 20um/20um
                                                                            
FAQ
Question Point    Answer
Q: What information is required for PCB    CEGSATE: Gberber files for PCB production, product process instructions, such as material requirements, surface treatment requirements, finished product thickness requirements, PCB stack structure diagram for advanced products, copper thickness requirements for each layer, sample quantity requirements, batch order requirements, product application fields, and other related information are required
Q: What information does PCBA need to provide    CEGSATE: BOM report is required (including the brand, specifications, and model of the components), X and Y coordinate numbers of PCBA components, and processing requirements: Do we need to purchase the components on our behalf? Or customer supplied components? Do you need software burning? What is the required quantity? What is the monthly demand and other detailed information.
Question: Is my file secure?    CEGSATE: Your files are very secure, and we protect intellectual property rights for our clients throughout the entire process. All files provided by the customer will never be shared with any third party.
Q: What is the minimum order quantity?    CESGATE: There is no minimum order quantity in POE. We are able to handle small and large batches flexibly.
Q: Do you have any other services?    CESGATE: We mainly focus on PCB+FPC production+SMT+assembly PCBA+component procurement services; In addition, we can also provide programming, testing, software burning, wiring, and shell assembly services; And product design, product development, software development
Q: What is your inspection method? How do you control the quality?    CESGATE: In order to ensure the quality of PCB and FPC products, flying pin testing is usually used for samples and small batches; The inner circuit undergoes AOI optical inspection, online AOI inspection, and the finished product undergoes 100% inspection through E-SET testing rack. The appearance undergoes 100% inspection through fully automatic finished product inspection equipment and FQC. PCBA undergoes automatic optical inspection (AOI), BGA part X-Ray 100% radiographic inspection, and first article inspection (FAI). PCBA products that require software burning undergo 100% full testing through finished product testing rack according to product functional requirements.