• Home

  • About us

    • Company profile

    • Organizational structure

    • Corporate culture

    • Development course

    • Honor and qualification

  • Core technology

    • PCB process production ability

    • FPC process production capability

    • SMT (PCBA) Production Capability

    • Market distribution

    • Product field

    • Production cycle

  • Main equipment

    • PCB equipment

    • Flexible FPC device

    • PCBA (SMT+DIP+AI) main equipment

  • Products and services

    • Double-sided PCB

    • Double sided FPC

    • Multi-layer circuit board

    • Multi layer flexible FPC

    • Roll to roll flexible FPC

    • Multi layer IC carrier substrate

    • HDI IC Carrier PCB

    • MiNiLEDHDI

    • Hardware software combination HDIFPC

    • High frequency printed circuit board

    • High thermal conductivity ceramic PCB

    • Oversized circuit board

    • Thermoelectric separation copper based circuit board

    • Multi layer thick copper circuit board

    • Special process circuit board

    • PCBA+SMT(AI+DIP)

  • Blog

    • Technical News

    • Industry Trends

  • Join us

    • Talent cultivation

    • Talent Recruitment

  • Contact us

language
Submit
News

Knowledge

Technical News

Industry Trends

Blog detail


SMT Control Process Diagram

Release time:

2022-06-29 22:39

SMT Control Process Diagram



 

Previous

How to detect defects in ceramic substrates

Material procurement process

Next

Previous

How to detect defects in ceramic substrates

Next

Material procurement process

Related news


Understanding Multi-Layer HDIFPC: Revolutionizing Circuit Board Technology

Understanding Multi-Layer HDIFPC: Revolutionizing Circuit Board Technology

In the rapidly evolving world of electronics, the demand for compact, lightweight, and efficient circuit boards has led to the development of advanced technologies. One such innovation is the multi-layer HDIFPC, or High-Density Interconnect Flexible Printed Circuit. This technology is essential for modern devices where space and performance are critical. Multi-layer HDIFPC integrates multiple laye

View details

Understanding Multi-Layer HDIFPC: Revolutionizing Circuit Board Technology

2025/05/15


The Science Behind Ultra Long Flexible 2LFPC: What You Need to Know

2025/05/12


Understanding the Advantages of 2L Mirror Aluminum Based PCBs in Electronics

2025/05/09


Phone: 13528819118
Email: sales@chaoshengpcb-fpc.com

 

Office address: 101, No.2 Longhe Road,

Longgang District, Shenzhen,

Guangdong, China
(Cha Bajie Headquarters) 2nd Floor

Chaosheng Electronics)

 

Hong Kong Address: Chungking Mansion,

36-44 Nathan Road, Tsim Sha Tsui, Kowloon,

Hong Kong, China

  • Home

  • About us

    • Company profile

    • Organizational structure

    • Corporate culture

    • Development course

    • Honor and qualification

  • Core technology

    • PCB process production ability

    • FPC process production capability

    • SMT (PCBA) Production Capability

    • Market distribution

    • Product field

    • Production cycle

  • Main equipment

    • PCB equipment

    • Flexible FPC device

    • PCBA (SMT+DIP+AI) main equipment

  • Products and services

    • Double-sided PCB

    • Double sided FPC

    • Multi-layer circuit board

    • Multi layer flexible FPC

    • Roll to roll flexible FPC

    • Multi layer IC carrier substrate

    • HDI IC Carrier PCB

    • MiNiLEDHDI

    • Hardware software combination HDIFPC

    • High frequency printed circuit board

    • High thermal conductivity ceramic PCB

    • Oversized circuit board

    • Thermoelectric separation copper based circuit board

    • Multi layer thick copper circuit board

    • Special process circuit board

    • PCBA+SMT(AI+DIP)

  • Blog

    • Technical News

    • Industry Trends

  • Join us

    • Talent cultivation

    • Talent Recruitment

  • Contact us

COOKIES

Our website uses cookies and similar technologies to personalize the advertising shown to you and to help you get the best experience on our website. For more information, see our Privacy & Cookie Policy

COOKIES

Our website uses cookies and similar technologies to personalize the advertising shown to you and to help you get the best experience on our website. For more information, see our Privacy & Cookie Policy

These cookies are necessary for basic functions such as payment. Standard cookies cannot be turned off and do not store any of your information.

These cookies collect information, such as how many people are using our site or which pages are popular, to help us improve the customer experience. Turning these cookies off will mean we can't collect information to improve your experience.

These cookies enable the website to provide enhanced functionality and personalization. They may be set by us or by third-party providers whose services we have added to our pages. If you do not allow these cookies, some or all of these services may not function properly.

These cookies help us understand what you are interested in so that we can show you relevant advertising on other websites. Turning these cookies off will mean we are unable to show you any personalized advertising.

300.cn

Shenzhen

SEO

Business

Sales Department2:616674225

Sales Department销售部:373011007

Tel:+86-13528819118

Email:sales@chaoshengpcb-fpc.com

WhatsApp:13528819118

Skype:pcb-fpcb88@163.com