Super Sheng 32 layer ultra long, ultra thick and large-sized circuit board
key word:
Product Description
Super Sheng 32 layer ultra long, ultra thick and large-sized circuit board
1、 Project Overview
This product aims to produce an ultra long, ultra thick, and large-sized circuit board with a 32 layer structure. The finished board thickness reaches 8.0mm, with dimensions of 1320mm in length and 97.80mm in width. The design of this circuit board is complex and the manufacturing difficulty is extremely high, but after careful planning and unremitting efforts by the team, it has been successfully delivered.
2、 Manufacturing process
This product has blind gong and blind slot technology to ensure precise connection of internal circuits on the circuit board. At the same time, in order to meet the high requirements of customers for the surface quality of circuit boards, we have adopted the immersion gold process for treatment, which presents a uniform and bright golden color on the surface of the circuit board, improving its oxidation resistance and conductivity.
3、 Technical Challenges and Solutions
1. Manufacturing difficulties caused by excessively long and thick dimensions: Due to the large size and thickness of the circuit board, we encountered technical challenges such as positioning accuracy and interlayer alignment during the manufacturing process. To address these issues, we have optimized the production process and adopted high-precision positioning equipment and interlayer alignment technology to ensure precise connections between the layers of the circuit board.
2. Processing accuracy of blind gongs and blind grooves: The processing of blind gongs and blind grooves requires extremely high equipment and process requirements. We have introduced advanced laser drilling equipment and precision gong plate equipment to ensure the machining accuracy and quality of blind gongs and blind grooves.
4、 Finished product quality
After rigorous testing and inspection, the quality of the 32 layer ultra long and ultra thick large-sized circuit board has reached the expected target. The surface of the circuit board is flat and smooth, the circuit connections are reliable, and the performance is stable.
We have conducted multiple tests on it, including electrical performance testing and reliability testing, all of which meet customer requirements and industry standards.
5、 Summary and Prospect
The successful manufacturing of the 32 layer ultra long and ultra thick large-sized circuit board not only demonstrates our strength and technological level in the field of high-end circuit board manufacturing, but also accumulates valuable experience for the development of similar projects in the future. We will continue to be committed to technological innovation and quality improvement, providing customers with better and more efficient circuit board manufacturing services. At the same time, we will actively monitor industry trends and technological developments, continuously expand our business areas, and provide customers with more comprehensive electronic product solutions.
| Main Product Structure of Chaosheng Group Company 2-80 layers of rigid circuit boards, 2-50 layers of flexible circuit boards and PCBA production Chaosheng Group Company mainly produces product categories High end double-sided, multi-layer, flexible, high-frequency, HDI interconnect, metal based, high thermal conductivity metal based, ceramic, cut in metal based, cut in buried capacitor, cut in thick copper buried magnet, concave convex step substrate, 5G high-speed board, thick copper, thick gold, high carbon resistance, double-sided multi-layer MiNiLED, MiNiHDILED, MiNiOLED, IC carrier substrate, roll to roll FPC, long FPC, large-sized printed circuit board, halogen-free material, high-frequency material, high-speed material, metal material, environmentally friendly circuit board, blind buried hole circuit board, high thermal conductivity aluminum based, thermoelectric separation copper based, PDU busbar, iron-based and metal based (core) mixed pressure plate, embedded copper buried copper. Buried resistance buried capacitance buried ceramic bead board, ultra-thin BT board, ceramic substrate, IC carrier board, high-frequency mixed voltage, high-speed board, differential impedance board, thick copper plate, thick gold plated board, HDI An integrated OEM and ODM production factory for Anylayer, double-sided, multi-layer, HDI FPC, soft hard combination HDI, roll to roll FPC, ultra long FPC, ultra large size PCB production and product design and development, software development, special material printed circuit boards, etc. The main application areas of PCB and PCBA products of Chaosheng Group Company Communication terminals, communication stations, electronic communication, fiber optics, optical modules, backlight sources, chip systems, communication equipment, communication instruments, computers, intelligent devices, intelligent control, system control, industrial power control, industrial equipment, testing instruments, testing instruments, SD cards, SG cards, mobile phones, computers, various antennas, radars, automobiles, light sources, resistors, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other application fields; The main application areas of flexible circuit boards (FPC) and FPCA products of Chaosheng Group Company Hard drives, printers, fax machines, scanners, sensors, mobile phones, connectors, modules, walkie talkie antenna cards, high-end cameras, digital cameras, laser heads, CDs, medical devices, instruments, drives, automobiles, automotive instruments, automotive drive disks, drivers, optical drives, medical devices, medical equipment, backlight sources, modules, banking equipment, industrial instruments, LED light strips, military, aviation, aerospace, national defense and other product fields. | |||||||||||||||
| Serial Number | Project | Manufacturing capability | |||||||||||||
| 1 | Layers | Floors 1-80 | |||||||||||||
| 2 | Maximum size of PCB | 2500*1150mm | |||||||||||||
| 3 | Maximum size of flexible FPC | 500mm*100m | |||||||||||||
| 4 | Maximum size of PCBA | 1600mm*1000mm | |||||||||||||
| 5 | FPCBA maximum size | 500mm*100m | |||||||||||||
| 6 | PCB finished product thickness | 0.15-12.0mm | |||||||||||||
| 7 | Thickness of flexible FPC finished product | 0.05-0.60mm | |||||||||||||
| 8 | Finished copper thickness | 12um-1075um | |||||||||||||
| 9 | Minimum finished aperture of laser hole | 0.075mm | |||||||||||||
| 10 | Minimum line width and spacing | 1.5mi/1.50mil | |||||||||||||
| 11 | Minimum finished hole diameter for through-hole | 0.15mm | |||||||||||||
| 12 | Thickness stacking aspect ratio | 1:35 | |||||||||||||
| 13 | By processing methods | VIA blind buried hole treatment: ink plug hole, resin plug hole, copper paste plug hole, VCP copper filling hole, silver paste plug hole, carbon oil plug hole, etc | |||||||||||||
| 14 | Surface Treatment | Sinking gold, electroplating nickel gold, electroplating thick gold, electroplating gold+OSP, electroplating nickel gold+sinking gold, electroplating nickel gold+sinking gold+OSP, electroplating gold+OSP, electroplating gold+gold fingers, OSP+gold fingers, lead-free tin spraying, lead-free tin spraying+sinking gold, lead-free tin spraying+gold fingers, lead tin spraying, OSP, sinking tin, sinking silver, electroplating silver | |||||||||||||
| 15 | Main substrate brands | Rogers, Arlon, Taconic, TP-2, Megtron, Neclo, Isola, F4B, 3M, Mitsui Group (Japan Mitsui/Mitsui Top), Taiyo TUC, Taiguang EMC, Tenghui VT, Shengyi SY, Lianmao ITEQ, South Asia NOUYA, DuPont Kappon, Taihong, Hongren Hongren, Xin Yang, Nippon Steel Nippon Stee, Teflon, Yasen, Matsushita, RCC, Mitsui Mitsui Group (Japan Mitsui Top), 3M (USA) 3M Location, Kyocera CERADIR, Jiuhe, Jiuhao, China Porcelain, Huaqing, Ai Shengda, Slitton, Kai Changde, Tongxin, Bergs, Yalong, Taiconieta, etc | |||||||||||||
| 16 | Solder mask color | Green, black, red, yellow, white, blue, purple, matte green, matte black, etc | |||||||||||||
| 17 | Test service | AOI、X-Ray、 Voltage withstand test, short circuit test, soldering test, thermal shock test, functional test, high temperature and high humidity test, first piece tester, etc | |||||||||||||
| 18 | Molding method | CNC shape, punch shape, V-CUT+forming method | |||||||||||||
| 19 | Finished product warpage | ≤0.5% | |||||||||||||
| 20 | Mechanical aperture tolerance | ≤0.025mm | |||||||||||||
| 21 | Finished product warpage | ≤0.5% | |||||||||||||
| 22 | MiNiLED Minimum PAD | 0.065mm/0.065mm | |||||||||||||
| 23 | Thermal conductivity | ≧8W | |||||||||||||
| 24 | Highest withstand voltage | 2500Pa | |||||||||||||
| 25 | High carbon resistance value and tolerance | ≧100→15000Ω±20% | |||||||||||||
| 26 | Impedance tolerance | ≤5→8%Ω | |||||||||||||
| 27 | IC Carrier Board Series | Minimum line width and spacing of 20um/20um | |||||||||||||
| FAQ | |||||||||||||||
| Question Point | Answer | ||||||||||||||
| Q: What information is required for PCB | CEGSATE: Gberber files for PCB production, product process instructions, such as material requirements, surface treatment requirements, finished product thickness requirements, PCB stack structure diagram for advanced products, copper thickness requirements for each layer, sample quantity requirements, batch order requirements, product application fields, and other related information are required | ||||||||||||||
| Q: What information does PCBA need to provide | CEGSATE: BOM report is required (including the brand, specifications, and model of the components), X and Y coordinate numbers of PCBA components, and processing requirements: Do we need to purchase the components on our behalf? Or customer supplied components? Do you need software burning? What is the required quantity? What is the monthly demand and other detailed information. | ||||||||||||||
| Question: Is my file secure? | CEGSATE: Your files are very secure, and we protect intellectual property rights for our clients throughout the entire process. All files provided by the customer will never be shared with any third party. | ||||||||||||||
| Q: What is the minimum order quantity? | CESGATE: There is no minimum order quantity in POE. We are able to handle small and large batches flexibly. | ||||||||||||||
| Q: Do you have any other services? | CESGATE: We mainly focus on PCB+FPC production+SMT+assembly PCBA+component procurement services; In addition, we can also provide programming, testing, software burning, wiring, and shell assembly services; And product design, product development, software development | ||||||||||||||
| Q: What is your inspection method? How do you control the quality? | CESGATE: In order to ensure the quality of PCB and FPC products, flying pin testing is usually used for samples and small batches; The inner circuit undergoes AOI optical inspection, online AOI inspection, and the finished product undergoes 100% inspection through E-SET testing rack. The appearance undergoes 100% inspection through fully automatic finished product inspection equipment and FQC. PCBA undergoes automatic optical inspection (AOI), BGA part X-Ray 100% radiographic inspection, and first article inspection (FAI). PCBA products that require software burning undergo 100% full testing through finished product testing rack according to product functional requirements. | ||||||||||||||
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Product Name: Aerospace, Military, Nuclear, Unmanned Aerial Vehicle ProductsBoard: FR-4, TG150Layers: 18layer coil inductor multilayer board PCBMinimum line width/spacing: 8/8milFinished product size: 255x176mm/1 * 1pcsSurface technology: Sinking gold, green oilCopper thickness: Inner and outer layers of copper with a thickness of 175umPlate thickness: 3.50mmMinimum aperture: 0.35mm, laser hole/mm,Transport Package：Vacuum packaging+moisture-proof beads+separated white paper+cardboard box+wooden card boardFeatures: Difficulties such as dense inner and outer coilsUsage: Engine, electric motor, inductor, orange equipment, etc2-80 layers of rigid circuit boards, 2-50 layers of flexible circuit boards and PCBA productionChaosheng Group Company mainly produces product categoriesHigh end double-sided, multi-layer, flexible, high-frequency, HDI interconnect, metal based, high thermal conductivitymetal based, ceramic, cut in metal based, cut in buried capacitor, cut in thick copper buried magnet, concave convex step substrate, 5G high-speed board, thick copper, thick gold, high carbon resistance, double-sided multi-layerMiNiLED, MiNiHDILED, MiNiOLED, IC carrier substrate, roll to roll FPC, long FPC, large-sized printed circuit board,halogen-free material, high-frequency material, high-speed material, metal material, environmentally friendly circuit board, blind buried hole circuit board, high thermal conductivity aluminum based, thermoelectric separation copper based, PDU busbar, iron-based and metal based (core) mixed pressure plate, embedded copper buried copper. Buried resistance buried capacitance buried ceramic bead board, ultra-thin BT board, ceramic substrate, IC carrier board,high-frequency mixed voltage, high-speed board, differential impedance board, thick copper plate, thick gold platedboard, HDI An integrated OEM and ODM production factory for Anylayer, double-sided, multi-layer, HDI FPC, softhard combination HDI, roll to roll FPC, ultra long FPC, ultra large size PCB production and product design and development, software development, special material printed circuit boards, etc. Process Capability TableTechnical ltemMassProductAdvanced Technology2015 2021 2025 Max.Layer Count80 layer100 layer100 layerPCB through hole board2～80 layer2～100 layer2～100 layerMaximum size through hole 1～237〞*98.50"43.3〞*118.11"43.3〞*118.11"Minimum line width and spacing10(0.40)10(0.40)7.50（0.30mm）Minimum mechanicalhole(mm)12(0.50)10(0.40)8.50（0.35mm）Maximum size through hole 4～22layers37〞*43.30"43.3〞*43.30"43.3〞*43.30"Maximum size through hole 4～22layers31.50 ″*59"31.50 ″*70.86"31.50 ″*70.86"Maximum size through hole 4～22layers10(0.40)10(0.40)7.50（0.30mm）Minimum line width and spacing formulti-layer large-sized PCBs10(0.40)10(0.40)7.50（0.30mm）Maximum size of multi-layer through-hole : 4-22 layers with the smallesthole12(0.50)10(0.40)8.50（0.35mm）Maximum size HDI 4～36 layers31.50 ″*55"31.50 ″*55"31.50 ″*55"Minimum line width and linespacing of large size PCBThrough hole 12 /12milHDI14 /14milThrough hole 10/10milHDI12 / 12milThrough hole 8 /8milHDI12 / 12milThe largest board ruler 1 → thesmallest hole of 18 layersThrough hole0.50mmHDI :0.45mmThrough hole 0.50mmHDI : 0.45mmThrough hole0.50mmHDI : 0.45mmThe layer number of FPC1～36layer1～60layer1～60layerMaximum size offlexible FPC19.68〞*55"28〞*59"31.49〞*118.12"Maximumsize of flexible FPC with soft hardcombination19.68〞*55"28〞*59"31.49〞*118.12"FPC (roll to roll) maximum size19.68 ″*7874"19.68 ″*7874"19.68 ″*7874"Maximum size of FPC single chipshipment19.68 ″*118.11"19.68 ″*196.8"19.68 ″*196.80"The layer number of FPC2～18 layer2～36 layer2～42 layerMaximum size of layered board19.68 ″*35"19.68 ″*43"19.68 ″*43"Number of through-hole layers2～20layer2～30 layer2～40 layerHard and soft HDI layers2～14 layer2～18 layer2～22 layerMaximum size of soft and hardcombination19.68 ″*43"19.68 ″*49"19.68 ″*49"FPC/soft-hard combinationarbitrary interconnection HDI4+X+4InterconnectHDI5+X+5Interconnect HDI6+X+6InterconnectHDIHDIPCB layers4～36layer4～60layer4～80 layerAnylayer HDI PCB4+X+4InterconnectHDI5+X+5、Interconnect HDI8+X+8、InterconnectHDIHDIPCB maximum board size24"*52"43"*49"43"*49"Number of through hole layers ofhigh frequency board2～18 layer2～36 layer2～60 layerHDI layersofhighfrequency board2～16 layer2～24 layer2～60layerMaximum size ofhigh frequency board37 ″*43"43 ″*49"43 ″*49"Number of ceramic plates1-2 layer1～4 layer1～6 layerCeramic plate thickness0.60mm-1.60mm0.38mm-20.0mm0.38mm-20.0mmMaximum size of ceramic plate100*150mm150*190mm150*650mmMinimum aperture of ceramicplate0.50mm0.35mm0.35mmMinimum line width and linespacing of ceramic board16/16mil12/12mil10/10milNumber of layers of metalcopper substrate1-2 layer1～4 layer1～6 layerMaximum line width and linespacing of metal iron substrate12/12mil4/4mil4/4milNumber of layers of metalaluminum substrateHDI1-2 layer1～4 layer1～6 layerMaximum size of metal substrate37 ″*43"25.59 ″*59"25.59 ″*59"The smallest hole ofthe metal substrate0.50mm0.35mm0
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