Production and Process Technology of Ceramic PCB Circuit Board

Production and Process Technology of Ceramic PCB Circuit Board
Ceramic PCB production, manufacturing, and manufacturing process technology for ceramic products. It is important to use single-sided, double-sided, two-layer, 6-layer, composite aluminum silicate plate structure for ceramic products

Aluminum silicate plates are mainly divided into aluminum oxide ceramics (which can be divided into fired ceramic art, silver wire production process, and polished aluminum silicate plate production process), aluminum nitride ceramics,

Ceramic PCB circuit boards are actually made of electronic device ceramic raw materials and can be made into various shapes. Among them, ceramic PCB circuit boards have the most prominent characteristics of high temperature resistance and high insulation layer, with low relative permittivity, low dielectric loss, high thermal conductivity, good analytical chemical stability, and similar thermal expansion coefficients of components. Ceramic printed circuit boards are produced and manufactured using laser fast activation coating technology LAM technology. Used in the LED field, high-power semiconductor modules, semiconductor devices such as fiberglass cooling towers, electronic heaters, power control circuits, power hybrid circuits, intelligent system power electronic devices, high-frequency switch power supply circuits, small relays, vehicle electronic equipment, communication, aerospace, and defense security electronic components.

Unlike traditional FR-4 (glass fiber), structural ceramics have excellent high-frequency and electrical equipment characteristics, as well as high thermal conductivity, analytical chemical stability, and temperature resistance. Ideal packaging material for converting into large-scale integrated circuit chip processors and power electronics technology modules.

Important advantages:

1. Higher thermal conductivity

2. More matching coefficient of thermal expansion

3. A slightly hard, low resistance micro filter alumina ceramic PCB circuit board

4. The board has good malleability and high operating temperature.

5. Good insulation performance

6. Low frequency loss

7. Assemble with relatively high density

8. No organic chemical components, resistant to cosmic rays, high reliability in aerospace, and long application time

9. The copper layer does not have a hydroxide layer and can be used in a reducing atmosphere for a long time.

Pottery has been printed with PCB circuit board technology. Detailed explanation of production and manufacturing process - Hole drilling safety vulnerabilities

With the development trend of electronic products with high output power towards miniaturization and high-speed, traditional FR-4, solar panels and other thick steel plate raw materials are no longer easily available for the development trend of high output power and maximum power. With the development trend of scientific research technology, the application of intelligent systems in the PCB industry. Traditional LTCC and DBC technologies are gradually being replaced by DPC and LAM technologies. Laser technology represented by LAM technology is more in line with the development trend of high hardness interconnects and particle size distribution in printed circuit boards. Laser drilling machine is a cutting-edge and popular hole making technology in the PCB industry. This technology is efficient, fast, precise, and has high practical value for application. The RayMingceramicpcb circuit board is made using laser fast activation plating technology. The bonding between the metal composite material layer and the ceramic in the middle has high tensile strength, high-quality electrical equipment functions, and can be continuously welded by electric arc welding. The thickness of the metal composite material layer can be adjusted within the range of 1 μ m-1mm, and L/S resolution can be achieved. 20 μ m, can be immediately connected to provide customized solutions for customers.

The horizontal excitation gas CO2 laser is designed and developed by an Australian company. Compared with traditional laser generators, it has an output power of 100 to 1000 times and is conducive to production and manufacturing. In the frequency range of 105-109Hz in the magnetic effect frequency band of current, with the development trend of national defense security and aerospace technology, the secondary frequency is pushed. Large, medium, and small-sized high-power CO2 laser devices have outstanding configuration characteristics, stable power, and high operational reliability. Characteristics such as long service life. UV solid YAG is widely used in the industrial production of plastics and metal composite materials in microelectronics technology. Although the entire process of CO2 laser drilling machine is relatively complex, the expected production and manufacturing effect of micro pores is better than that of UV solid YAG. However, CO2 laser has the advantages of high efficiency and fast hardware mold processing. The market share of PCB laser micro hole processing is still in the development stage of China's laser micro hole production and manufacturing, and there are not many enterprises that can allocate funds for production and manufacturing.

The production and manufacturing of laser micro holes in China is still in the stage of development trend. Short pulse and peak period power lasers are used to create holes in thick steel plates on PCB substrates for relatively high mechanical energy, material removal, and micro hole formation. Dissolution is divided into photothermal power generation dissolution and photochemical change dissolution. Photothermal ablation refers to the entire process of drilling holes using high-energy lasers based on the rapid digestion of thick steel plate raw materials. Photochemical dissolution refers to the composition of high photon energy in the ultraviolet region exceeding 2 eV electron volts and laser light wavelengths exceeding 400 nm. The entire production process can effectively damage the long molecular chains of organic materials, resulting in smaller fine particles, which can quickly form micropores under external forces.

Today, there is a certain practical experience and technological development trend in laser drilling machine technology in China. Compared with traditional hardware mold technology, laser punching machine technology has precision machining, high-speed operation, high efficiency, large-scale automatic punching machines, and can use the vast majority of hard and soft materials without harming commonly used tools and causing waste. The advantages of less raw materials, ecological environment protection, and zero environmental pollution.

The ceramic PCB circuit board is made according to the laser drilling process, with strong fusion between the ceramic and metal composite materials in the middle, preventing them from falling off. It is foamed with polyurethane and has the expected effect of growing and developing together, with high surface flatness and surface roughness ranging from 0.1 μ m to 0.3 μ m. The laser severely inspects the hole diameter from 0.15mm to 0.5mm, even 0.06mm.

Ceramic PCB production and manufacturing - etching

On the copper tray stored on the surface of the PCB circuit board, a layer of lead tin resist is pre embedded in the circuit design pattern, and then chemical etching is analyzed to remove a portion of the unprotected dielectric copper, resulting in the circuit.

According to different manufacturing processes, etching can be divided into internal layer etching and surface etching. Internal layer etching is acid etching, and wet film or wet film m is used as a resist; Surface etching is alkaline etching, with tin lead as the resist.

The basic elements reflected in etching

1. Acid alkali copper chloride ash removal

Acid alkali copper chloride ash removal

Developer solution: A portion of the wet film that has not been irradiated with ultraviolet light is dissolved by weakly alkaline potassium carbonate, and a portion remains after irradiation.

Etching: Based on a certain proportion of solution, the exposed copper surface of the wet film or wet film is melted and etched by an acidic or alkaline copper chloride etching solution.

Fading plastic film: The protective film of the automatic production line melts at a unique temperature and speed in a certain proportion.

The pH copper chloride catalyst carrier has the characteristics of easy control of etching rate, high copper etching efficiency, high cost-effectiveness, and is conducive to the recycling and reuse of etching solution

Pool effect

2. Gully effect

The adhesion of the medicinal solution causes it to adhere to the gaps between the pipelines, which can result in different etching amounts in the gathering area and expand the open area.

Puddle Effect 

3. Based on expected results

The liquid drug crosses the hole downwards, resulting in an increase in the speed of the liquid drug upgrading near the welding bolt during the entire etching process, and an increase in the etching amount.

Based on expected results

4. Expected effect of nozzle shaking

The line perpendicular to the shaking direction of the nozzle, because the new medicine easily dissipates the medicine in the middle of the line, the liquid medicine quickly upgrades, and the etching amount is large;

The line that vertically divides the shaking direction of the nozzle, because the new analytical chemical liquid is not easy to dissipate. The liquid drug in the middle of the line upgrades at a slower speed, and the etching amount is not large

2. Alkaline etching

Expected effect of nozzle shaking

Common problems and improvement methods in etching

1. Movies are endless

Because the content of sugar syrup is very low; The angular velocity is too fast; Difficulties such as nozzle blockage can lead to excessive plastic film. Therefore, it is necessary to check the content value of the sugar syrup and adjust it to an appropriate range; Immediately adjust the speed and basic parameters; Next, eliminate the nozzle.

2. Oxidation on the surface of the board

Due to the high concentration and temperature of sugar syrup, it can cause oxidation on the surface of the board. Therefore, it is necessary to immediately adjust the content and temperature of the sugar syrup.

3. The Tecopper did not carry out

The etching speed is too fast; There is a deviation in the composition of sugar syrup; Copper surface is polluted by air; Nozzle blockage; The temperature is low and copper has not been developed. Therefore, it is necessary to adjust the etching transfer speed; Recheck the composition of the sugar syrup; Be careful of copper air pollution; Clear the nozzle to prevent blockage; Adjust the temperature.

4. Etching copper too high

Due to the slow operation and high temperature of the machinery and equipment, there is a high possibility of excessive copper corrosion. Therefore, preventive measures such as adjusting machine equipment speed and adjusting temperature should be selected.