Ultra long size flexible FPC,Double layer roll to roll flexible FPC

key word:

Product consultation:

Product Description

Ultra Long Size Flexible FPC: Double Layer Roll to Roll Flexible FPC

Material PI, size 2 meters, width 250mm, plate thickness 0.25mm, FR-4 reinforcement, nickel sheet reinforcement
Electric thick gold PCB
Large size circular PCB
Multi layer large-sized PCB
Ultra long size PCB
Special large-sized PCB
Customized large-sized PCB
Large size PCB for coil board
Inductive coil large-sized PCB
Multi layer large-sized coil PCB
Ultra thick and large-sized PCB
18mm ultra thick large-sized PCB
10mm ultra thick PCB
32 layer large-sized PCB
64 layer large-sized PCB
60 layer large-sized flexible FPC
Super sized flexible FPC with a combination of soft and hard components
Large size soft hard combination FPC
Multi layer large-sized flexible FPC
Large size flexible FPC
Ultra long size flexible FPC
Double layer roll to roll flexible FPC

In the rapidly evolving field of electronics, the demand for flexible printed circuits (FPC) has surged. Among the various types of FPCs, ultra long size flexible FPCs have emerged as a significant innovation. These circuits offer unique advantages, particularly when designed as double layer roll-to-roll flexible FPCs. This article delves into the characteristics, advantages, and applications of ultra long size flexible FPCs, specifically focusing on double layer roll-to-roll manufacturing processes.

**Understanding Flexible Printed Circuits**

Flexible printed circuits, commonly known as FPCs, are a type of electronic circuit that can bend and twist without compromising functionality. Unlike traditional rigid printed circuit boards (PCBs), FPCs are made from flexible substrates such as polyimide or polyester. This flexibility allows them to be integrated into various applications where space and weight are critical considerations. 

The ultra long size flexible FPCs take this concept further, allowing for longer circuit lengths without sacrificing performance. These circuits can be produced in lengths that exceed standard dimensions, enabling more complex and sophisticated electronic designs. 

**The Double Layer Configuration*

One of the most notable configurations of flexible FPCs is the double layer design. In this configuration, two conductive layers are separated by an insulating layer. This design allows for increased circuit density, enabling more components to be placed within a smaller footprint. The double layer structure also enhances electrical performance by reducing signal loss and improving reliability.

The double layer roll-to-roll (R2R) manufacturing process further optimizes the production of ultra long size flexible FPCs. This technique involves continuously feeding a flexible substrate through a series of processes, including printing, etching, and lamination. The R2R method is highly efficient, allowing for high-volume production while maintaining quality and precision

**Advantages of Ultra Long Size Flexible FPCs**

The ultra long size flexible FPCs offer several distinct advantages over traditional circuit designs. Firstly, their flexibility and lightweight nature make them ideal for applications where space is at a premium. This is particularly important in consumer electronics, automotive systems, and medical devices, where compact designs are essential.

Moreover, the double layer configuration enhances the overall performance of the circuits. The ability to fit more components into a smaller area allows for more complex functionalities, making these FPCs suitable for advanced applications such as wearable technology and IoT devices.

Additionally, the roll-to-roll manufacturing process significantly reduces production costs. By allowing continuous production, manufacturers can achieve economies of scale, making ultra long size flexible FPCs more accessible to a broader range of industries.

**Applications of Ultra Long Size Flexible FPCs**

The applications for ultra long size flexible FPCs are vast and varied. In the consumer electronics sector, these circuits are used in smartphones, tablets, and laptops, where they contribute to slimmer designs and improved performance. Their flexibility allows for innovative product designs that enhance user experience.

In the automotive industry, ultra long size flexible FPCs play a crucial role in advanced driver-assistance systems (ADAS) and infotainment systems. The ability to integrate these circuits into tight spaces within vehicles enables manufacturers to incorporate cutting-edge technology without compromising on design.

The medical field also benefits from ultra long size flexible FPCs. These circuits are utilized in medical devices such as flexible sensors, wearable health monitors, and diagnostic equipment. Their lightweight and flexible nature allows for comfortable wear and easy integration into everyday items.

**Challenges and Future Directions**

Despite the numerous advantages, the production of ultra long size flexible FPCs is not without its challenges. One significant issue is the potential for manufacturing defects, such as wrinkles or misalignment during the roll-to-roll process. Ensuring quality control throughout production is essential to mitigate these risks.

Another challenge lies in the material selection. While flexible substrates offer great benefits, they must also withstand various environmental factors, including temperature fluctuations and humidity. Ongoing research is focused on developing advanced materials that can meet these demands while maintaining flexibility and performance.

Looking to the future, the demand for ultra long size flexible FPCs is expected to grow. As technology continues to advance, the need for more compact and efficient electronic devices will drive innovation in FPC design and manufacturing. The integration of smart materials and enhanced manufacturing techniques will likely pave the way for even more sophisticated applications.

**Conclusion**

Ultra long size flexible FPCs, particularly in their double layer roll-to-roll configuration, represent a significant advancement in the field of electronics. Their unique characteristics, combined with the advantages of flexible design and efficient manufacturing processes, make them an essential component in modern technology. As industries continue to seek innovative solutions to meet consumer demands, the role of ultra long size flexible FPCs will undoubtedly expand, leading to new possibilities in electronics design and application.
Main Product Structure of Chaosheng Group Company
2-80 layers of rigid circuit boards, 2-50 layers of flexible circuit boards and PCBA production
Chaosheng Group Company mainly produces product categories
High end double-sided, multi-layer, flexible, high-frequency, HDI interconnect, metal based, high thermal conductivity metal based, ceramic, cut in metal based, cut in buried capacitor, cut in thick copper buried magnet, concave convex step substrate, 5G high-speed board, thick copper, thick gold, high carbon resistance, double-sided multi-layer MiNiLED, MiNiHDILED, MiNiOLED, IC carrier substrate, roll to roll FPC, long FPC, large-sized printed circuit board, halogen-free material, high-frequency material, high-speed material, metal material, environmentally friendly circuit board, blind buried hole circuit board, high thermal conductivity aluminum based, thermoelectric separation copper based, PDU busbar, iron-based and metal based (core) mixed pressure plate, embedded copper buried copper. Buried resistance buried capacitance buried ceramic bead board, ultra-thin BT board, ceramic substrate, IC carrier board, high-frequency mixed voltage, high-speed board, differential impedance board, thick copper plate, thick gold plated board, HDI An integrated OEM and ODM production factory for Anylayer, double-sided, multi-layer, HDI FPC, soft hard combination HDI, roll to roll FPC, ultra long FPC, ultra large size PCB production and product design and development, software development, special material printed circuit boards, etc.
The main application areas of PCB and PCBA products of Chaosheng Group Company
Communication terminals, communication stations, electronic communication, fiber optics, optical modules, backlight sources, chip systems, communication equipment, communication instruments, computers, intelligent devices, intelligent control, system control, industrial power control, industrial equipment, testing instruments, testing instruments, SD cards, SG cards, mobile phones, computers, various antennas, radars, automobiles, light sources, resistors, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other application fields;
The main application areas of flexible circuit boards (FPC) and FPCA products of Chaosheng Group Company
Hard drives, printers, fax machines, scanners, sensors, mobile phones, connectors, modules, walkie talkie antenna cards, high-end cameras, digital cameras, laser heads, CDs, medical devices, instruments, drives, automobiles, automotive instruments, automotive drive disks, drivers, optical drives, medical devices, medical equipment, backlight sources, modules, banking equipment, industrial instruments, LED light strips, military, aviation, aerospace, national defense and other product fields.
 

Serial NumberProjectManufacturing capability
1LayersFloors 1-80
2Maximum size of PCB2500*1150mm
3Maximum size of flexible FPC500mm*100m
4Maximum size of PCBA1600mm*1000mm
5FPCBA maximum size500mm*100m
6PCB finished product thickness0.15-12.0mm
7Thickness of flexible FPC finished product0.05-0.60mm
8Finished copper thickness12um-1075um
9Minimum finished aperture of laser hole0.075mm
10Minimum line width and spacing1.5mi/1.50mil
11Minimum finished hole diameter for through-hole0.15mm
12Thickness stacking aspect ratio1:35
13By processing methodsVIA blind buried hole treatment: ink plug hole, resin plug hole, copper paste plug hole, VCP copper filling hole, silver paste plug hole, carbon oil plug hole, etc
14Surface TreatmentSinking gold, electroplating nickel gold, electroplating thick gold, electroplating gold+OSP, electroplating nickel gold+sinking gold, electroplating nickel gold+sinking gold+OSP, electroplating gold+OSP, electroplating gold+gold fingers, OSP+gold fingers, lead-free tin spraying, lead-free tin spraying+sinking gold, lead-free tin spraying+gold fingers, lead tin spraying, OSP, sinking tin, sinking silver, electroplating silver
15Main substrate brandsRogers, Arlon, Taconic, TP-2, Megtron, Neclo, Isola, F4B, 3M, Mitsui Group (Japan Mitsui/Mitsui Top), Taiyo TUC, Taiguang EMC, Tenghui VT, Shengyi SY, Lianmao ITEQ, South Asia NOUYA, DuPont Kappon, Taihong, Hongren Hongren, Xin Yang, Nippon Steel Nippon Stee, Teflon, Yasen, Matsushita, RCC, Mitsui Mitsui Group (Japan Mitsui Top), 3M (USA) 3M Location, Kyocera CERADIR, Jiuhe, Jiuhao, China Porcelain, Huaqing, Ai Shengda, Slitton, Kai Changde, Tongxin, Bergs, Yalong, Taiconieta, etc
16Solder mask colorGreen, black, red, yellow, white, blue, purple, matte green, matte black, etc
17Test serviceAOI、X-Ray、 Voltage withstand test, short circuit test, soldering test, thermal shock test, functional test, high temperature and high humidity test, first piece tester, etc
18Molding methodCNC shape, punch shape, V-CUT+forming method
19Finished product warpage≤0.5%
20Mechanical aperture tolerance≤0.025mm
21Finished product warpage≤0.5%
22MiNiLED Minimum PAD0.065mm/0.065mm
23Thermal conductivity≧8W
24Highest withstand voltage2500Pa
25High carbon resistance value and tolerance≧100→15000Ω±20%
26Impedance tolerance≤5→8%Ω
27IC Carrier Board SeriesMinimum line width and spacing of 20um/20um
                
FAQ
Question PointAnswer
Q: What information is required for PCBCEGSATE: Gberber files for PCB production, product process instructions, such as material requirements, surface treatment requirements, finished product thickness requirements, PCB stack structure diagram for advanced products, copper thickness requirements for each layer, sample quantity requirements, batch order requirements, product application fields, and other related information are required
Q: What information does PCBA need to provideCEGSATE: BOM report is required (including the brand, specifications, and model of the components), X and Y coordinate numbers of PCBA components, and processing requirements: Do we need to purchase the components on our behalf? Or customer supplied components? Do you need software burning? What is the required quantity? What is the monthly demand and other detailed information.
Question: Is my file secure?CEGSATE: Your files are very secure, and we protect intellectual property rights for our clients throughout the entire process. All files provided by the customer will never be shared with any third party.
Q: What is the minimum order quantity?CESGATE: There is no minimum order quantity in POE. We are able to handle small and large batches flexibly.
Q: Do you have any other services?CESGATE: We mainly focus on PCB+FPC production+SMT+assembly PCBA+component procurement services; In addition, we can also provide programming, testing, software burning, wiring, and shell assembly services; And product design, product development, software development
Q: What is your inspection method? How do you control the quality?CESGATE: In order to ensure the quality of PCB and FPC products, flying pin testing is usually used for samples and small batches; The inner circuit undergoes AOI optical inspection, online AOI inspection, and the finished product undergoes 100% inspection through E-SET testing rack. The appearance undergoes 100% inspection through fully automatic finished product inspection equipment and FQC. PCBA undergoes automatic optical inspection (AOI), BGA part X-Ray 100% radiographic inspection, and first article inspection (FAI). PCBA products that require software burning undergo 100% full testing through finished product testing rack according to product functional requirements.

Related products

China Chao Sheng Electronic Automotive-Grade Hard-Soft Combined HDI-FPC


Automotive electronics PCB, Medical equipment circuit board, Industrial control PCB, Aerospace & military grade PCB, Ion‑equipment high‑voltage board, High‑speed server PCB, 5G communication circuit board, Radar RF microwave PCB, Wireless terminal motherboard, Industrial SBC mainboard, High‑power industrial control PCB, Automation controller board, Drone flight‑control PCB, Robot control board, High frequency low loss PCB, Thick hard gold finger circuit board

China Chaosheng Electronic Intelligent Products Multilayer Circuit Board HDIPCB TechnologyPCB


Automotive electronics PCB, Medical equipment circuit board, Industrial control PCB, Aerospace & military grade PCB, Ion‑equipment high‑voltage board, High‑speed server PCB, 5G communication circuit board, Radar RF microwave PCB, Wireless terminal motherboard, Industrial SBC mainboard, High‑power industrial control PCB, Automation controller board, Drone flight‑control PCB, Robot control board, High frequency low loss PCB, Thick hard gold finger circuit board, HDI blind & buried via PCB

China Chaosheng Electronic and Electrical Products Multi layer Circuit Board PCB Source FactoryPCB


Automotive electronics PCB, Medical equipment circuit board, Industrial control PCB, Aerospace & military grade PCB, Ion‑equipment high‑voltage board, High‑speed server PCB, 5G communication circuit board, Radar RF microwave PCB, Wireless terminal motherboard, Industrial SBC mainboard, High‑power industrial control PCB, Automation controller board, Drone flight‑control PCB, Robot control board, High frequency low loss PCB, Thick hard gold finger circuit board, HDI blind & buried via PCB

China Chaosheng Electronic Medical Equipment Products Multilayer Circuit Board HDIPCB Technology


Automotive electronics PCB, Medical equipment circuit board, Industrial control PCB, Aerospace & military grade PCB, Ion‑equipment high‑voltage board, High‑speed server PCB, 5G communication circuit board, Radar RF microwave PCB, Wireless terminal motherboard, Industrial SBC mainboard, High‑power industrial control PCB, Automation controller board, Drone flight‑control PCB, Robot control board, High frequency low loss PCB, Thick hard gold finger circuit board, HDI blind & buried via PCB

China Chaosheng Electronic Automotive Products Multi layer Circuit Board HDIPCB Technology


Ultra thin PCB,Double layer ultra-thin PCB,Multi layer ultra-thin PCB,HDI ultra-thin PCB,Oversized thin board PCB,Flexible Rigid PCB,PCB factory,Top PCB Manufacturers,Printed Circuit Board (PCB),If you get rid of the PCB,PCB Piezotronics,PCB Simulation,Certified PCB Design Company,Quick Turn PCB

China Chaosheng Automotive Control Multi layer Circuit Board PCB Source Factory


Ultra thin PCB,Double layer ultra-thin PCB,Multi layer ultra-thin PCB,HDI ultra-thin PCB,Oversized thin board PCB,Flexible Rigid PCB,PCB factory,Top PCB Manufacturers,Printed Circuit Board (PCB),If you get rid of the PCB,PCB Piezotronics,PCB Simulation,Certified PCB Design Company,Quick Turn PCB

China Chaosheng Electronics Mobile Phone Flexible Motherboard FPC


any order HDI soft hard combined FPC, blind buried hole HDIFPC, single-layer flexible FPC, double-layer flexible FPC, multi-layer flexible FPC, multi-layer flexible HDIFPC, soft hard combined flexible FPC, soft hard combined HDI flexible FPC, any order HDI soft hard combined flexible FPC

China Chaosheng Electronic Printer Driver Flexible FPC


Ultra long flexible FPC,Ultra long double-layer flexible FPC,Ultra long multi-layer flexible FPC,Ultra long combination of soft and hard FPC,Multi layer ultra long flexible FPC,Ultra long flexible multi-layer FPC,Ultra large flexible FPC,Ultra large flexible multi-layer FPC,Roll to roll flexible FPC, single-layer roll to roll flexible FPC, double-layer roll to roll flexible FPC

China Chaosheng Electronics | Ultra Large&Ultra Long Sizes · Roll to Roll (R-to-R) Flexible FPC Complete Technical Description


Roll‑to‑Roll(R2R) FPC, Ultra‑long flexible circuit board, Max length 15meter FPC, Large format flex PCB, Seamless one‑piece long flex cable, Dupont PI FPC, Thick hard‑gold finger FPC, Multi‑layer long flex PCB, Automotive BMS flexible ribbon, Industrial automation long‑distance flex interconnect

China Chaosheng Electronics | Complete‑Set Technologies for Rigid‑Flex FPC and Ultra‑Long Flexible FPC


Single Layer FPC, Double Layer FPC, Multilayer Flexible PCB, Roll-to-Roll FPC, R2R Flex Circuit, Rigid-Flex PCB, Oversize Large Format Flexible FPC,Medical grade rigid-flex FPC,Automotive flexible multilayer PCB,New energy vehicle large size FPC,800G optical module flexible circuit,Rigid-Flex FPC / Rigid Flexible Combined PCB,Oversize Large Format Flexible FPC / Extra Large Size Flexible PCB,Multilayer Flexible Printed Circuit,Roll-to-Roll Flexible FPC / R2R Flexible PCB,Multilayer Flexible FPC

China Chaosheng Electronics | Complete‑Set Technologies for Rigid‑Flex FPC and Ultra‑Long Flexible FPC


Single Layer FPC, Double Layer FPC, Multilayer Flexible PCB, Roll-to-Roll FPC, R2R Flex Circuit, Rigid-Flex PCB, Oversize Large Format Flexible FPC,Medical grade rigid-flex FPC,Automotive flexible multilayer PCB,New energy vehicle large size FPC,800G optical module flexible circuit,Rigid-Flex FPC / Rigid Flexible Combined PCB,Oversize Large Format Flexible FPC / Extra Large Size Flexible PCB,Multilayer Flexible Printed Circuit,Roll-to-Roll Flexible FPC / R2R Flexible PCB,Multilayer Flexible FPC

China Chaosheng Electronic Sensor Fused Screen Ultra Large and Wide Flexible Circuit Board FPCSpecial


Ultra long flexible FPC,Ultra long double-layer flexible FPC,Ultra long multi-layer flexible FPC,Ultra long combination of soft and hard FPC,Multi layer ultra long flexible FPC,Ultra long flexible multi-layer FPC,Ultra large flexible FPC,Ultra large flexible multi-layer FPC,Roll to roll flexible FPC, single-layer roll to roll flexible FPC, double-layer roll to roll flexible FPC,Single layer FPC, double-layer FPC, multi-layer FPC, multi-layer HDIFPC, soft hard combined FPC, soft hard combined HDI

blind buried hole HDI flexible FPC,4-layer flexible FPC


any order HDI soft hard combined FPC, blind buried hole HDIFPC, single-layer flexible FPC, double-layer flexible FPC, multi-layer flexible FPC, multi-layer flexible HDIFPC, soft hard combined flexible FPC, soft hard combined HDI flexible FPC, any order HDI soft hard combined flexible FPC, blind buried hole HDI flexible FPC

China Chaosheng Electronics | A complete set of core technologies including large film switches, fused film screens, silver wires for display screens, and ultra large flexible FPCs


Large sized flexible silver wire PETFPC Extra large carbon wire PETFPC Extra large carbon wire+silver wire PETFPC Touch screen flexible silver wire FPC Touch screen flexible carbon oil line FPC Film switch PET silver wire FPC Film switch PET silver oil circuit FPC Film switch PET carbon oil circuit FPC Large size film switch PET carbon oil circuit FPC Ultra large size thin film switch flexible FPC

Surrounding dam metal ceramic circuit board PCB


- ✅ High airtightness: Metal dam sealed cavity, protecting chips and extending their lifespan (essential for military/aerospace industries). - ✅ Super heat dissipation: Ceramic thermal conductivity is 100 times that of FR-4, suitable for high-power LED, laser, IGBT modules. - ✅ High reliability and stability: Low thermal expansion coefficient (CTE ≈ 4-7 ppm/℃), matched with silicon chips, resistant to thermal shock and high and low temperatures. ✅ ** Large scale mass production: Chaosheng has a unique 3m × 1.24m production line that can produce ≥ 500 pieces per month, replacing multi board splicing and improving system stability.

18layer coil inductor multilayer board PCB


Product Name: Aerospace, Military, Nuclear, Unmanned Aerial Vehicle ProductsBoard: FR-4, TG150Layers: 18layer coil inductor multilayer board PCBMinimum line width/spacing: 8/8milFinished product size: 255x176mm/1 * 1pcsSurface technology: Sinking gold, green oilCopper thickness: Inner and outer layers of copper with a thickness of 175umPlate thickness: 3.50mmMinimum aperture: 0.35mm, laser hole/mm,Transport Package:Vacuum packaging+moisture-proof beads+separated white paper+cardboard box+wooden card boardFeatures: Difficulties such as dense inner and outer coilsUsage: Engine, electric motor, inductor, orange equipment, etc2-80 layers of rigid circuit boards, 2-50 layers of flexible circuit boards and PCBA productionChaosheng Group Company mainly produces product categoriesHigh end double-sided, multi-layer, flexible, high-frequency, HDI interconnect, metal based, high thermal conductivitymetal based, ceramic, cut in metal based, cut in buried capacitor, cut in thick copper buried magnet, concave convex step substrate, 5G high-speed board, thick copper, thick gold, high carbon resistance, double-sided multi-layerMiNiLED, MiNiHDILED, MiNiOLED, IC carrier substrate, roll to roll FPC, long FPC, large-sized printed circuit board,halogen-free material, high-frequency material, high-speed material, metal material, environmentally friendly circuit board, blind buried hole circuit board, high thermal conductivity aluminum based, thermoelectric separation copper based, PDU busbar, iron-based and metal based (core) mixed pressure plate, embedded copper buried copper. Buried resistance buried capacitance buried ceramic bead board, ultra-thin BT board, ceramic substrate, IC carrier board,high-frequency mixed voltage, high-speed board, differential impedance board, thick copper plate, thick gold platedboard, HDI An integrated OEM and ODM production factory for Anylayer, double-sided, multi-layer, HDI FPC, softhard combination HDI, roll to roll FPC, ultra long FPC, ultra large size PCB production and product design and development, software development, special material printed circuit boards, etc.        Process Capability TableTechnical ltemMassProductAdvanced Technology2015 2021 2025 Max.Layer Count80 layer100 layer100 layerPCB through hole board2~80 layer2~100 layer2~100 layerMaximum size through hole 1~237〞*98.50"43.3〞*118.11"43.3〞*118.11"Minimum line width and spacing10(0.40)10(0.40)7.50(0.30mm)Minimum mechanicalhole(mm)12(0.50)10(0.40)8.50(0.35mm)Maximum size through hole 4~22layers37〞*43.30"43.3〞*43.30"43.3〞*43.30"Maximum size through hole 4~22layers31.50 ″*59"31.50 ″*70.86"31.50 ″*70.86"Maximum size through hole 4~22layers10(0.40)10(0.40)7.50(0.30mm)Minimum line width and spacing formulti-layer large-sized PCBs10(0.40)10(0.40)7.50(0.30mm)Maximum size of multi-layer through-hole : 4-22 layers with the smallesthole12(0.50)10(0.40)8.50(0.35mm)Maximum size HDI 4~36 layers31.50 ″*55"31.50 ″*55"31.50 ″*55"Minimum line width and linespacing of large size PCBThrough hole 12 /12milHDI14 /14milThrough hole 10/10milHDI12 / 12milThrough hole 8 /8milHDI12 / 12milThe largest board ruler 1 → thesmallest hole of 18 layersThrough hole0.50mmHDI :0.45mmThrough hole 0.50mmHDI : 0.45mmThrough hole0.50mmHDI : 0.45mmThe layer number of FPC1~36layer1~60layer1~60layerMaximum size offlexible FPC19.68〞*55"28〞*59"31.49〞*118.12"Maximumsize of flexible FPC with soft hardcombination19.68〞*55"28〞*59"31.49〞*118.12"FPC (roll to roll) maximum size19.68 ″*7874"19.68 ″*7874"19.68 ″*7874"Maximum size of FPC single chipshipment19.68 ″*118.11"19.68 ″*196.8"19.68 ″*196.80"The layer number of FPC2~18 layer2~36 layer2~42 layerMaximum size of layered board19.68 ″*35"19.68 ″*43"19.68 ″*43"Number of through-hole layers2~20layer2~30 layer2~40 layerHard and soft HDI layers2~14 layer2~18 layer2~22 layerMaximum size of soft and hardcombination19.68 ″*43"19.68 ″*49"19.68 ″*49"FPC/soft-hard combinationarbitrary interconnection HDI4+X+4InterconnectHDI5+X+5Interconnect HDI6+X+6InterconnectHDIHDIPCB layers4~36layer4~60layer4~80 layerAnylayer HDI PCB4+X+4InterconnectHDI5+X+5、Interconnect HDI8+X+8、InterconnectHDIHDIPCB maximum board size24"*52"43"*49"43"*49"Number of through hole layers ofhigh frequency board2~18 layer2~36 layer2~60 layerHDI layersofhighfrequency board2~16 layer2~24 layer2~60layerMaximum size ofhigh frequency board37 ″*43"43 ″*49"43 ″*49"Number of ceramic plates1-2 layer1~4 layer1~6 layerCeramic plate thickness0.60mm-1.60mm0.38mm-20.0mm0.38mm-20.0mmMaximum size of ceramic plate100*150mm150*190mm150*650mmMinimum aperture of ceramicplate0.50mm0.35mm0.35mmMinimum line width and linespacing of ceramic board16/16mil12/12mil10/10milNumber of layers of metalcopper substrate1-2 layer1~4 layer1~6 layerMaximum line width and linespacing of metal iron substrate12/12mil4/4mil4/4milNumber of layers of metalaluminum substrateHDI1-2 layer1~4 layer1~6 layerMaximum size of metal substrate37 ″*43"25.59 ″*59"25.59 ″*59"The smallest hole ofthe metal substrate0.50mm0.35mm0

64 layer thick copper coil plate technology


Product Name: Aerospace, Military, Nuclear, Unmanned Aerial Vehicle ProductsBoard: FR-4, TG150Layers: 64 layer coil inductor multilayer board PCBMinimum line width/spacing: 8/8milFinished product size: 301x301mm/1 * 1pcsSurface technology: Sinking gold, green oilCopper thickness: 105um for inner and outer layersPlate thickness: 5.5mmMinimum aperture: 3.5mm, laser hole/mm,Features: Difficulties such as dense inner and outer coilsUsage: Engine, electric motor, inductor, orange equipment, etcFirstly, from the perspective of the company's own technological strength, Chaosheng clearly has the ability to produce high multi-layer circuit boards, with its product range covering 2-80 layers of precision multi-layer circuit boards.At the same time, Chaosheng also has imported fully automated precision equipment production lines and a sound quality management system. It has passed multiple quality system certifications such as UL and ISO9001 in the United States, which has laid the foundation for its production of 64 layer and other ultra-high multi-layer circuit boards. Secondly, from the perspective of product characteristics, the product adopts a design that combines blind grooves and depth control grooves, combined with metal edging. The middle part has been treated with immersion gold, which not only improves corrosion resistance but also enhances stability.It is speculated that a 64 layer inductor coil metal wrapped circuit board may also use a similar design to meet the needs of multi-layer and different thickness circuit fabrication.At the same time, metal edging can effectively shield electromagnetic radiation, further enhancing signal integrity and circuit stability. Finally, for the part of the inductor coil, precise control of the inductance value may be achieved through special layout design of the coil and optimized via settings, in order to meet specific electrical performance requirements of the product. A multi-layer coil PCB (Printed Circuit Board) refers to a type of circuit board that consists of multiple layers of conductive material, separated by insulating layers, and is often used for applications requiring compact designs, such as RF (radio frequency) coils, inductors, transformers, and other electromagnetic components.### Key Features of Multi-Layer Coil PCBs:1. **Layer Structure**:   - Multi-layer PCBs typically consist of three or more layers. The inner layers can be used for routing power and ground, while the outer layers can be utilized for signal routing and component placement.2. **Coil Design**:   - The coils can be designed in various configurations, such as solenoids, toroids, or planar coils, depending on the application. The design may include various winding techniques and geometries to optimize inductance and performance.3. **Material**:   - Common materials used for multi-layer PCBs include FR-4 (a type of fiberglass epoxy), Rogers materials (for high-frequency applications), and other specialized materials that can handle specific thermal or electrical requirements.4. **Impedance Control**:   - For RF applications, controlling the impedance of the coil is crucial. Multi-layer designs can help maintain consistent impedance across the PCB by using specific layer stack-ups and trace widths.5. **Thermal Management**:   - Multi-layer PCBs can help dissipate heat more effectively than single-layer designs. Proper thermal management is essential in coil applications, especially when dealing with high currents.6. **Manufacturing Process**:   - The fabrication of multi-layer PCBs involves several steps, including layer alignment, lamination, drilling, plating, and etching. Advanced techniques such as laser drilling and via filling may be employed to create vias and interconnections.7. **Applications**:   - Multi-layer coil PCBs are used in various applications, including:     - RF and microwave devices     - Wireless charging systems     - Inductive sensors     - Power amplifiers     - Communication devices### Design Considerations:1. **Simulation**:   - Using simulation software (like HFSS, CST, or other electromagnetic simulation tools) to model the coil's behavior can help in optimizing its design before fabrication.2. **Manufacturing Tolerances**:   - Ensure that the PCB manufacturer can meet the necessary tolerances for the coil's dimensions and layer alignment to achieve the desired performance.3. **Testing and Prototyping**:   - Prototyping the design and conducting tests (like S-parameter testing) is essential to validate performance and make any necessary adjustments.4. **Cost**:   - Multi-layer PCBs can be more expensive than single-layer boards due to the complexity of manufacturing and the materials used. Balancing performance requirements with cost considerations is crucial.5. **Stack-Up Design**:   - Carefully planning the stack-up of the PCB layers is important to achieve the desired electrical performance and to minimize issues like crosstalk and electromagnetic interfe

The following is a detailed introduction about "PET carbon wire pseudo double-layer flexible FPC"


Transparent PCB, transparent flexible FPC Transparent PET circuit board, transparent button carbon oil FPC, transparent button carbon silver PCB, transparent PET perforated carbon silver PCB, transparent FR-4PCB, double-layer transparent circuit board PCB, multi-layer transparent FR-4 circuit board, ultra large size transparent PCB, ultra large size transparent circuit board PCB

Transparent PCB, transparent flexible FPC


Transparent PET circuit board, transparent button carbon oil FPC, transparent button carbon silver PCB, transparent PET perforated carbon silver PCB, transparent FR-4PCB, double-layer transparent circuit board PCB, multi-layer transparent FR-4 circuit board, ultra large size transparent PCB, ultra large size transparent circuit board PCB

Detailed Introduction to Transparent FR-4 Multilayer PCB


Transparent PCB, transparent flexible FPC Transparent FR-4PCB, double-layer transparent circuit board PCB, multi-layer transparent FR-4 circuit board, ultra large size transparent PCB, ultra large size transparent circuit board PCB

Welcome to inquire

Please leave your information, our professional consultant will contact you within 24 hours