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4-layer high thermal conductivity thermoelectric separation thick copper aluminum base


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2-layer thermoelectric separation+mirror aluminum copper base+convex platform process


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2-layer thermoelectric separation+10OZ thick copper+recessed buried copper+sinkhole


3-layer thermoelectric separation+20OZ thick copper+recessed buried copper+sinkhole

3-layer thermoelectric separation+20OZ thick copper+recessed buried copper+sinkhole


4-layer thermoelectric separation+20OZ thick copper+recessed buried copper+sinkhole

4-layer thermoelectric separation+20OZ thick copper+recessed buried copper+sinkhole


4 layers of 15OZ thick copper+copper bars

4 layers of 15OZ thick copper+copper bars


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Fake double-sided copper based hollow building


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4 layers of 15OZ thick copper+beveled edge+countersunk hole


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2-layer 15OZ thick copper+convex copper base


2-layer 20OZ thick copper+bending processing

2-layer 20OZ thick copper+bending processing


4-layer 6OZ thick copper, thermoelectric separation copper based PCB

4-layer 6OZ thick copper, thermoelectric separation copper based PCB


4-layer high thermal conductivity thermoelectric separation thick copper aluminum base

4-layer high thermal conductivity thermoelectric separation thick copper aluminum base


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Phone: 13528819118
Email: sales@chaoshengpcb-fpc.com

 

Office address: 101, No.2 Longhe Road,

Longgang District, Shenzhen,

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Chaosheng Electronics)

 

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36-44 Nathan Road, Tsim Sha Tsui, Kowloon,

Hong Kong, China

  • Home

  • About us

    • Company profile

    • Organizational structure

    • Corporate culture

    • Development course

    • Honor and qualification

  • Core technology

    • PCB process production ability

    • FPC process production capability

    • SMT (PCBA) Production Capability

    • Market distribution

    • Product field

    • Production cycle

  • Main equipment

    • PCB equipment

    • Flexible FPC device

    • PCBA (SMT+DIP+AI) main equipment

  • Products and services

    • Double-sided PCB

    • Double sided FPC

    • Multi-layer circuit board

    • Multi layer flexible FPC

    • Roll to roll flexible FPC

    • Multi layer IC carrier substrate

    • HDI IC Carrier PCB

    • MiNiLEDHDI

    • Hardware software combination HDIFPC

    • High frequency printed circuit board

    • High thermal conductivity ceramic PCB

    • Oversized circuit board

    • Thermoelectric separation copper based circuit board

    • Multi layer thick copper circuit board

    • Special process circuit board

    • PCBA+SMT(AI+DIP)

  • Blog

    • Technical News

    • Industry Trends

  • Join us

    • Talent cultivation

    • Talent Recruitment

  • Contact us

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