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16 layer industrial chip IC carrier PCB
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16th floor stair step board FR-4, TG170, 5-stage HDI, 5-stage Minimum line width and spacing 4/4mil, minimum hole 0.10mm, red solder mask, 2U immersion gold" The finished board thickness is 2.95mm, the copper thickness is 35um, and the thickness of each step is 0.30mm,
16 layer HDI step PCB FR-4, TG170, 5-stage HDI, 5-stage Minimum line width and spacing 4/4mil, minimum hole 0.10mm, red solder mask, 2U immersion gold" The finished board thickness is 2.95mm, the copper thickness is 35um, and the thickness of each step is 0.30mm, Thickness, Stacking, Aspect Ratio, Processing Methods, Surface Treatment, Main Substrate Brands, Solder Resist, Color Testing Services, Molding Methods, Finished Product Warping, Mechanical Aperture Tolerance, Finished Product Warping, MiNiLED Minimum PAD Thermal Conductivity, Voltage Endurance, Highest Carbon Resistance, Impedance Tolerance, IC Carrier Substrate Series
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