64 layer thick copper coil plate technology
Product Name: Aerospace, Military, Nuclear, Unmanned Aerial Vehicle ProductsBoard: FR-4, TG150Layers: 64 layer coil inductor multilayer board PCBMinimum line width/spacing: 8/8milFinished product size: 301x301mm/1 * 1pcsSurface technology: Sinking gold, green oilCopper thickness: 105um for inner and outer layersPlate thickness: 5.5mmMinimum aperture: 3.5mm, laser hole/mm,Features: Difficulties such as dense inner and outer coilsUsage: Engine, electric motor, inductor, orange equipment, etcFirstly, from the perspective of the company's own technological strength, Chaosheng clearly has the ability to produce high multi-layer circuit boards, with its product range covering 2-80 layers of precision multi-layer circuit boards.At the same time, Chaosheng also has imported fully automated precision equipment production lines and a sound quality management system. It has passed multiple quality system certifications such as UL and ISO9001 in the United States, which has laid the foundation for its production of 64 layer and other ultra-high multi-layer circuit boards. Secondly, from the perspective of product characteristics, the product adopts a design that combines blind grooves and depth control grooves, combined with metal edging. The middle part has been treated with immersion gold, which not only improves corrosion resistance but also enhances stability.It is speculated that a 64 layer inductor coil metal wrapped circuit board may also use a similar design to meet the needs of multi-layer and different thickness circuit fabrication.At the same time, metal edging can effectively shield electromagnetic radiation, further enhancing signal integrity and circuit stability. Finally, for the part of the inductor coil, precise control of the inductance value may be achieved through special layout design of the coil and optimized via settings, in order to meet specific electrical performance requirements of the product. A multi-layer coil PCB (Printed Circuit Board) refers to a type of circuit board that consists of multiple layers of conductive material, separated by insulating layers, and is often used for applications requiring compact designs, such as RF (radio frequency) coils, inductors, transformers, and other electromagnetic components.### Key Features of Multi-Layer Coil PCBs:1. **Layer Structure**: - Multi-layer PCBs typically consist of three or more layers. The inner layers can be used for routing power and ground, while the outer layers can be utilized for signal routing and component placement.2. **Coil Design**: - The coils can be designed in various configurations, such as solenoids, toroids, or planar coils, depending on the application. The design may include various winding techniques and geometries to optimize inductance and performance.3. **Material**: - Common materials used for multi-layer PCBs include FR-4 (a type of fiberglass epoxy), Rogers materials (for high-frequency applications), and other specialized materials that can handle specific thermal or electrical requirements.4. **Impedance Control**: - For RF applications, controlling the impedance of the coil is crucial. Multi-layer designs can help maintain consistent impedance across the PCB by using specific layer stack-ups and trace widths.5. **Thermal Management**: - Multi-layer PCBs can help dissipate heat more effectively than single-layer designs. Proper thermal management is essential in coil applications, especially when dealing with high currents.6. **Manufacturing Process**: - The fabrication of multi-layer PCBs involves several steps, including layer alignment, lamination, drilling, plating, and etching. Advanced techniques such as laser drilling and via filling may be employed to create vias and interconnections.7. **Applications**: - Multi-layer coil PCBs are used in various applications, including: - RF and microwave devices - Wireless charging systems - Inductive sensors - Power amplifiers - Communication devices### Design Considerations:1. **Simulation**: - Using simulation software (like HFSS, CST, or other electromagnetic simulation tools) to model the coil's behavior can help in optimizing its design before fabrication.2. **Manufacturing Tolerances**: - Ensure that the PCB manufacturer can meet the necessary tolerances for the coil's dimensions and layer alignment to achieve the desired performance.3. **Testing and Prototyping**: - Prototyping the design and conducting tests (like S-parameter testing) is essential to validate performance and make any necessary adjustments.4. **Cost**: - Multi-layer PCBs can be more expensive than single-layer boards due to the complexity of manufacturing and the materials used. Balancing performance requirements with cost considerations is crucial.5. **Stack-Up Design**: - Carefully planning the stack-up of the PCB layers is important to achieve the desired electrical performance and to minimize issues like crosstalk and electromagnetic interfe
key word:
Product Description
Product Name: Aerospace, Military, Nuclear, Unmanned Aerial Vehicle Products
Board: FR-4, TG150
Layers: 64 layer coil inductor multilayer board PCB
Minimum line width/spacing: 8/8mil
Finished product size: 301x301mm/1 * 1pcs
Surface technology: Sinking gold, green oil
Copper thickness: 105um for inner and outer layers
Plate thickness: 5.5mm
Minimum aperture: 3.5mm, laser hole/mm,
Features: Difficulties such as dense inner and outer coils
Usage: Engine, electric motor, inductor, orange equipment, etc
Firstly, from the perspective of the company's own technological strength, Chaosheng clearly has the ability to produce high multi-layer circuit boards, with its product range covering 2-80 layers of precision multi-layer circuit boards.
At the same time, Chaosheng also has imported fully automated precision equipment production lines and a sound quality management system. It has passed multiple quality system certifications such as UL and ISO9001 in the United States, which has laid the foundation for its production of 64 layer and other ultra-high multi-layer circuit boards. Secondly, from the perspective of product characteristics, the product adopts a design that combines blind grooves and depth control grooves, combined with metal edging. The middle part has been treated with immersion gold, which not only improves corrosion resistance but also enhances stability.
It is speculated that a 64 layer inductor coil metal wrapped circuit board may also use a similar design to meet the needs of multi-layer and different thickness circuit fabrication.
At the same time, metal edging can effectively shield electromagnetic radiation, further enhancing signal integrity and circuit stability. Finally, for the part of the inductor coil, precise control of the inductance value may be achieved through special layout design of the coil and optimized via settings, in order to meet specific electrical performance requirements of the product.
A multi-layer coil PCB (Printed Circuit Board) refers to a type of circuit board that consists of multiple layers of conductive material, separated by insulating layers, and is often used for applications requiring compact designs, such as RF (radio frequency) coils, inductors, transformers, and other electromagnetic components.
### Key Features of Multi-Layer Coil PCBs:
1. **Layer Structure**:
- Multi-layer PCBs typically consist of three or more layers. The inner layers can be used for routing power and ground, while the outer layers can be utilized for signal routing and component placement.
2. **Coil Design**:
- The coils can be designed in various configurations, such as solenoids, toroids, or planar coils, depending on the application. The design may include various winding techniques and geometries to optimize inductance and performance.
3. **Material**:
- Common materials used for multi-layer PCBs include FR-4 (a type of fiberglass epoxy), Rogers materials (for high-frequency applications), and other specialized materials that can handle specific thermal or electrical requirements.
4. **Impedance Control**:
- For RF applications, controlling the impedance of the coil is crucial. Multi-layer designs can help maintain consistent impedance across the PCB by using specific layer stack-ups and trace widths.
5. **Thermal Management**:
- Multi-layer PCBs can help dissipate heat more effectively than single-layer designs. Proper thermal management is essential in coil applications, especially when dealing with high currents.
6. **Manufacturing Process**:
- The fabrication of multi-layer PCBs involves several steps, including layer alignment, lamination, drilling, plating, and etching. Advanced techniques such as laser drilling and via filling may be employed to create vias and interconnections.
7. **Applications**:
- Multi-layer coil PCBs are used in various applications, including:
- RF and microwave devices
- Wireless charging systems
- Inductive sensors
- Power amplifiers
- Communication devices
### Design Considerations:
1. **Simulation**:
- Using simulation software (like HFSS, CST, or other electromagnetic simulation tools) to model the coil's behavior can help in optimizing its design before fabrication.
2. **Manufacturing Tolerances**:
- Ensure that the PCB manufacturer can meet the necessary tolerances for the coil's dimensions and layer alignment to achieve the desired performance.
3. **Testing and Prototyping**:
- Prototyping the design and conducting tests (like S-parameter testing) is essential to validate performance and make any necessary adjustments.
4. **Cost**:
- Multi-layer PCBs can be more expensive than single-layer boards due to the complexity of manufacturing and the materials used. Balancing performance requirements with cost considerations is crucial.
5. **Stack-Up Design**:
- Carefully planning the stack-up of the PCB layers is important to achieve the desired electrical performance and to minimize issues like crosstalk and electromagnetic interference (EMI).
### Conclusion:
Multi-layer coil PCBs are a versatile solution for many high-frequency and compact electronic applications. Their design and manufacturing require careful consideration of electrical, thermal, and mechanical factors to ensure optimal performance in their intended applications.
In addition to the technical advancements and product characteristics mentioned, it is essential to highlight the potential applications and market implications of the 64-layer thick copper coil plate technology developed by Chaosheng. As industries increasingly move towards miniaturization and higher performance in electronic devices, the demand for advanced circuit board technologies is surging. The ability to produce multi-layer circuit boards with enhanced inductive capabilities positions Chaosheng as a key player in various sectors, including telecommunications, automotive electronics, and consumer electronics. The high layer count allows for more complex circuitry, which is vital for modern applications such as high-frequency signal processing and power management systems. Furthermore, the integration of metal wrapped technology not only improves thermal management but also contributes to reduced electromagnetic interference, making these circuit boards ideal for use in sensitive electronic environments. As the Internet of Things (IoT) and smart devices continue to proliferate, the need for reliable and efficient circuit solutions will only grow. Consequently, Chaosheng's innovations in 64-layer thick copper coil plate technology not only enhance their product offerings but also align with the future trends of the electronics industry, potentially leading to strategic partnerships and increased market share in the coming years.
| FAQ | |||
| Serial Number | Question Point | Answer | |
| Q1 | Q: What information is required to make a PCB | CEGSATE: Gberber files for PCB production, product process instructions, such as material requirements, surface treatment requirements, finished product thickness requirements, PCB stack structure diagram for advanced products, copper thickness requirements for each layer, sample quantity requirements, batch order requirements, product application fields, and other related information are required | |
| Q2 | Q: What information does PCBA need to provide | CEGSATE: BOM report is required (including the brand, specifications, and model of the components), X and Y coordinate numbers of PCBA components, and processing requirements: Do we need to purchase the components on our behalf? Or customer supplied components? Do you need software burning? What is the required quantity? What is the monthly demand and other detailed information. | |
| Q3 | Question: Is my file secure? | CEGSATE: Your files are very secure, and we protect intellectual property rights for our clients throughout the entire process. All files provided by the customer will never be shared with any third party. | |
| Q4 | Q: What is the minimum order quantity? | CESGATE: We do not have a minimum order quantity for PO orders. We are able to handle small and large batches flexibly. | |
| Q5 | Q: What is your inspection method? How do you control the quality? | CESGATE: In order to ensure the quality of PCB, FPC, and PCBA products, we use flying pin testing for small batches, which is usually used for samples and small batches; The inner circuit undergoes 100% optical inspection through AOI, and we have online AOI automatic inspection for intermediate inspection. Batch finished products undergo 100% inspection through E-SET testing rack. The appearance is 100% inspected by fully automated finished product testing equipment and FQC. PCBA undergoes automatic optical inspection (AOI), 100% X-ray inspection of BGA parts, and first article inspection (FAI). PCBA products that require software burning must undergo 100% comprehensive testing on the finished product testing rack according to product functional requirements before they can be shipped. | |
| Q6 | Q: What standard should PCB be shipped according to? | WCESGATE: e accept and store according to the international IPC-6012 Level 2 standard. If there are special requirements for Level 3 standards in the quotation, we accept and store according to the international IPC-6012 Level 3 standardWe accept and store according to the international IPC-6012 Level 2 standard. If there are special requirements for Level 3 standards in the quotation, we accept and store according to the international IPC-6012 Level 3 standard | |
| Q7 | Q: May I ask how you package and ship? | 1：PCBVacuum packaging+separated white paper+moisture-proof beads+cardboard box 2：PCBVacuum packaging+white paper insulation+moisture-proof beads+tin vacuum packaging+cardboard box 3：PCBSpecial size PCB, vacuum packaging+separated white paper+moisture-proof beads+wooden frame or plastic bag packaging+separated white paper+moisture-proof beads+wooden frame 4: PCBA anti-static packaging 5: PCBA anti-static film+vacuum box packaging+shelving | |
 Process Capability Table | ||||
| Technical ltem | MassProduct | Advanced Technology | ||
| 2015 | 2021 | 2025 | ||
| Max.Layer Count | 80 layer | 100 layer | 100 layer | |
PCB through hole board | 2～80 layer | 2～100 layer | 2～100 layer | |
Maximum size through hole 1～2 | 37〞*98.50" | 43.3〞*118.11" | 43.3〞*118.11" | |
Minimum line width and spacing | 10(0.40) | 10(0.40) | 7.50（0.30mm） | |
| Minimum mechanical hole(mm) | 12(0.50) | 10(0.40) | 8.50（0.35mm） | |
Maximum size through hole 4～22 layers | 37〞*43.30" | 43.3〞*43.30" | 43.3〞*43.30" | |
Maximum size through hole 4～22 layers | 31.50 ″*59" | 31.50 ″*70.86" | 31.50 ″*70.86" | |
Maximum size through hole 4～22 layers | 10(0.40) | 10(0.40) | 7.50（0.30mm） | |
| Minimum line width and spacing for multi-layer large-sized PCBs | 10(0.40) | 10(0.40) | 7.50（0.30mm） | |
Maximum size of multi-layer through- hole : 4-22 layers with the smallest hole | 12(0.50) | 10(0.40) | 8.50（0.35mm） | |
| Maximum size HDI 4～36 layers | 31.50 ″*55" | 31.50 ″*55" | 31.50 ″*55" | |
| Minimum line width and line spacing of large size PCB | Through hole 12 / 12milHDI14 /14mil | Through hole 10/10 milHDI12 / 12mil | Through hole 8 / 8milHDI12 / 12mil | |
| The largest board ruler 1 → the smallest hole of 18 layers | Through hole 0.50mmHDI :0.45mm | Through hole 0.50mm HDI : 0.45mm | Through hole 0.50mmHDI : 0.45mm | |
| The layer number of FPC | 1～36layer | 1～60layer | 1～60layer | |
| Maximum size of flexible FPC | 19.68〞*55" | 28〞*59" | 31.49〞*118.12" | |
| Maximum size of flexible FPC with soft hard combination | 19.68〞*55" | 28〞*59" | 31.49〞*118.12" | |
FPC (roll to roll) maximum size | 19.68 ″*7874" | 19.68 ″*7874" | 19.68 ″*7874" | |
Maximum size of FPC single chip shipment | 19.68 ″*118.11" | 19.68 ″*196.8" | 19.68 ″*196.80" | |
| The layer number of FPC | 2～18 layer | 2～36 layer | 2～42 layer | |
Maximum size of layered board | 19.68 ″*35" | 19.68 ″*43" | 19.68 ″*43" | |
Number of through-hole layers | 2～20layer | 2～30 layer | 2～40 layer | |
Hard and soft HDI layers | 2～14 layer | 2～18 layer | 2～22 layer | |
Maximum size of soft and hard combination | 19.68 ″*43" | 19.68 ″*49" | 19.68 ″*49" | |
FPC/soft-hard combination arbitrary interconnection HDI | 4+X+4Interconnect HDI | 5+X+5Interconnect HDI | 6+X+6Interconnect HDI | |
HDIPCB layers | 4～36layer | 4～60layer | 4～80 layer | |
Anylayer HDI PCB | 4+X+4Interconnect HDI | 5+X+5、Interconnect HDI | 8+X+8、Interconnect HDI | |
HDIPCB maximum board size | 24"*52" | 43"*49" | 43"*49" | |
Number of through hole layers of high frequency board | 2～18 layer | 2～36 layer | 2～60 layer | |
| HDI layers ofhighfrequency board | 2～16 layer | 2～24 layer | 2～60layer | |
| Maximum size of high frequency board | 37 ″*43" | 43 ″*49" | 43 ″*49" | |
Number of ceramic plates | 1-2 layer | 1～4 layer | 1～6 layer | |
Ceramic plate thickness | 0.60mm-1.60mm | 0.38mm-20.0mm | 0.38mm-20.0mm | |
Maximum size of ceramic plate | 100*150mm | 150*190mm | 150*650mm | |
Minimum aperture of ceramic plate | 0.50mm | 0.35mm | 0.35mm | |
Minimum line width and line spacing of ceramic board | 16/16mil | 12/12mil | 10/10mil | |
Number of layers of metal copper substrate | 1-2 layer | 1～4 layer | 1～6 layer | |
Maximum line width and line spacing of metal iron substrate | 12/12mil | 4/4mil | 4/4mil | |
Number of layers of metal aluminum substrateHDI | 1-2 layer | 1～4 layer | 1～6 layer | |
Maximum size of metal substrate | 37 ″*43" | 25.59 ″*59" | 25.59 ″*59" | |
| The smallest hole of the metal substrate | 0.50mm | 0.35mm | 0.35mm | |
Minimum line width and line spacing of metal substrate | 8/8mil | 4/4mil | 4/4mil | |
| Transparent FR- 4 material layers | 1-2layer | 1-2layer | 1-8layer | |
| Transparent FR-4 minimum hole | 0.35mm | 0.35mm | 0.35mm | |
| Transparent FR-4 minimum line width and spacing | 4/4Mil | 4/4Mil | 3.5/3.5Mil | |
| Transparent FR- 4 maximum size | 23.63*47.25″ | 23.63*47.25 ″ | 23.63*47.25 ″ | |
| Number of tempered glass base layers | 1-2layer | 1-2layer | 1-2layer | |
| Minimum line width and spacing of glass | 4/4Mil | 4/4Mil | 3.5/3.5Mil | |
| The smallest hole in glass | 0.35mm | 0.35mm | 0.35mm | |
| Maximum size of glass | 23.63*47.25″ | 23.63*47.25 ″ | 23.63*47.25 ″ | |
| Number of layers of transparent PETmaterial | 1-2layer | 1-2layer | 1-2layer | |
| Maximum size of transparent PET | 19.68 ″*7874" | 19.68 ″*7874" | 19.68 ″*7874" | |
The company's main product types | Halogen free materials, high TG materials, high-frequency materials, high-speed materials, metal materials, glass materials, embedded materials, transparent FR- 4 materials, high thermal conductivity metals, high thermal conductivity aluminum substrates, environmentally friendly circuit boards, BT materials, ABF materials, and other imported materials, DU busbars, iron-based and metal based (core) mixed pressure plates, embedded buried copper, buried resistors, buried capacitors, buried ceramic bead plates, buried ceramics, ceramic mixed pressure plates, multi-layer ceramics, ultra-thin BT plates, ultra-thin PCBs, ultra-thin PCBs, multi-layer aluminum substrates, multi-layer ceramic plates, multi-layer ultra-thin HDI、 High frequency mixed voltage, differential impedance board, thick copper plate, gold-plated plate, high and low copper, high and low copper, high carbon resistance, transparent multilayer, glass plate, HDI arbitrary order (cross blind buried) Anylayer, flexible double-sided, flexible multilayer, soft hard combination HDI, roll to roll FPC, ultra long size, ultra large size board (single, double, multi-layer) PCB production and product design, product development, software development, etc | |||
| Main material | Rogers, Taikoni, Yaron, Mitsui, Isola, 3M, Taiyao, Taiguang, Tenghui, Shengyi,Lianmao, Nanya, Doosan, DuPont, Taihong, Hongren, Xinyang, Nippon Steel, Teflon,Yasen, Panasonic, RCC, Mitsui, Mitsubishi, Yingye, 3M, Kyocera, Jiuhao, Zhongci,Huaqing, Aishengda, Sliton, Kaichangde, Tongxin, Beige, Yalong, Taikoni,Hitachi, Laird System, etc | |||
Main material categories | Halogen-free、halogenated、 high thermal conductivity, high TG135 、TG140、 TG150、 TG170、TG180、TG240、TG320 | |||
| Build-up Material | FR-4 ，TG150,TG70,TG180 | |||
Conventional plate thickness (mm) | Min.1-2L(mm) | 0.10mm | 0.10-12.0mm | 0.10-18.0mm |
| Min.4-10L(mm) | 0.35mm | 0.35mm～10.0mm | 0.35-18.0mm | |
| Min.12L(mm) | 0.43 | 0.38～10.0mm | 0.38～18.0mm | |
| Min.16L(mm) | 0.53 | 0.45～10.0mm | 0.45～18.0mm | |
| Min.18L(mm) | 0.63 | 0.51～10.0mm | 0.51～18.0mm | |
| Min.52L(mm) | 0.8 | 0.65～10.0mm | 0.65～18.0mm | |
| MAX(mm) | 3.5 | 12.0mm | 18.0mm | |
Copper plate thickness and copper thickness | 1-2 layerCU | 700um | 875um | 875um |
| Layers 4-20 | 4-12layer | 4-16layer | 4-22layer | |
| Inner layer copper thickness（um) | 875um | 1050um | 1225um | |
Outercopperthickness | 210um | 350um | 525um | |
Thick copper finished plate thickness | 8.0mm | 12.0mm | 18.0mm | |
IC substrate | layerHDI | 1-10layer | 1-14layer | 1-16layer |
| Line width and spacing | 50um | 25um | 15um | |
| copper thickness | 8-10um | 10-12um | 12-15um | |
| Min.CoreThickness um(mil) | 254" (10.0) | 0.15～254(10.0mm) | 0.15～254(10.0mm) | |
| Min.Build up Dielectric | 38(1.5) | 25(1.0) | 25(1.0) | |
BaseCopperWeigh t | Inner Layer | 1/4-8 OZ | 1/4-0.30mm | 1/4-0.30mm |
| Out Layer | 1/4-10 OZ | 1/4-30 OZ | 1/4-30 OZ | |
| Gold thick | 1～40u" | 1～200u" | 1～200u" | |
| Nithick | 76～127u" | 1～250u" | 1～250u" | |
Min.HOle/Land um(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | |
Min.Laser via/landum(mil) | 60/170(2.4/6.8) | 50/150(2/6) | 50/150(2/6) | |
Min. IVH、Hole size/landum(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | |
| DieletricThickness | 38(1.5) | 32(1.3) | 32(1.3) | |
| 125(5) | 125(5) | 125(5) | ||
| SKipvia | Yes | Yes | Yes | |
| viaoNhie(laserviaon BuriedPTH) | Yes | Yes | Yes | |
| Laser Hole Filling | Yes | Yes | Yes | |
| Technicalltem | MassProduct | Advanced Technology | ||
| Hole depth/diameter | Through Hoie | 25:01 :00 | 35:01 :00 | 40:01 :00 |
| AspctRatio | MicroVia | 0.8 :1 | 0.8 :1 | 0.8 :1 |
| copperFilling Dimple Size | 10(0.40) | 5(0.20) | 5(0.20) | |
Minimumouter line width/ spacing | Inner layer line width and spacing | 38/38(1.5/1.5) | 38/38(1.5/1.5) | 38/38(1.5/1.5) |
PlatedLayerum(mil) | 38/38(1.5/1.5) | 38/38(1.5/1.5) | 38/38(1.5/1.5) | |
| BGAPitchmm(mil) | 0.4 | 0.4 | 0.4 | |
| PHMin.Hole rlng um(mil) | 75(3) | 62.50(2.50 | 62.50(2.50 | |
| Line Width control | <2.5mil(mil) | ±0.50 | ±0.50 | ±0.50 |
| 2.5mil≤L/W<4mil | ±0.50 | ±0.50 | ±0.50 | |
| ≤3mil(mil) | ±0.60 | ±0.60 | ±0.60 | |
| SolderMask Registration um(mil) | ±25 | ±25 | ±25 | |
| Solder masThickness | Lines Minum(mil) | 10(0.40) | 10(0.40) | 10(0.40) |
| Lines Minum(mil) | 30(1.20) | 30(1.20) | 30(1.20) | |
| CopperMinum(mil) | 10(0.40) | 10(0.40) | 10(0.40) | |
| CopperMax um(mil) | 30(1.20) | 30(1.20) | 30(1.20) | |
| Mln.Solder Mask opening um(mil) | 250(10) | 200(8) | 200(8) | |
Structure | Stacking layer by layer | 5+N+5 | 6+N+6 | 7+N+7 |
| Sequenetlal Bu il-up | 42Any Layer | 46Any Layer | 60Any Layer | |
| Stacking layer by layer | N+N | N+N | N+N | |
| N+X+N | N+X+N | N+X+N | ||
| Sequenetlal Lamination | 4+(N+X+N)+4 | 5+(N+X+N)+5 | 6+(N+X+N)+6 | |
Multi-layer stepped structure | Multi- layer stacking | 5+N+5 | 6+N+6 | 7+N+7 |
| Sequenetlal Bu il-up | 12Any Layer | 16Any Layer | 18Any Layer | |
| Multi- layer staircase | 4 steps | 6 steps | 6 steps | |
| Mechanical depth control drilling depth | 2.0mm±0.08mm | 2.0mm±0.08m | 2.0mm±0.08m | |
| Laser controlled depth drilling | 0.6mm±0.08mm | 0.8mm±0.08mm | 1.0mm±0.08mm | |
/Min.HOle/Land um(mil) | linner um(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) |
| Outer um(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | |
Minimumburiedholediameter/solder pad | 60/170(2.4/6.8) | 50/150(2/6) | 50/150(2/6) | |
SUBDielectricThic kness | Mln.um(mil) | 38(1.5) | 32(1.3) | 25(1.0) |
| Max.um(mil) | 125(5) | 125(5) | 125(5) | |
| SKipvia | Yes | Yes | Yes | |
| Via on hole(LaserViaon BuriePTH | Yes | Yes | Yes | |
| Laser Hole Filling | Yes | Yes | Yes | |
Resin plug hole plate thickness | Min mm(mil) | 0.35 | 0.35 | 0.35 |
| Max mm(mil) | 3.2 | 3.2 | 3.2 | |
| Min mm(mil) | 125(5) | 110(4.50) | 110(4.50) | |
| Routing Depth control Accuracy um(mil) | ±50um(mil) | ±50um(mil) | ±50um(mil) | |
| Outine NC Rcuting Tolerance um(mil) | 75(3) | 75(3) | 75(3) | |
Type of surface Finishing | OSP、 Sinking gold, lead-free tin, lead tin, electroplated gold fingers, electroplated gold (electroplated nickel hard gold, electroplated nickel soft gold), gold fingers+sinking gold, spray tin+gold fingers, OSP+electroplated gold, OSP+sinking gold, electroplated silver, electroplated silver, electroplated tin, gold coated silver, nickel free electroplated thick gold, nickel free electroplated thick silver, tin silver copper, OSP+gold fingers | |||
| EN Thickness Control(um) | >0.025-0.1um | >0.025-0.1um | >0.025-0.1um | |
| OSOSP Thickness(um) | >0.20-0.50um | >0.20-0.50um | >0.20-0.50um | |
| Ni Thickness(um) | >105⇢ 250um | >105⇢ 250um | >105⇢ 250um | |
| Platinum thickness control | >0.025-5um | >0.025-5um | >0.025-5um | |
| Lead/lead- free tin spraying thickness | >105⇢ 150um | >105⇢ 150um | >105⇢ 150um | |
| Electrosilver | >105⇢ 140um | >105⇢ 140um | >105⇢ 140um | |
| Thickness control of sinking silver | >105⇢ 140um | >105⇢ 140um | >105⇢ 140um | |
| Tin thickness control | >105⇢ 140um | >105⇢ 140um | >105⇢ 140um | |
Min TestPAD | E/Tum(mil) | 75(3) | 75(3) | 75(3) |
| E/Tum(mil) | 50(2) | 50(2) | 50(2) | |
| E/Tum(mil | 25(1) | 25(1) | 25(1) | |
| E/Tum(mil) | 150（6） | 150（6） | 150（6） | |
lmpedanceContro lTolerance | ≧50ohm | ± 10% | ±8% | ±8% |
| ≦50ohm | ±50ohm | ±50ohm | ±50ohm | |
| Finished board | Plate thickness≧0.15mm | ≧ ± 10% | ≧ ± 10% | ≧ ± 10% |
| Plate thickness≧0.15mm | ≧ ±0.075% | ≧ ±0.075% | ≧ ±0.075% | |
| Warpage | ≤0.7% | ≤0.5% | ≤0.5% | |
| The above are the conventional production skills of Chaosheng Group Company, and there are any unclear points. Please further communicate with our specialized technical personnel, and we will be happy to serve you! Welcome to our guide! | ||||
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Office address: 101, No.2 Longhe Road,
Longgang District, Shenzhen,
Guangdong, China
(Cha Bajie Headquarters) 2nd Floor
Chaosheng Electronics)
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36-44 Nathan Road, Tsim Sha Tsui, Kowloon,
Hong Kong, China
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