Leader in ultra long, ultra large, and roll to roll flexible FPC technology
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Product Description
2. Technical support: Dedicated equipment cluster builds a solid foundation for mass production
Equipped with a complete set of specialized production equipment for ultra large multi-layer boards, forming a closed-loop production chain: key equipment such as fully automatic screen printing machines, exposure machines, AOI detection machines, etc. all support processing of ultra large sizes of 2600 × 1200mm, ensuring the accuracy and stability of core processes such as multi-layer board pressing and wiring; The electroplating tank equipment has a total width of 2600 × 1350 millimeters and uses VCP gold plating wire technology to achieve uniform electroplating, ensuring consistent copper thickness in different layers and areas; The laser inspection equipment covers a size range of 2100 × 1150 millimeters and achieves full-scale accurate detection with a fine resolution of 100nm; Paired with a fully automatic stacking system, it achieves efficient stacking of over 4 sheets per minute, while significantly reducing the defect rate of multi-layer board compression through bubble monitoring and management technology. The entire set of equipment is included in the SPC full process control, achieving precise control of X and Y dimensional parameters, providing hardware support for stable mass production of ultra large multi-layer boards.
3. Quality advantage: Full chain control and extreme environmental reliability guarantee
Establish a strict quality control system for the entire chain from material screening to finished product shipment: select high-quality polyimide substrates and halogen-free, lead-free environmentally friendly materials in the raw material process, and accurately test key parameters such as dielectric constant and insertion loss of materials through a probe station system to ensure electrical performance compliance; The production process implements Six Sigma management standards, strictly controlling interlayer alignment errors within ± 20 μ m, with a minimum aperture of 0.10mm, copper thickness ranging from 5 angstroms to 12oz, and precise control of finished plate thickness between 0.12-10.0mm, with an error not exceeding ± 10%; The detection process adopts full process automation detection, combined with advanced methods such as X-ray bubble detection and 3D-SPI height detection (accuracy of 1um), to achieve 100% qualified testing and shipment. The product has passed multiple authoritative certifications such as UL, ISO9001, TS16949, and has been verified through extreme environmental testing. It can withstand 1000 temperature cycle tests from -25 ℃ to 125 ℃ and 100 thermal shock tests from room temperature to 260 ℃. It maintains stable conductivity under harsh conditions such as high temperature, high frequency, and high vibration, and its reliability reaches the top level in the industry.
 Process Capability Table | ||||
| Technical ltem | MassProduct | Advanced Technology | ||
| 2015 | 2021 | 2025 | ||
| Max.Layer Count | 80 layer | 100 layer | 100 layer | |
PCB through hole board | 2～80 layer | 2～100 layer | 2～100 layer | |
Maximum size through hole 1～2 | 37〞*98.50" | 43.3〞*118.11" | 43.3〞*118.11" | |
Minimum line width and spacing | 10(0.40) | 10(0.40) | 7.50（0.30mm） | |
| Minimum mechanical hole(mm) | 12(0.50) | 10(0.40) | 8.50（0.35mm） | |
Maximum size through hole 4～22 layers | 37〞*43.30" | 43.3〞*43.30" | 43.3〞*43.30" | |
Maximum size through hole 4～22 layers | 31.50 ″*59" | 31.50 ″*70.86" | 31.50 ″*70.86" | |
Maximum size through hole 4～22 layers | 10(0.40) | 10(0.40) | 7.50（0.30mm） | |
| Minimum line width and spacing for multi-layer large-sized PCBs | 10(0.40) | 10(0.40) | 7.50（0.30mm） | |
Maximum size of multi-layer through- hole : 4-22 layers with the smallest hole | 12(0.50) | 10(0.40) | 8.50（0.35mm） | |
| Maximum size HDI 4～36 layers | 31.50 ″*55" | 31.50 ″*55" | 31.50 ″*55" | |
| Minimum line width and line spacing of large size PCB | Through hole 12 / 12milHDI14 /14mil | Through hole 10/10 milHDI12 / 12mil | Through hole 8 / 8milHDI12 / 12mil | |
| The largest board ruler 1 → the smallest hole of 18 layers | Through hole 0.50mmHDI :0.45mm | Through hole 0.50mm HDI : 0.45mm | Through hole 0.50mmHDI : 0.45mm | |
| The layer number of FPC | 1～36layer | 1～60layer | 1～60layer | |
| Maximum size of flexible FPC | 19.68〞*55" | 28〞*59" | 31.49〞*118.12" | |
| Maximum size of flexible FPC with soft hard combination | 19.68〞*55" | 28〞*59" | 31.49〞*118.12" | |
FPC (roll to roll) maximum size | 19.68 ″*7874" | 19.68 ″*7874" | 19.68 ″*7874" | |
Maximum size of FPC single chip shipment | 19.68 ″*118.11" | 19.68 ″*196.8" | 19.68 ″*196.80" | |
| The layer number of FPC | 2～18 layer | 2～36 layer | 2～42 layer | |
Maximum size of layered board | 19.68 ″*35" | 19.68 ″*43" | 19.68 ″*43" | |
Number of through-hole layers | 2～20layer | 2～30 layer | 2～40 layer | |
Hard and soft HDI layers | 2～14 layer | 2～18 layer | 2～22 layer | |
Maximum size of soft and hard combination | 19.68 ″*43" | 19.68 ″*49" | 19.68 ″*49" | |
FPC/soft-hard combination arbitrary interconnection HDI | 4+X+4Interconnect HDI | 5+X+5Interconnect HDI | 6+X+6Interconnect HDI | |
HDIPCB layers | 4～36layer | 4～60layer | 4～80 layer | |
Anylayer HDI PCB | 4+X+4Interconnect HDI | 5+X+5、Interconnect HDI | 8+X+8、Interconnect HDI | |
HDIPCB maximum board size | 24"*52" | 43"*49" | 43"*49" | |
Number of through hole layers of high frequency board | 2～18 layer | 2～36 layer | 2～60 layer | |
| HDI layers ofhighfrequency board | 2～16 layer | 2～24 layer | 2～60layer | |
| Maximum size of high frequency board | 37 ″*43" | 43 ″*49" | 43 ″*49" | |
Number of ceramic plates | 1-2 layer | 1～4 layer | 1～6 layer | |
Ceramic plate thickness | 0.60mm-1.60mm | 0.38mm-20.0mm | 0.38mm-20.0mm | |
Maximum size of ceramic plate | 100*150mm | 150*190mm | 150*650mm | |
Minimum aperture of ceramic plate | 0.50mm | 0.35mm | 0.35mm | |
Minimum line width and line spacing of ceramic board | 16/16mil | 12/12mil | 10/10mil | |
Number of layers of metal copper substrate | 1-2 layer | 1～4 layer | 1～6 layer | |
Maximum line width and line spacing of metal iron substrate | 12/12mil | 4/4mil | 4/4mil | |
Number of layers of metal aluminum substrateHDI | 1-2 layer | 1～4 layer | 1～6 layer | |
Maximum size of metal substrate | 37 ″*43" | 25.59 ″*59" | 25.59 ″*59" | |
| The smallest hole of the metal substrate | 0.50mm | 0.35mm | 0.35mm | |
Minimum line width and line spacing of metal substrate | 8/8mil | 4/4mil | 4/4mil | |
| Transparent FR- 4 material layers | 1-2layer | 1-2layer | 1-8layer | |
| Transparent FR-4 minimum hole | 0.35mm | 0.35mm | 0.35mm | |
| Transparent FR-4 minimum line width and spacing | 4/4Mil | 4/4Mil | 3.5/3.5Mil | |
| Transparent FR- 4 maximum size | 23.63*47.25″ | 23.63*47.25 ″ | 23.63*47.25 ″ | |
| Number of tempered glass base layers | 1-2layer | 1-2layer | 1-2layer | |
| Minimum line width and spacing of glass | 4/4Mil | 4/4Mil | 3.5/3.5Mil | |
| The smallest hole in glass | 0.35mm | 0.35mm | 0.35mm | |
| Maximum size of glass | 23.63*47.25″ | 23.63*47.25 ″ | 23.63*47.25 ″ | |
| Number of layers of transparent PETmaterial | 1-2layer | 1-2layer | 1-2layer | |
| Maximum size of transparent PET | 19.68 ″*7874" | 19.68 ″*7874" | 19.68 ″*7874" | |
The company's main product types | Halogen free materials, high TG materials, high-frequency materials, high-speed materials, metal materials, glass materials, embedded materials, transparent FR- 4 materials, high thermal conductivity metals, high thermal conductivity aluminum substrates, environmentally friendly circuit boards, BT materials, ABF materials, and other imported materials, DU busbars, iron-based and metal based (core) mixed pressure plates, embedded buried copper, buried resistors, buried capacitors, buried ceramic bead plates, buried ceramics, ceramic mixed pressure plates, multi-layer ceramics, ultra-thin BT plates, ultra-thin PCBs, ultra-thin PCBs, multi-layer aluminum substrates, multi-layer ceramic plates, multi-layer ultra-thin HDI、 High frequency mixed voltage, differential impedance board, thick copper plate, gold-plated plate, high and low copper, high and low copper, high carbon resistance, transparent multilayer, glass plate, HDI arbitrary order (cross blind buried) Anylayer, flexible double-sided, flexible multilayer, soft hard combination HDI, roll to roll FPC, ultra long size, ultra large size board (single, double, multi-layer) PCB production and product design, product development, software development, etc | |||
| Main material | Rogers, Taikoni, Yaron, Mitsui, Isola, 3M, Taiyao, Taiguang, Tenghui, Shengyi,Lianmao, Nanya, Doosan, DuPont, Taihong, Hongren, Xinyang, Nippon Steel, Teflon,Yasen, Panasonic, RCC, Mitsui, Mitsubishi, Yingye, 3M, Kyocera, Jiuhao, Zhongci,Huaqing, Aishengda, Sliton, Kaichangde, Tongxin, Beige, Yalong, Taikoni,Hitachi, Laird System, etc | |||
Main material categories | Halogen-free、halogenated、 high thermal conductivity, high TG135 、TG140、 TG150、 TG170、TG180、TG240、TG320 | |||
| Build-up Material | FR-4 ，TG150,TG70,TG180 | |||
Conventional plate thickness (mm) | Min.1-2L(mm) | 0.10mm | 0.10-12.0mm | 0.10-18.0mm |
| Min.4-10L(mm) | 0.35mm | 0.35mm～10.0mm | 0.35-18.0mm | |
| Min.12L(mm) | 0.43 | 0.38～10.0mm | 0.38～18.0mm | |
| Min.16L(mm) | 0.53 | 0.45～10.0mm | 0.45～18.0mm | |
| Min.18L(mm) | 0.63 | 0.51～10.0mm | 0.51～18.0mm | |
| Min.52L(mm) | 0.8 | 0.65～10.0mm | 0.65～18.0mm | |
| MAX(mm) | 3.5 | 12.0mm | 18.0mm | |
Copper plate thickness and copper thickness | 1-2 layerCU | 700um | 875um | 875um |
| Layers 4-20 | 4-12layer | 4-16layer | 4-22layer | |
| Inner layer copper thickness（um) | 875um | 1050um | 1225um | |
Outercopperthickness | 210um | 350um | 525um | |
Thick copper finished plate thickness | 8.0mm | 12.0mm | 18.0mm | |
IC substrate | layerHDI | 1-10layer | 1-14layer | 1-16layer |
| Line width and spacing | 50um | 25um | 15um | |
| copper thickness | 8-10um | 10-12um | 12-15um | |
| Min.CoreThickness um(mil) | 254" (10.0) | 0.15～254(10.0mm) | 0.15～254(10.0mm) | |
| Min.Build up Dielectric | 38(1.5) | 25(1.0) | 25(1.0) | |
BaseCopperWeigh t | Inner Layer | 1/4-8 OZ | 1/4-0.30mm | 1/4-0.30mm |
| Out Layer | 1/4-10 OZ | 1/4-30 OZ | 1/4-30 OZ | |
| Gold thick | 1～40u" | 1～200u" | 1～200u" | |
| Nithick | 76～127u" | 1～250u" | 1～250u" | |
Min.HOle/Land um(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | |
Min.Laser via/landum(mil) | 60/170(2.4/6.8) | 50/150(2/6) | 50/150(2/6) | |
Min. IVH、Hole size/landum(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | |
| DieletricThickness | 38(1.5) | 32(1.3) | 32(1.3) | |
| 125(5) | 125(5) | 125(5) | ||
| SKipvia | Yes | Yes | Yes | |
| viaoNhie(laserviaon BuriedPTH) | Yes | Yes | Yes | |
| Laser Hole Filling | Yes | Yes | Yes | |
| Technicalltem | MassProduct | Advanced Technology | ||
| Hole depth/diameter | Through Hoie | 25:01 :00 | 35:01 :00 | 40:01 :00 |
| AspctRatio | MicroVia | 0.8 :1 | 0.8 :1 | 0.8 :1 |
| copperFilling Dimple Size | 10(0.40) | 5(0.20) | 5(0.20) | |
Minimumouter line width/ spacing | Inner layer line width and spacing | 38/38(1.5/1.5) | 38/38(1.5/1.5) | 38/38(1.5/1.5) |
PlatedLayerum(mil) | 38/38(1.5/1.5) | 38/38(1.5/1.5) | 38/38(1.5/1.5) | |
| BGAPitchmm(mil) | 0.4 | 0.4 | 0.4 | |
| PHMin.Hole rlng um(mil) | 75(3) | 62.50(2.50 | 62.50(2.50 | |
| Line Width control | <2.5mil(mil) | ±0.50 | ±0.50 | ±0.50 |
| 2.5mil≤L/W<4mil | ±0.50 | ±0.50 | ±0.50 | |
| ≤3mil(mil) | ±0.60 | ±0.60 | ±0.60 | |
| SolderMask Registration um(mil) | ±25 | ±25 | ±25 | |
| Solder masThickness | Lines Minum(mil) | 10(0.40) | 10(0.40) | 10(0.40) |
| Lines Minum(mil) | 30(1.20) | 30(1.20) | 30(1.20) | |
| CopperMinum(mil) | 10(0.40) | 10(0.40) | 10(0.40) | |
| CopperMax um(mil) | 30(1.20) | 30(1.20) | 30(1.20) | |
| Mln.Solder Mask opening um(mil) | 250(10) | 200(8) | 200(8) | |
Structure | Stacking layer by layer | 5+N+5 | 6+N+6 | 7+N+7 |
| Sequenetlal Bu il-up | 42Any Layer | 46Any Layer | 60Any Layer | |
| Stacking layer by layer | N+N | N+N | N+N | |
| N+X+N | N+X+N | N+X+N | ||
| Sequenetlal Lamination | 4+(N+X+N)+4 | 5+(N+X+N)+5 | 6+(N+X+N)+6 | |
Multi-layer stepped structure | Multi- layer stacking | 5+N+5 | 6+N+6 | 7+N+7 |
| Sequenetlal Bu il-up | 12Any Layer | 16Any Layer | 18Any Layer | |
| Multi- layer staircase | 4 steps | 6 steps | 6 steps | |
| Mechanical depth control drilling depth | 2.0mm±0.08mm | 2.0mm±0.08m | 2.0mm±0.08m | |
| Laser controlled depth drilling | 0.6mm±0.08mm | 0.8mm±0.08mm | 1.0mm±0.08mm | |
/Min.HOle/Land um(mil) | linner um(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) |
| Outer um(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | |
Minimumburiedholediameter/solder pad | 60/170(2.4/6.8) | 50/150(2/6) | 50/150(2/6) | |
SUBDielectricThic kness | Mln.um(mil) | 38(1.5) | 32(1.3) | 25(1.0) |
| Max.um(mil) | 125(5) | 125(5) | 125(5) | |
| SKipvia | Yes | Yes | Yes | |
| Via on hole(LaserViaon BuriePTH | Yes | Yes | Yes | |
| Laser Hole Filling | Yes | Yes | Yes | |
Resin plug hole plate thickness | Min mm(mil) | 0.35 | 0.35 | 0.35 |
| Max mm(mil) | 3.2 | 3.2 | 3.2 | |
| Min mm(mil) | 125(5) | 110(4.50) | 110(4.50) | |
| Routing Depth control Accuracy um(mil) | ±50um(mil) | ±50um(mil) | ±50um(mil) | |
| Outine NC Rcuting Tolerance um(mil) | 75(3) | 75(3) | 75(3) | |
Type of surface Finishing | OSP、 Sinking gold, lead-free tin, lead tin, electroplated gold fingers, electroplated gold (electroplated nickel hard gold, electroplated nickel soft gold), gold fingers+sinking gold, spray tin+gold fingers, OSP+electroplated gold, OSP+sinking gold, electroplated silver, electroplated silver, electroplated tin, gold coated silver, nickel free electroplated thick gold, nickel free electroplated thick silver, tin silver copper, OSP+gold fingers | |||
| EN Thickness Control(um) | >0.025-0.1um | >0.025-0.1um | >0.025-0.1um | |
| OSOSP Thickness(um) | >0.20-0.50um | >0.20-0.50um | >0.20-0.50um | |
| Ni Thickness(um) | >105⇢ 250um | >105⇢ 250um | >105⇢ 250um | |
| Platinum thickness control | >0.025-5um | >0.025-5um | >0.025-5um | |
| Lead/lead- free tin spraying thickness | >105⇢ 150um | >105⇢ 150um | >105⇢ 150um | |
| Electrosilver | >105⇢ 140um | >105⇢ 140um | >105⇢ 140um | |
| Thickness control of sinking silver | >105⇢ 140um | >105⇢ 140um | >105⇢ 140um | |
| Tin thickness control | >105⇢ 140um | >105⇢ 140um | >105⇢ 140um | |
Min TestPAD | E/Tum(mil) | 75(3) | 75(3) | 75(3) |
| E/Tum(mil) | 50(2) | 50(2) | 50(2) | |
| E/Tum(mil | 25(1) | 25(1) | 25(1) | |
| E/Tum(mil) | 150（6） | 150（6） | 150（6） | |
lmpedanceContro lTolerance | ≧50ohm | ± 10% | ±8% | ±8% |
| ≦50ohm | ±50ohm | ±50ohm | ±50ohm | |
| Finished board | Plate thickness≧0.15mm | ≧ ± 10% | ≧ ± 10% | ≧ ± 10% |
| Plate thickness≧0.15mm | ≧ ±0.075% | ≧ ±0.075% | ≧ ±0.075% | |
| Warpage | ≤0.7% | ≤0.5% | ≤0.5% | |
| The above are the conventional production skills of Chaosheng Group Company, and there are any unclear points. Please further communicate with our specialized technical personnel, and we will be happy to serve you! Welcome to our guide! | ||||
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✅ ** Large scale mass production: Chaosheng has a unique 3m × 1.24m production line that can produce ≥ 500 pieces per month, replacing multi board splicing and improving system stability.
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Product Name: Aerospace, Military, Nuclear, Unmanned Aerial Vehicle ProductsBoard: FR-4, TG150Layers: 18layer coil inductor multilayer board PCBMinimum line width/spacing: 8/8milFinished product size: 255x176mm/1 * 1pcsSurface technology: Sinking gold, green oilCopper thickness: Inner and outer layers of copper with a thickness of 175umPlate thickness: 3.50mmMinimum aperture: 0.35mm, laser hole/mm,Transport Package：Vacuum packaging+moisture-proof beads+separated white paper+cardboard box+wooden card boardFeatures: Difficulties such as dense inner and outer coilsUsage: Engine, electric motor, inductor, orange equipment, etc2-80 layers of rigid circuit boards, 2-50 layers of flexible circuit boards and PCBA productionChaosheng Group Company mainly produces product categoriesHigh end double-sided, multi-layer, flexible, high-frequency, HDI interconnect, metal based, high thermal conductivitymetal based, ceramic, cut in metal based, cut in buried capacitor, cut in thick copper buried magnet, concave convex step substrate, 5G high-speed board, thick copper, thick gold, high carbon resistance, double-sided multi-layerMiNiLED, MiNiHDILED, MiNiOLED, IC carrier substrate, roll to roll FPC, long FPC, large-sized printed circuit board,halogen-free material, high-frequency material, high-speed material, metal material, environmentally friendly circuit board, blind buried hole circuit board, high thermal conductivity aluminum based, thermoelectric separation copper based, PDU busbar, iron-based and metal based (core) mixed pressure plate, embedded copper buried copper. Buried resistance buried capacitance buried ceramic bead board, ultra-thin BT board, ceramic substrate, IC carrier board,high-frequency mixed voltage, high-speed board, differential impedance board, thick copper plate, thick gold platedboard, HDI An integrated OEM and ODM production factory for Anylayer, double-sided, multi-layer, HDI FPC, softhard combination HDI, roll to roll FPC, ultra long FPC, ultra large size PCB production and product design and development, software development, special material printed circuit boards, etc. Process Capability TableTechnical ltemMassProductAdvanced Technology2015 2021 2025 Max.Layer Count80 layer100 layer100 layerPCB through hole board2～80 layer2～100 layer2～100 layerMaximum size through hole 1～237〞*98.50"43.3〞*118.11"43.3〞*118.11"Minimum line width and spacing10(0.40)10(0.40)7.50（0.30mm）Minimum mechanicalhole(mm)12(0.50)10(0.40)8.50（0.35mm）Maximum size through hole 4～22layers37〞*43.30"43.3〞*43.30"43.3〞*43.30"Maximum size through hole 4～22layers31.50 ″*59"31.50 ″*70.86"31.50 ″*70.86"Maximum size through hole 4～22layers10(0.40)10(0.40)7.50（0.30mm）Minimum line width and spacing formulti-layer large-sized PCBs10(0.40)10(0.40)7.50（0.30mm）Maximum size of multi-layer through-hole : 4-22 layers with the smallesthole12(0.50)10(0.40)8.50（0.35mm）Maximum size HDI 4～36 layers31.50 ″*55"31.50 ″*55"31.50 ″*55"Minimum line width and linespacing of large size PCBThrough hole 12 /12milHDI14 /14milThrough hole 10/10milHDI12 / 12milThrough hole 8 /8milHDI12 / 12milThe largest board ruler 1 → thesmallest hole of 18 layersThrough hole0.50mmHDI :0.45mmThrough hole 0.50mmHDI : 0.45mmThrough hole0.50mmHDI : 0.45mmThe layer number of FPC1～36layer1～60layer1～60layerMaximum size offlexible FPC19.68〞*55"28〞*59"31.49〞*118.12"Maximumsize of flexible FPC with soft hardcombination19.68〞*55"28〞*59"31.49〞*118.12"FPC (roll to roll) maximum size19.68 ″*7874"19.68 ″*7874"19.68 ″*7874"Maximum size of FPC single chipshipment19.68 ″*118.11"19.68 ″*196.8"19.68 ″*196.80"The layer number of FPC2～18 layer2～36 layer2～42 layerMaximum size of layered board19.68 ″*35"19.68 ″*43"19.68 ″*43"Number of through-hole layers2～20layer2～30 layer2～40 layerHard and soft HDI layers2～14 layer2～18 layer2～22 layerMaximum size of soft and hardcombination19.68 ″*43"19.68 ″*49"19.68 ″*49"FPC/soft-hard combinationarbitrary interconnection HDI4+X+4InterconnectHDI5+X+5Interconnect HDI6+X+6InterconnectHDIHDIPCB layers4～36layer4～60layer4～80 layerAnylayer HDI PCB4+X+4InterconnectHDI5+X+5、Interconnect HDI8+X+8、InterconnectHDIHDIPCB maximum board size24"*52"43"*49"43"*49"Number of through hole layers ofhigh frequency board2～18 layer2～36 layer2～60 layerHDI layersofhighfrequency board2～16 layer2～24 layer2～60layerMaximum size ofhigh frequency board37 ″*43"43 ″*49"43 ″*49"Number of ceramic plates1-2 layer1～4 layer1～6 layerCeramic plate thickness0.60mm-1.60mm0.38mm-20.0mm0.38mm-20.0mmMaximum size of ceramic plate100*150mm150*190mm150*650mmMinimum aperture of ceramicplate0.50mm0.35mm0.35mmMinimum line width and linespacing of ceramic board16/16mil12/12mil10/10milNumber of layers of metalcopper substrate1-2 layer1～4 layer1～6 layerMaximum line width and linespacing of metal iron substrate12/12mil4/4mil4/4milNumber of layers of metalaluminum substrateHDI1-2 layer1～4 layer1～6 layerMaximum size of metal substrate37 ″*43"25.59 ″*59"25.59 ″*59"The smallest hole ofthe metal substrate0.50mm0.35mm0
64 layer thick copper coil plate technology
Product Name: Aerospace, Military, Nuclear, Unmanned Aerial Vehicle ProductsBoard: FR-4, TG150Layers: 64 layer coil inductor multilayer board PCBMinimum line width/spacing: 8/8milFinished product size: 301x301mm/1 * 1pcsSurface technology: Sinking gold, green oilCopper thickness: 105um for inner and outer layersPlate thickness: 5.5mmMinimum aperture: 3.5mm, laser hole/mm,Features: Difficulties such as dense inner and outer coilsUsage: Engine, electric motor, inductor, orange equipment, etcFirstly, from the perspective of the company's own technological strength, Chaosheng clearly has the ability to produce high multi-layer circuit boards, with its product range covering 2-80 layers of precision multi-layer circuit boards.At the same time, Chaosheng also has imported fully automated precision equipment production lines and a sound quality management system. It has passed multiple quality system certifications such as UL and ISO9001 in the United States, which has laid the foundation for its production of 64 layer and other ultra-high multi-layer circuit boards. Secondly, from the perspective of product characteristics, the product adopts a design that combines blind grooves and depth control grooves, combined with metal edging. The middle part has been treated with immersion gold, which not only improves corrosion resistance but also enhances stability.It is speculated that a 64 layer inductor coil metal wrapped circuit board may also use a similar design to meet the needs of multi-layer and different thickness circuit fabrication.At the same time, metal edging can effectively shield electromagnetic radiation, further enhancing signal integrity and circuit stability. Finally, for the part of the inductor coil, precise control of the inductance value may be achieved through special layout design of the coil and optimized via settings, in order to meet specific electrical performance requirements of the product. A multi-layer coil PCB (Printed Circuit Board) refers to a type of circuit board that consists of multiple layers of conductive material, separated by insulating layers, and is often used for applications requiring compact designs, such as RF (radio frequency) coils, inductors, transformers, and other electromagnetic components.### Key Features of Multi-Layer Coil PCBs:1. **Layer Structure**: - Multi-layer PCBs typically consist of three or more layers. The inner layers can be used for routing power and ground, while the outer layers can be utilized for signal routing and component placement.2. **Coil Design**: - The coils can be designed in various configurations, such as solenoids, toroids, or planar coils, depending on the application. The design may include various winding techniques and geometries to optimize inductance and performance.3. **Material**: - Common materials used for multi-layer PCBs include FR-4 (a type of fiberglass epoxy), Rogers materials (for high-frequency applications), and other specialized materials that can handle specific thermal or electrical requirements.4. **Impedance Control**: - For RF applications, controlling the impedance of the coil is crucial. Multi-layer designs can help maintain consistent impedance across the PCB by using specific layer stack-ups and trace widths.5. **Thermal Management**: - Multi-layer PCBs can help dissipate heat more effectively than single-layer designs. Proper thermal management is essential in coil applications, especially when dealing with high currents.6. **Manufacturing Process**: - The fabrication of multi-layer PCBs involves several steps, including layer alignment, lamination, drilling, plating, and etching. Advanced techniques such as laser drilling and via filling may be employed to create vias and interconnections.7. **Applications**: - Multi-layer coil PCBs are used in various applications, including: - RF and microwave devices - Wireless charging systems - Inductive sensors - Power amplifiers - Communication devices### Design Considerations:1. **Simulation**: - Using simulation software (like HFSS, CST, or other electromagnetic simulation tools) to model the coil's behavior can help in optimizing its design before fabrication.2. **Manufacturing Tolerances**: - Ensure that the PCB manufacturer can meet the necessary tolerances for the coil's dimensions and layer alignment to achieve the desired performance.3. **Testing and Prototyping**: - Prototyping the design and conducting tests (like S-parameter testing) is essential to validate performance and make any necessary adjustments.4. **Cost**: - Multi-layer PCBs can be more expensive than single-layer boards due to the complexity of manufacturing and the materials used. Balancing performance requirements with cost considerations is crucial.5. **Stack-Up Design**: - Carefully planning the stack-up of the PCB layers is important to achieve the desired electrical performance and to minimize issues like crosstalk and electromagnetic interfe
The following is a detailed introduction about "PET carbon wire pseudo double-layer flexible FPC"
Transparent PCB, transparent flexible FPC
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Transparent PCB, transparent flexible FPC
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Detailed Introduction to Transparent FR-4 Multilayer PCB
Transparent PCB, transparent flexible FPC
Transparent FR-4PCB, double-layer transparent circuit board PCB, multi-layer transparent FR-4 circuit board, ultra large size transparent PCB, ultra large size transparent circuit board PCB
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