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HDI blind buried hole manufacturing process technology
Release time:
2022-06-21 14:03
The production of blind hole boards has a relatively high density of professional skills, and the development prospects of industrial equipment manufacturing and manufacturing are detailed. The relativity clearly points out the same requirements for PCB PCB PCB circuit boards. The most effective way to increase PCB density is to reduce the number of through holes and accurately set blind holes and buried holes.
HDI blind buried hole manufacturing process technology
The production of blind hole boards has a relatively high density of professional skills, and the development prospects of industrial equipment manufacturing and manufacturing are detailed. The relativity clearly points out the same requirements for PCB PCB PCB circuit boards. The most effective way to increase PCB density is to reduce the number of through holes and accurately set blind holes and buried holes.
1. Definition of blind hole
a: Compared to through holes, through holes refer to holes drilled through all layers, while blind holes are drilled through for love and hate. (Legend explanation, for example, eight layer board: through-hole, blind hole, buried hole)
b: Blind hole segmentation market: Blind hole (BLIND HOLE), Buried hole (not visible on the surface);
c: The difference in production process is that blind holes are drilled before pressing, while through holes are drilled after pressing.
2. Method: a: Drill belt:
(1) Select a selection point: Choose a through-hole (i.e. one of the holes in the first drill strip) as the reference hole for the control module.
(2) Each blind hole drill strip needs to select a hole and mark its coordinates relative to the reference hole of the control module.
(3) Attention should be paid to indicating which drill strip is consistent with which double layer: The control module hole diagram and drill bit table should be marked, and the names on the top, bottom, left, right should be consistent; The situation where a, b, and c are used to illustrate the inability to generate a pore plot, which was previously explained using 1st and 2nd. Note that when the generator holes of the laser generator are nested with the inner buried holes, that is, the holes of the two drill strips are in the same position, it is necessary to ask the customer to move the position of the generator holes of the laser generator to ensure the connection on the electrical equipment. (Legend Explanation 9430)
B: Production and processing of PNL board outer production process holes: general solid wood composite board: inner layer without holes;
(1) The anchor bolts gh, aoi gh, and et gh are all extracted after etching the plate
(2) Target hole (hole opening) CCD: The surface needs to have an internal electrical layer removed, X-ray machine: immediately remove it, and pay attention to the long side being at least 11 inches. (11228) Blind hole plate: All tooling holes are crawled out, pay attention to the anchor bolts gh; Beer needs to be brewed to avoid any deviation in alignment. (Aoi GH is also for beer production), the production and processing of PNL boards require drilling on the outside to distinguish one board from another.
3. Film modification:
(1) Mark the film to produce the entire film. Film: General specifications: If the plate thickness exceeds 8 meters (without copper), the entire film process will be followed; If the thickness of the board is less than 8 meters (without copper), follow the film process (copper sheet raw material); When the gap valley of the wire strip is too large, the copper thickness at d/f should be fully considered, not just the bottom copper thickness. A blind hole ring can be made for 5mil without the need for 1mil. The inner independent pads with consistent blind holes need to be stored. Blind holes cannot be made without rings.
4. Process: The method of burying filling materials is consistent with that of general double-sided panels. Blind hole board, not only has one side as the surface: full sheet process: try to have both sides d/f, pay attention not to roll the wrong side (when the double-sided bottom copper is inconsistent);
When exposed to d/f, cover the copper surface with black tape to prevent transparency. Due to the fact that blind hole boards require more than two electrical treatments, it is easy for the total value to be too thin or too thick. Therefore, attention should be paid to controlling the thickness of the board and copper, and the range of copper and aluminum plate thickness should be marked after etching processing. After pressing the board, use an X-ray machine to create target holes for the solid wood composite board. Film process: For metal sheet materials and raw materials (<12mil copper), due to their inability to be produced and processed by drawing electric drawing, they should be produced and processed by water metal drawing as much as possible. However, water metal drawing cannot produce total current on both sides separately, so it is not possible to produce total current without or with small total current on both sides according to MI requirements. If the entire film process is followed, it often leads to excessive thickness of copper on both sides, making etching processing difficult and resulting in thin lines. Therefore, this type of board needs to go through the film process.
5. The opening sequence of through holes and blind holes is different, and the reasons for deviations during production are inconsistent; Blind hole boards are very prone to deformation, and it is difficult to control the position distance of solid wood composite boards when cutting with horizontal or straight materials. Therefore, when cutting, only horizontal or straight materials should be cut.
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