10 layer thermoelectric separation copper based


Automotive electronics PCB, Medical equipment circuit board, Industrial control PCB, Aerospace & military grade PCB, Ion‑equipment high‑voltage board, High‑speed server PCB, 5G communication circuit board, Radar RF microwave PCB, Wireless terminal motherboard, Industrial SBC mainboard, High‑power industrial control PCB, Automation controller board, Drone flight‑control PCB, Robot control board, High frequency low loss PCB, Thick hard gold finger circuit board, HDI blind & buried via PCB

36 layer multi-layer PCB


<p>板厚: 1.397 +0.139mm<br /> 板材: 370HR+l-Tera MT40+ RO4450F<br /> 最小孔径: 0.225mm通孔/0.15mm(盲孔)<br /> 层数: 10L<br /> 最小线宽:内层4mil<br /> 最小线宽:外层4mil<br /> 最小孔铜: 0.6mil<br /> 完成面铜:1.0mil<br /> 出货尺寸: 30.8*181.1mm<br /> 表面处理:沉金<br /> 产品应用: 5G小基站天线</p>

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