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2L mirror aluminum based PCB

2L mirror aluminum based PCB Product field: New energy vehicles Layers: 2L Plate thickness: 2.0mm Process structure: Mirror aluminum+2L aluminum base+deep head hole Surface treatment: silver deposition

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2L mirror aluminum based PCB

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Thick copper metal based circuit board PCB

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Product Description

PCB

2L mirror aluminum based PCB

Product field: New energy vehicles

Layers: 2L

Plate thickness: 2.0mm

Process structure: Mirror aluminum+2L aluminum base+deep head hole

Surface treatment: silver deposition

Main Product Structure of Chaosheng Group Company
2-80 layers of rigid circuit boards, 2-50 layers of flexible circuit boards and PCBA production
Chaosheng Group Company mainly produces product categories
High end double-sided, multi-layer, flexible, high-frequency, HDI interconnect, metal based, high thermal conductivity metal based, ceramic, cut in metal based, cut in buried capacitor, cut in thick copper buried magnet, concave convex step substrate, 5G high-speed board, thick copper, thick gold, high carbon resistance, double-sided multi-layer MiNiLED, MiNiHDILED, MiNiOLED, IC carrier substrate, roll to roll FPC, long FPC, large-sized printed circuit board, halogen-free material, high-frequency material, high-speed material, metal material, environmentally friendly circuit board, blind buried hole circuit board, high thermal conductivity aluminum based, thermoelectric separation copper based, PDU busbar, iron-based and metal based (core) mixed pressure plate, embedded copper buried copper. Buried resistance buried capacitance buried ceramic bead board, ultra-thin BT board, ceramic substrate, IC carrier board, high-frequency mixed voltage, high-speed board, differential impedance board, thick copper plate, thick gold plated board, HDI An integrated OEM and ODM production factory for Anylayer, double-sided, multi-layer, HDI FPC, soft hard combination HDI, roll to roll FPC, ultra long FPC, ultra large size PCB production and product design and development, software development, special material printed circuit boards, etc.
The main application areas of PCB and PCBA products of Chaosheng Group Company
Communication terminals, communication stations, electronic communication, fiber optics, optical modules, backlight sources, chip systems, communication equipment, communication instruments, computers, intelligent devices, intelligent control, system control, industrial power control, industrial equipment, testing instruments, testing instruments, SD cards, SG cards, mobile phones, computers, various antennas, radars, automobiles, light sources, resistors, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other application fields;
The main application areas of flexible circuit boards (FPC) and FPCA products of Chaosheng Group Company
Hard drives, printers, fax machines, scanners, sensors, mobile phones, connectors, modules, walkie talkie antenna cards, high-end cameras, digital cameras, laser heads, CDs, medical devices, instruments, drives, automobiles, automotive instruments, automotive drive disks, drivers, optical drives, medical devices, medical equipment, backlight sources, modules, banking equipment, industrial instruments, LED light strips, military, aviation, aerospace, national defense and other product fields.

Serial Number

Project

Manufacturing capability

Layers

Floors 1-80

Maximum size of PCB

2500*1150mm

Maximum size of flexible FPC

500mm*100m

Maximum size of PCBA

1600mm*1000mm

FPCBA maximum size

500mm*100m

PCB finished product thickness

0.15-12.0mm

Thickness of flexible FPC finished product

0.05-0.60mm

Finished copper thickness

12um-1075um

Minimum finished aperture of laser hole

0.075mm

Minimum line width and spacing

1.5mi/1.50mil

Minimum finished hole diameter for through-hole

0.15mm

Thickness stacking aspect ratio

1:35

By processing methods

VIA blind buried hole treatment: ink plug hole, resin plug hole, copper paste plug hole, VCP copper filling hole, silver paste plug hole, carbon oil plug hole, etc

Surface Treatment

Sinking gold, electroplating nickel gold, electroplating thick gold, electroplating gold+OSP, electroplating nickel gold+sinking gold, electroplating nickel gold+sinking gold+OSP, electroplating gold+OSP, electroplating gold+gold fingers, OSP+gold fingers, lead-free tin spraying, lead-free tin spraying+sinking gold, lead-free tin spraying+gold fingers, lead tin spraying, OSP, sinking tin, sinking silver, electroplating silver

Main substrate brands

Rogers, Arlon, Taconic, TP-2, Megtron, Neclo, Isola, F4B, 3M, Mitsui Group (Japan Mitsui/Mitsui Top), Taiyo TUC, Taiguang EMC, Tenghui VT, Shengyi SY, Lianmao ITEQ, South Asia NOUYA, DuPont Kappon, Taihong, Hongren Hongren, Xin Yang, Nippon Steel Nippon Stee, Teflon, Yasen, Matsushita, RCC, Mitsui Mitsui Group (Japan Mitsui Top), 3M (USA) 3M Location, Kyocera CERADIR, Jiuhe, Jiuhao, China Porcelain, Huaqing, Ai Shengda, Slitton, Kai Changde, Tongxin, Bergs, Yalong, Taiconieta, etc

Solder mask color

Green, black, red, yellow, white, blue, purple, matte green, matte black, etc

Test service

AOI、X-Ray、 Voltage withstand test, short circuit test, soldering test, thermal shock test, functional test, high temperature and high humidity test, first piece tester, etc

Molding method

CNC shape, punch shape, V-CUT+forming method

Finished product warpage

≤0.5%

Mechanical aperture tolerance

≤0.025mm

Finished product warpage

≤0.5%

MiNiLED Minimum PAD

0.065mm/0.065mm

Thermal conductivity

≧8W

Highest withstand voltage

2500Pa

High carbon resistance value and tolerance

≧100→15000Ω±20%

Impedance tolerance

≤5→8%Ω

IC Carrier Board Series

Minimum line width and spacing of 20um/20um

FAQ

Question Point

Answer

Q: What information is required for PCB

CEGSATE: Gberber files for PCB production, product process instructions, such as material requirements, surface treatment requirements, finished product thickness requirements, PCB stack structure diagram for advanced products, copper thickness requirements for each layer, sample quantity requirements, batch order requirements, product application fields, and other related information are required

Q: What information does PCBA need to provide

CEGSATE: BOM report is required (including the brand, specifications, and model of the components), X and Y coordinate numbers of PCBA components, and processing requirements: Do we need to purchase the components on our behalf? Or customer supplied components? Do you need software burning? What is the required quantity? What is the monthly demand and other detailed information.

Question: Is my file secure?

CEGSATE: Your files are very secure, and we protect intellectual property rights for our clients throughout the entire process. All files provided by the customer will never be shared with any third party.

Q: What is the minimum order quantity?

CESGATE: There is no minimum order quantity in POE. We are able to handle small and large batches flexibly.

Q: Do you have any other services?

CESGATE: We mainly focus on PCB+FPC production+SMT+assembly PCBA+component procurement services; In addition, we can also provide programming, testing, software burning, wiring, and shell assembly services; And product design, product development, software development

Q: What is your inspection method? How do you control the quality?

CESGATE: In order to ensure the quality of PCB and FPC products, flying pin testing is usually used for samples and small batches; The inner circuit undergoes AOI optical inspection, online AOI inspection, and the finished product undergoes 100% inspection through E-SET testing rack. The appearance undergoes 100% inspection through fully automatic finished product inspection equipment and FQC. PCBA undergoes automatic optical inspection (AOI), BGA part X-Ray 100% radiographic inspection, and first article inspection (FAI). PCBA products that require software burning undergo 100% full testing through finished product testing rack according to product functional requirements.

A 2-layer mirror aluminum-based PCB (Printed Circuit Board) is a specialized type of PCB that combines the excellent thermal conductivity of aluminum with a reflective, smooth surface finish, offering superior performance in high-power and heat-sensitive electronic applications. Unlike conventional FR4 boards, aluminum PCBs feature a metal substrate—typically aluminum or an aluminum alloy—bonded with an insulating layer and a copper circuit layer. The mirror finish not only enhances aesthetic appeal but also improves light reflection in LED applications, making them ideal for high-efficiency lighting solutions.

Structure and Design

The typical 2-layer aluminum-based PCB consists of three main layers: a copper circuit layer, a dielectric insulation layer, and an aluminum base layer. The copper layer carries the electrical signals, while the dielectric layer ensures insulation and facilitates heat transfer from the components to the aluminum base. The mirror aluminum surface provides a highly reflective platform, which is especially useful for applications where light management and thermal dissipation are critical.

Compared to standard single-layer aluminum PCBs, the 2-layer configuration allows for more complex circuit designs and enables higher-density component placement. Designers can optimize trace routing and component arrangement without compromising thermal management, making 2L mirror aluminum PCBs suitable for compact and high-performance electronic devices.

Material Advantages

Aluminum substrate offers high thermal conductivity, mechanical strength, and excellent electrical insulation through the dielectric layer. The mirror finish further enhances thermal radiation, allowing components to operate at lower temperatures, extending lifespan, and improving reliability. Additionally, aluminum PCBs are lightweight yet robust, providing a durable solution for industrial, automotive, and consumer electronics.

The 2-layer design allows separation of signal and power lines, reducing electromagnetic interference (EMI) and improving signal integrity. This is particularly valuable in sensitive devices like medical instruments, communication equipment, and precision measurement systems.

Applications

2L mirror aluminum-based PCBs are widely used in LED lighting, power electronics, automotive electronics, and telecommunication equipment. In LED modules, the reflective mirror surface enhances light efficiency by redirecting light emitted from diodes, reducing energy consumption while increasing illumination output. In power electronics, aluminum PCBs provide efficient heat dissipation for components like power transistors, MOSFETs, and voltage regulators.

In automotive electronics, these PCBs are employed in headlights, tail lights, control modules, and electric vehicle battery management systems. Their superior thermal management ensures reliability in high-temperature environments and supports compact design, crucial for modern vehicles.

Manufacturing Process

The production of 2L mirror aluminum-based PCBs involves several critical steps: substrate preparation, copper lamination, circuit patterning, etching, dielectric layer bonding, surface finishing, and testing. High precision is required in each stage to maintain surface smoothness and reflectivity. Advanced technologies such as CNC milling, laser ablation, and surface polishing ensure mirror-like finishes and precise circuit geometries.

Quality control is essential to prevent defects such as warping, delamination, or uneven reflection, which could compromise thermal performance and electrical reliability. Manufacturers often use automated optical inspection (AOI) and thermal imaging to verify integrity before shipment.

Market Trends

The demand for aluminum PCBs, especially 2L mirror types, has been rising due to rapid growth in LED lighting, 5G communication infrastructure, and electric vehicles. The high efficiency, durability, and thermal management capabilities of these PCBs make them a preferred choice for high-power applications. Global suppliers are investing in research and development to enhance substrate materials, dielectric performance, and mirror surface techniques to meet evolving industry standards.

Advantages over Conventional PCBs

Compared to traditional FR4 or standard copper PCBs, 2L mirror aluminum-based PCBs offer:

Superior heat dissipation for high-power components.
Enhanced light reflection for LED applications.
Greater mechanical strength and durability.
Reduced electromagnetic interference and improved signal integrity.
Lightweight yet robust construction, suitable for compact designs.

Conclusion

2L mirror aluminum-based PCBs represent a critical advancement in high-performance electronics. Their combination of thermal efficiency, structural durability, and reflective surface properties makes them essential in applications ranging from LED lighting to automotive and telecommunication electronics. As industries continue to demand higher performance, efficiency, and miniaturization, 2L mirror aluminum PCBs will play an increasingly vital role in next-generation electronic devices.

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Product Name: Aerospace, Military, Nuclear, Unmanned Aerial Vehicle ProductsBoard: FR-4, TG150Layers: 64 layer coil inductor multilayer board PCBMinimum line width/spacing: 8/8milFinished product size: 301x301mm/1 * 1pcsSurface technology: Sinking gold, green oilCopper thickness: 105um for inner and outer layersPlate thickness: 5.5mmMinimum aperture: 3.5mm, laser hole/mm,Features: Difficulties such as dense inner and outer coilsUsage: Engine, electric motor, inductor, orange equipment, etcFirstly, from the perspective of the company's own technological strength, Chaosheng clearly has the ability to produce high multi-layer circuit boards, with its product range covering 2-80 layers of precision multi-layer circuit boards.At the same time, Chaosheng also has imported fully automated precision equipment production lines and a sound quality management system. It has passed multiple quality system certifications such as UL and ISO9001 in the United States, which has laid the foundation for its production of 64 layer and other ultra-high multi-layer circuit boards. Secondly, from the perspective of product characteristics, the product adopts a design that combines blind grooves and depth control grooves, combined with metal edging. The middle part has been treated with immersion gold, which not only improves corrosion resistance but also enhances stability.It is speculated that a 64 layer inductor coil metal wrapped circuit board may also use a similar design to meet the needs of multi-layer and different thickness circuit fabrication.At the same time, metal edging can effectively shield electromagnetic radiation, further enhancing signal integrity and circuit stability. Finally, for the part of the inductor coil, precise control of the inductance value may be achieved through special layout design of the coil and optimized via settings, in order to meet specific electrical performance requirements of the product. A multi-layer coil PCB (Printed Circuit Board) refers to a type of circuit board that consists of multiple layers of conductive material, separated by insulating layers, and is often used for applications requiring compact designs, such as RF (radio frequency) coils, inductors, transformers, and other electromagnetic components.### Key Features of Multi-Layer Coil PCBs:1. **Layer Structure**: - Multi-layer PCBs typically consist of three or more layers. The inner layers can be used for routing power and ground, while the outer layers can be utilized for signal routing and component placement.2. **Coil Design**: - The coils can be designed in various configurations, such as solenoids, toroids, or planar coils, depending on the application. The design may include various winding techniques and geometries to optimize inductance and performance.3. **Material**: - Common materials used for multi-layer PCBs include FR-4 (a type of fiberglass epoxy), Rogers materials (for high-frequency applications), and other specialized materials that can handle specific thermal or electrical requirements.4. **Impedance Control**: - For RF applications, controlling the impedance of the coil is crucial. Multi-layer designs can help maintain consistent impedance across the PCB by using specific layer stack-ups and trace widths.5. **Thermal Management**: - Multi-layer PCBs can help dissipate heat more effectively than single-layer designs. Proper thermal management is essential in coil applications, especially when dealing with high currents.6. **Manufacturing Process**: - The fabrication of multi-layer PCBs involves several steps, including layer alignment, lamination, drilling, plating, and etching. Advanced techniques such as laser drilling and via filling may be employed to create vias and interconnections.7. **Applications**: - Multi-layer coil PCBs are used in various applications, including: - RF and microwave devices - Wireless charging systems - Inductive sensors - Power amplifiers - Communication devices### Design Considerations:1. **Simulation**: - Using simulation software (like HFSS, CST, or other electromagnetic simulation tools) to model the coil's behavior can help in optimizing its design before fabrication.2. **Manufacturing Tolerances**: - Ensure that the PCB manufacturer can meet the necessary tolerances for the coil's dimensions and layer alignment to achieve the desired performance.3. **Testing and Prototyping**: - Prototyping the design and conducting tests (like S-parameter testing) is essential to validate performance and make any necessary adjustments.4. **Cost**: - Multi-layer PCBs can be more expensive than single-layer boards due to the complexity of manufacturing and the materials used. Balancing performance requirements with cost considerations is crucial.5. **Stack-Up Design**: - Carefully planning the stack-up of the PCB layers is important to achieve the desired electrical performance and to minimize issues like crosstalk and electromagnetic interfe

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