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BT resin BT resin board application High quality BT resin PCB Zhongjing Integrated Company is your wisest choice
Release time:
2022-06-21 11:23
Simply put, BT board is a general term for PCB processed from BT substrate material. The PCB carrier board currently used in SMD LED products belongs to a special type of PCB and is the simplest IC carrier board. Currently, the BT resin developed by Mitsubishi Gas in Japan is mainly polymerized in the market.
BT resin BT resin board application High quality BT resin PCB Zhongjing Integrated Company is your wisest choice
BT board
Simply put, BT board is a general term for PCB processed from BT substrate material.
The PCB carrier board currently used in SMD LED products belongs to a special type of PCB and is the simplest IC carrier board. Currently, the BT resin developed by Mitsubishi Gas in Japan is mainly polymerized in the market.
The substrate composed of BT resin as raw material has advantages such as high Tg (255-330 ℃), heat resistance (160-230 ℃), moisture resistance, low dielectric constant (Dk), and low loss factor (Df). The BT copper foil substrate (used on SMD LEDs) is mainly based on the CCL-HL 820 series, and has now developed to the latest version model CCL-HL 820WDI. The main thickness specifications are 0.10, 0.20, 0.40, and 0.46mm. The copper foil thickness specifications covered by the BT copper foil substrate are 1/2oz and 1/3oz, so the corresponding BT board finished product thicknesses are 0.18+/-0.03mm, 0.28+/-0.03mm, 0.48+/-0.03mm, and 0.54+/-0.03mm. The existing BT boards are mainly double-sided boards, which can be divided into drilling boards and groove boards according to different conduction methods. They can also be divided into two types based on surface treatment: electroplated gold and electroplated silver. Currently, electroplated gold technology is the main technology in the market, but we believe that the application of electroplated silver technology in BT boards is developing in line with the market's demand for LED brightness.
That is to say, BT board, also known as BT resin substrate material, such as BT resin based copper-clad laminate, is a special high-performance substrate material used for PCB (printed circuit board).
Basic Introduction to BT Board
BT "is a resin chemical trade name produced by Mitsubishi Gas Chemical Company in Japan. It is synthesized from bismaleimide and cyanate ester resin. BT resin based copper-clad laminates (abbreviated as BT boards) have high glass transition temperature (Tg), excellent dielectric properties, low thermal expansion rate, and good mechanical characteristics, which make them widely used in high-density interconnect (HDI) multilayer printed boards and packaging substrates that are gradually becoming popular. At first, BT boards were only used in chip packaging, and now there are more than ten varieties. Gradually, the application of BT boards has become more widespread.
Application scope of BT board
At present, the BT board on the market is dominated by products from Mitsubishi Gas Chemical Company in Japan. In China, the industrial production of BT board is still blank, but research institutes have begun to study BT resin. With the rise of packaging technologies such as PBGA, EBGA, CSP, and the increase in operating frequency of electronic devices, such as the development of mobile phones from the initial GSM (900-1800MHz) mode to the current Bluetooth technology (2.400-2.497kMHz), as well as the development of lead-free soldering technology for printed boards, especially in recent years with the strong development of light-emitting diodes (LEDs) and microelectromechanical systems (MEMS), and the encouragement policies of the country, there have been extensive opportunities for the development of BT boards. It is used in packaging substrates, high-frequency boards, and height boards.
BT Resin
Basic information of BT resin
Abstract: This article elaborates on the properties and synthesis process of bismaleimide triazine resin (BT resin). Explored the technological progress of PCB substrate materials using this type of BT resin
【 Keywords 】: Bismaleimide triazine resin, printed circuit board substrate material, synthesis performance
[Category Number]: TQ323
BT resin used for PCB substrate materials
Here, we use bismaleimide and triazine as the main resin components, and add epoxy resin, polyphenylene ether resin, or allyl compounds as modified components to form a thermosetting resin called BT resin. In 1963, Germany first invented a simple process for synthesizing cyanate esters using halogenated cyanide and phenol.
Now, PCB manufacturer Zhongjing Integrated PCB CEO Wang stated that the supply of BT resin substrates will be guaranteed in June, and the outlook for smartphones throughout the year remains optimistic. Due to insufficient material supply from other manufacturers, Xinxing's revenue in the second quarter is expected to remain stable or slightly increase compared to the first quarter. It is expected that the supply of high-density interconnect (HDI) boards will once again be tight in the third quarter.
The Taiwan side stated that although there were unfavorable factors such as declining revenue, appreciation of the New Taiwan Dollar against the US dollar, and rising raw material prices in the first quarter, high gross profit integrated circuit (IC) substrates and high-density connection boards had relatively less decline, and the product structure was better. Some product prices also reflected the increase in exchange rates and raw material prices, so the gross profit margin improved compared to the fourth quarter of last year. For the second quarter, Xinxing believes that the selling prices of gold and some copper foil and copper foil substrate (CCL) products will continue to rise, the New Taiwan Dollar will also appreciate against the US dollar, and HDI will be relatively weak. However, some low-priced products will continue to increase, which has also gained customer consensus, and there is a chance for the gross profit margin to remain flat.
In addition, the operation in the second quarter is expected to remain stable or slightly increase. In terms of IC substrates, HDI, and traditional PCBs, IC substrates will remain stable or slightly increase, HDI will decline more, and PCBs will show a significant improvement compared to the off-season in the first quarter. As for the production capacity utilization rate of Xinxing PCB, HDI, IC substrate and flexible printed circuit board (FPC), PCB has increased to 80% to 90%, HDI has slightly decreased to 80% to 85%, IC substrate has slightly increased to 75% to 85%, and FPC has increased to 85% to 90%.
Regarding the weakening demand for HDI, major manufacturers emphasize that there is no problem with the PCB supply chain itself, but other supply chains may have issues, leading to conservative customer orders, especially for mobile phones. Part of the reason is also due to customers not placing large orders during the transition period when many new products will be launched at the end of the third quarter and the beginning of the fourth quarter. However, we believe that although HDI declined in April, there is a chance for a significant increase in May, and it can be estimated that the demand for smartphones will increase in May.
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